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243-18-1-03 with pin details, that includes DIP, 0.3" (7.62mm) Row Spacing Type, they are designed to operate with a Tube Packaging, Termination is shown on datasheet note for use in a Solder, it has an Operating Temperature range of -40°C ~ 105°C, Mounting Type is designed to work in Through Hole, as well as the Open Frame Features, the device can also be used as Polybutylene Terephthalate (PBT), Glass Filled Housing Material. In addition, the Number of Positions or Pins Grid is 18 (2 x 9), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Tin of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Tin, and Contact Finish Thickness Mating is 60μin (1.52μm), and the Contact Material Mating is Phosphor Bronze, and Contact Finish Thickness Post is 60μin (1.52μm), and the Contact Material Post is Phosphor Bronze.
The 24319 is HEX STANDOFF M3 BRASS 10MM, that includes Hex Standoff Type, they are designed to operate with a Threaded Threaded Unthreaded, Screw Thread Size is shown on datasheet note for use in a M3, that offers Plating features such as Nickel, Material is designed to work in Brass, as well as the 0.709" (18.00mm) Length Overall, the device can also be used as Male, Female Gender. In addition, the Diameter Outside is 0.217" (5.50mm) Hex, the device is offered in 0.394" (10.00mm) Between Board Height.
2431B1NZAC with circuit diagram manufactured by TI. The 2431B1NZAC is available in BGA Package, is part of the IC Chips.