FEATURES
Description
The MA4P7470F-1072T is a surface mountable PIN diode in a Non-Magnetic ( patent pending ) Metal Electrode Leadless Faced (MELF) package. The device incorporates M/A-COM’s proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM’s new nonmagnetic plating process to provide an extremely low permeability, hermetically sealed package. Incorporated in the package is a passivated PIN diode that is full face bonded on both the cathode and anode of the chip to maximize surface area for lower electrical and thermal resistance. The MA4P7470F-1072T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance.
Features
■ Non-Magnetic Package Suitable for MRI Applications
■ Rectangular MELF SMQ Ceramic Package
■ Hermetically Sealed
■ Lower Rs for Lower Series Loss
■ Longer tL for Lower Intermodulation Distortion
■ Lower Cj for Higher Series Isolation
■ Higher Average Incident Power Handling Capability
MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.
MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia.