FEATURES
Power Chip® Thick Film on Alumina Substrate
Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package configuration which dissipates heat well above board level.
Ohmite’s power chip resis tors have a 125% higher operating temperature range than competitive product of similar design. High temperature solder and in-process plating keep terminations secure under self-heating effects by preventing re-flow from full power operation.
Flexible packaging schemes make these resistors ideal for power supplies, audio amplifiers, video fly-back, and other power control applications.
FeATureS
• High-Temp Terminal Construction
• Wide Resistance Range
• Low Inductance (50nH-100nH)
• High Power Density
• Easy to install. PC-mountable
Ohmite Manufacturing Company has been a leading provider of resistors for high current, high voltage, and high energy applications for over 80 years. Our full complement of products includes wirewound, wire element, thick film, and ceramic composition resistors, in addition to variable voltage controls and heatsinks.