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BGM113A256V2R with pin details, that includes Blue Gecko Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a Module, that offers Frequency features such as 2.4GHz, it has an Operating Temperature range of -40°C ~ 85°C, as well as the Surface Mount Mounting Type, the device can also be used as -93dBm Sensitivity. In addition, the Voltage Supply is 3.8V, the device is offered in 256kB Flash, 32kB RAM Memory Size, the device has a Bluetooth v4.1 of Protocol, and Data Rate is 1Mbps, and the Serial Interfaces is SPI, UART, and Power Output is 3dBm, and the Current Receiving is 8.7mA, and RF Family Standard is Bluetooth, and the Current Transmitting is 8.8mA, and Antenna Type is Integrated, Chip.
The BGM113A256V2 is BLUETOOTH SMART MODULE FCC/CE, that includes 3.8V Voltage Supply, they are designed to operate with a Blue Gecko Series, Serial Interfaces is shown on datasheet note for use in a SPI, UART, that offers Sensitivity features such as -93dBm, RF Family Standard is designed to work in Bluetooth, as well as the Bluetooth v4.1 Protocol, the device can also be used as 3dBm Power Output. In addition, the Packaging is Digi-ReelR Alternate Packaging, the device is offered in Module Package Case, it has an Operating Temperature range of -40°C ~ 85°C, and Mounting Type is Surface Mount, and the Memory Size is 256kB Flash, 32kB RAM, and Frequency is 2.4GHz, and the Data Rate is 1Mbps, and Current Transmitting is 8.8mA, and the Current Receiving is 8.7mA, and Antenna Type is Integrated, Chip.
BGM121A256V1 with circuit diagram manufactured by Silicon. is part of the IC Chips, , and with support for Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 56-Pin Tray.
BGM121A256V2R with EDA / CAD Models manufactured by SILICON LABS. is part of the IC Chips, MODULE BT SIP MODULE WITH ANTENN, Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 56-Pin T/R.