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Jun 21 2021

MSM-8960-0-756PNSP-TR-08-0 Datasheets | Integrated Circuits (ICs) Integrated Circuits (ICs) BGA-756

Product Overview

Image:
MSM-8960-0-756PNSP-TR-08-0
Manufacturer Part#: MSM-8960-0-756PNSP-TR-08-0
Product Category: Integrated Circuits (ICs)
Stock: No
Manufacturer: Qualcomm technologies, inc
Description: Integrated Circuits (ICs) BGA-756
Datasheet: N/A
Package: BGA-756
Minimum: 1
Lead Time: 3(168 Hours)
Quantity: On Order
Send RFQ: Inquiry

MSM-8960-0-756PNSP-TR-08-0 Images are for reference only.

MSM-8960-0-756PNSP-TR-08-0

CAD Models

Product Attributes

Manufacturer: Qualcomm
Packing: Tape & reel (tr)/cut tape (ct)/tray/tube
Rohs status: Lead free / rohs compliant
Package/case: Bga-756

Descriptions

There is no relevant information available for this part yet.

features

Environmental & Export Classifications

There is no relevant information available for this part yet.

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  • Product Attributes
  • Descriptions
  • Features
  • CAD Models
Manufacturer: QUALCOMM
Packing: Tape & Reel (TR)/Cut Tape (CT)/Tray/Tube
RoHs Status: Lead free / RoHS Compliant
Package/Case: BGA-756

There is no relevant information available for this part yet.

features

There is no relevant information available for this part yet.