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Home  Embedded - DSP (Digital Signal Processors)  66AK2H12BAAW2 Datasheets| Texas Instruments | PDF| Price| In Stock

Mar 2 2021

66AK2H12BAAW2 Datasheets| Texas Instruments | PDF| Price| In Stock

Product Overview

Image:
66AK2H12BAAW2
Manufacturer Part#: 66AK2H12BAAW2
Product Category: Embedded - DSP (Digital Signal Processors)
Stock: No
Manufacturer: Texas Instruments
Description:
Datasheet: 66AK2H06,12,14 Datasheet
Package: 1517-BBGA, FCBGA
Minimum: 1
Lead Time: 3(168 Hours)
Quantity: On Order
Send RFQ: Inquiry

66AK2H12BAAW2 Images are for reference only.

66AK2H12BAAW2

CAD Models

Product Attributes

Series: 66AK2Hx KeyStone Multicore
Part Status: Obsolete
Type: DSP+ARM®
Interface: EBI/EMI Ethernet DMA I²C Serial RapidIO SPI UART/USART USB 3.0
Clock Rate: 1.2GHz
Non-Volatile Memory: ROM (384kB)
On-Chip RAM: 12.75MB
Voltage - I/O: 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
Voltage - Core: Variable
Operating Temperature: 0°C ~ 85°C (TC)
Mounting Type: Surface Mount
Package / Case: 1517-BBGA FCBGA
Supplier Device Package: 1517-FCBGA (40x40)
Mfr: Texas Instruments
Package: Tray
Base Product Number: 66AK2

Descriptions

There is no relevant information available for this part yet.

FEATURES

Features:

● Zener Voltage 3.9 to 200V
● Low Zener Impedance
● Highly Reliable and Rugged
● Also Available in Reverse Polarity (NTE5240AK thru NTE5296AK)

Environmental & Export Classifications

Description Value
RoHS Status: ROHS3 Compliant
Moisture Sensitivity Level (MSL): 4 (72 Hours)
REACH Status: REACH Unaffected
ECCN: 5A991B4
HTSUS: 8542.31.0001

Documents & Media

Datasheets: 66AK2H06,12,14 Datasheet
Design Resources: Development Tool Selector
PCN Design/Specification: Package Thickness Update 04/Jun/2015
PCN Assembly/Origin: Wafer Bump Site 21/Mar/2016
PCN Part Status Change: 66AK2Hyy Die Revision 9/Feb/2018
EDA / CAD Models: 66AK2H12BAAW2 by Ultra Librarian
Errata: 66AK2H06/12/14 Errata

Product Manufacturer

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today.

Popularity by Region

  • 1. Swaziland
    100
  • 2. Norway
    98
  • 3. South Korea
    96
  • 4. Falkland Islands (Malvinas)
    96
  • 5. Germany
    95
  • 6. Egypt
    95
  • 7. Saint Pierre and Miquelon
    95
  • 8. Turkey
    94
  • 9. Indonesia
    94
  • 10. Kiribati
    94
  • 11. United States
    93
  • 12. Luxembourg
    92
  • 13. Slovenia
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  • 14. Russia
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  • 15. Austria
    91
  • 16. Japan
    90
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  • 18. Nigeria
    90
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    90
  • 20. Singapore
    89
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  • 22. Canada
    89
  • 23. Taiwan
    89
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  • 25. Philippines
    87
  • 26. Belarus
    86
  • 27. China
    86
  • 28. Malaysia
    86
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    85
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    85
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    84
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    84
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    84
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    84
  • 37. Latvia
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    79
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    79
  • 47. United Kingdom
    78
  • 48. Algeria
    78
  • 49. Vietnam
    76
  • 50. Cambodia
    76
  • 51. Pakistan
    75
  • 52. Australia
    69

66AK2H12BAAW2 Popularity by Region

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  • Product Attributes
  • Descriptions
  • Features
  • CAD Models
Series: 66AK2Hx KeyStone Multicore
Part Status: Obsolete
Type: DSP+ARM®
Interface: EBI/EMI Ethernet DMA I²C Serial RapidIO SPI UART/USART USB 3.0
Clock Rate: 1.2GHz
Non-Volatile Memory: ROM (384kB)
On-Chip RAM: 12.75MB
Voltage - I/O: 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
Voltage - Core: Variable
Operating Temperature: 0°C ~ 85°C (TC)
Mounting Type: Surface Mount
Package / Case: 1517-BBGA FCBGA
Supplier Device Package: 1517-FCBGA (40x40)
Mfr: Texas Instruments
Package: Tray
Base Product Number: 66AK2

There is no relevant information available for this part yet.

FEATURES

Features:

● Zener Voltage 3.9 to 200V
● Low Zener Impedance
● Highly Reliable and Rugged
● Also Available in Reverse Polarity (NTE5240AK thru NTE5296AK)

There is no relevant information available for this part yet.