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The SN75LVDS84DGGR is IC FLATLINK(TM) XMITTER 48-TSSOP, that includes FlatLink? Series, they are designed to operate with a Driver Type, Packaging is shown on datasheet note for use in a Tape & Reel (TR) Alternate Packaging, that offers Unit Weight features such as 0.007076 oz, Mounting Style is designed to work in SMD/SMT, as well as the FlatLink Tradename, the device can also be used as 48-TFSOP (0.240", 6.10mm Width) Package Case, it has an Operating Temperature range of 0°C ~ 70°C, the device is offered in Surface Mount Mounting Type, the device has a 3 V ~ 3.6 V of Voltage Supply, and Supplier Device Package is 48-TSSOP, and the Protocol is LVDS, and Data Rate is 163 MBps, and the Number of Drivers Receivers is 4/0, it has an Maximum Operating Temperature range of + 70 C, it has an Minimum Operating Temperature range of 0 C, and Interface Type is EIA/TIA-644, and the Supply Voltage Max is 3.6 V, and Supply Voltage Min is 3 V.
The SN75LVDS84DGGRG4 is IC FLATLINK(TM) XMITTER 48-TSSOP, that includes 3 V ~ 3.6 V Voltage Supply, they are designed to operate with a Driver Type, Supplier Device Package is shown on datasheet note for use in a 48-TSSOP, that offers Series features such as FlatLink?, Protocol is designed to work in LVDS, as well as the Tape & Reel (TR) Alternate Packaging Packaging, the device can also be used as 48-TFSOP (0.240", 6.10mm Width) Package Case, it has an Operating Temperature range of 0°C ~ 70°C, the device is offered in 4/0 Number of Drivers Receivers, the device has a Surface Mount of Mounting Type.
SN75LVDS85A with circuit diagram manufactured by TI. The SN75LVDS85A is available in O-NEW SOP Package, is part of the IC Chips.
SN75LVDS85DGG with EDA / CAD Models manufactured by TI. The SN75LVDS85DGG is available in TSSOP Package, is part of the IC Chips.