TS117PTR Datasheets | Telecom ICs Telecom IC Relay Switch 8-Flatpack -Apogeeweb

Telecom ICs

TS117PTR Datasheets | Interface - Telecom Telecom IC Relay Switch 8-Flatpack

TS117PTR Datasheets | Telecom ICs Telecom IC Relay Switch 8-Flatpack

By apogeeweb, TS117PTR, TS117PTR Datasheet,TS117PTR PDF,IXYS Integrated Circuits Division

Product Overview

Image:
Manufacturer Part#:	TS117PTR
Product Category:	Telecom ICs
Stock:	On Order
Manufacturer:	IXYS Integrated Circuits
Description:	Telecom IC Relay Switch 8-Flatpack
Datasheet:	N/A
Package:	8-SMD, Gull Wing
Minimum:	1
Quantity:	On Order

TS117PTR Images are for reference only.

TS117PTR

CAD Models

Product Attributes

Product Attributes	Attrinute Value	Search Similar
Series:	-
Function:	Relay Switch
Interface:	-
Voltage - Supply:	-
Current - Supply:	-
Operating Temperature:	-40°C ~ 85°C
Mounting Type:	Surface Mount
Package / Case:	8-SMD Gull Wing
Supplier Device Package:	8-Flatpack
Number of Circuits:	2
Power (Watts):	800 mW
Mfr:	IXYS Integrated Circuits Division
Package:	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Base Product Number:	TS117
Product Status:	Active
Package / Case:	100-BQFP 100-LBGA 100-LFBGA CSPBGA 100-LQFP 100-LQFP Exposed Pad 100-TQFP Exposed Pad 10-TFSOP 10-MSOP (0．118" 3．00mm Width) 1152-BBGA FCBGA 120-BGA 120-LQFP 121-LFBGA 128-BFQFP 128-BQFP 128-LQFP 128-LQFP Exposed Pad 128-TQFP 144-BBGA 144-BGA 144-BGA CSPBGA 144-BQFP 144-LBGA 144-LBGA FCBGA 144-LQFP 144-LQFP Exposed Pad 14-DIP (0．300" 7．62mm) 14-SOIC (0．154" 3．90mm Width) 160-BGA 160-BQFP 160-BQFP Exposed Pad 160-LBGA 160-LQFP 164-QFN 16-DIP (0．300" 7．62mm) 16-QFN 16-SOIC (0．154" 3．90mm Width) 16-SOIC (0．154" 3．90mm Width) Exposed Pad 16-SOIC (0．295" 7．50mm Width) 16-TFQFN Exposed Pad 16-TSSOP (0．173" 4．40mm Width) 16-VDFN Exposed Pad 16-VFQFN Exposed Pad 16-VQFN Exposed Pad 176-LBGA 176-LQFP 18-DIP (0．300" 7．62mm) 18-DIP Module (0．850" 21．59mm) 11 Leads 18-DIP Module (0．850" 21．59mm) 9 Leads 18-SOIC (0．213" 5．40mm Width) 18-SOIC (0．295" 7．50mm Width) 195-BFBGA FCBGA 196-BBGA 196-BGA 196-LBGA 196-LBGA FCBGA 200-LFBGA 208-BFQFP 208-BGA 208-LBGA 20-DIP (0．300" 7．62mm) 20-LCC (J-Lead) 20-SOIC (0．209" 5．30mm Width) 20-SOIC (0．295" 7．50mm Width) 20-SOIC (0．433" 11．00mm Width) Exposed Pad 20-SSOP (0．209" 5．30mm Width) 20-TSSOP (0．173" 4．40mm Width) 20-VFQFN Exposed Pad 217-BBGA 217-BGA 220-BGA 220-LBGA 225-BGA 225-LFBGA 22-DIP (0．400" 10．16mm) 22-DIP (0．415" 10．50mm) 244-BBGA FCBGA 24-DIP (0．300" 7．62mm) 24-DIP (0．600" 15．24mm) 24-QFN 24-SOIC (0．295" 7．50mm Width) 24-SSOP (0．209" 5．30mm Width) 24-VFQFN Exposed Pad 24-VQFN Exposed Pad 24-WFQFN Exposed Pad 252-BGA 256-BBGA 256-BBGA FCBGA 256-BGA 256-BGA Exposed Pad 256-BQFP 256-LBGA 256-LBGA CSBGA 256-LQFP 272-BBGA 272-BGA 284-TQFP 284-TQFP Exposed Pad 289-LFBGA 28-BSOJ (0．300" 7．62mm Width) 28-DIP (0．600" 15．24mm) 28-LCC 28-LCC (J-Lead) 28-QFN 28-SOIC (0．295" 7．50mm Width) 28-TSSOP (0．173" 4．40mm Width) 28-VDFN Exposed Pad 28-VFQFN Exposed Pad 300-BBGA 300-BGA 302-TQFP 304-BBGA 304-LBGA 30-Stik Module 316-LBGA 323-BBGA FCBGA 324-BBGA FCBGA 324-BGA 324-FBGA 324-LBGA 32-LCC (J-Lead) 32-LQFP 32-QFN 32-SOIC (0．295" 7．50mm Width) 32-TFQFN Exposed Pad 32-TQFP 32-VFQFN Exposed Pad 32-VQFN Exposed Pad 344-BBGA 365-BBGA 36-BSOP (0．295" 7．50mm Width) 36-BSSOP (0．295" 7．50mm Width) 36-BSSOP (0．433" 11．00mm Width) Exposed Pad 36-FBGA 36-QFN 388-BBGA 38-TFSOP (0．173" 4．40mm Width) 38-VFQFN Exposed Pad 40-DIP (0．600" 15．24mm) 40-DIP (0．620" 15．75mm) 40-VFQFN Exposed Pad 416-BGA 420-BBGA 420-LBGA 42-VFQFN Exposed Pad 42-WFQFN Exposed Pad 444-BGA Exposed Pad 44-BSOP (0．295" 7．50mm Width) 44-LCC (J-Lead) 44-LQFP 44-QFN 44-QFP 44-TQFP 44-TQFP Exposed Pad 480-LBGA Exposed Pad 484-BBGA 484-BGA 484-LFBGA 48-BSSOP (0．295" 7．50mm Width) 48-LQFP 48-QFN 48-SSOP (0．295" 7．50mm Width) 48-TQFP 48-VFQFN Exposed Pad 48-VQFN Exposed Pad 52-LCC (J-Lead) 52-LQFP 535-BGA 552-BGA 56-VFQFN Exposed Pad 60-WFQFN Exposed Pad 625-BFBGA FCBGA 640-BGA Exposed Pad 64-BQFP 64-FQFP 64-LQFP 64-QFN 64-QFP 64-TQFP 64-VFQFN Exposed Pad 672-BBGA FCBGA 672-BGA 672-BGA FCBGA 672-LBGA 676-BGA 68-LCC (J-Lead) 68-VFQFN Exposed Pad 80-LQFP 80-QFP 80-TFQFN Exposed Pad 81-LBGA 81-LFBGA 84-LCC (J-Lead) 896-BGA 896-BGA FCBGA 8-DIP (0．300" 7．62mm) 8-DIP (0．300"" 7．62mm) 8-ESOP (0．250" 6．35mm Width) 8-SMD Gull Wing 8-SOIC (0．154" 3．90mm Width) 8-SOIC (0．154" 3．90mm Width) Exposed Pad 8-SOIC (0．154"" 3．90mm Width) 8-SOIC (0．209" 5．30mm Width)
Voltage - Supply:	±4V ~ 6．6V 8V ~ 13．2V 0．95V ~ 1．05V 1．14V ~ 1．26V 2．38V ~ 2．62V 3．135V ~ 3．465V 1．14V ~ 1．26V 1．7V ~ 1．9V 2．37V ~ 2．63V 3．13V ~ 3．47V 1．14V ~ 1．26V 2．25V ~ 2．75V 3V ~ 3．6V 1．2V 1．2V 3．3V 1．2V ~ 3．3V 1．5V 1．8V 2．5V 3．3V 1．5V 3．3V 1．65V ~ 1．95V 1．6V ~ 2V 1．71V ~ 1．89V 1．71V ~ 1．89V 3．13V ~ 3．47V 1．8V 1．8V 3．3V 10V ~ 12．5V 10V ~ 14．7V 10V ~ 24V ±5V ~ 12V 10V ~ 28V 12．5V 12．6V ~ 15．4V 12V 15V ~ 110V 1V 1V 1．2V 1V 2．5V 2．5V 2．5V 3．3V 2．7V ~ 3．3V 2．7V ~ 3．6V 2．7V ~ 4．5V 2．7V ~ 5．5V 2．8V ~ 5．5V 2．97V ~ 3．63V 26V 2V ~ 9V 3．135 ~ 5．25V 3．135V ~ 3．465V 3．135V ~ 5．25V 3．13V ~ 3．45V 3．13V ~ 3．46V 3．13V ~ 3．47V 3．13V ~ 5．25V 3．14V ~ 3．47V 3．14V ~ 3．47V 4．75V ~ 5．25V 3．15V ~ 3．45V 3．1V ~ 3．5V 3．1V ~ 3．6V 3．3V 3．3V 5V 3．3V ~ 35V 3．3V ~ 5V 3．4V 3．5V ~ 6．5V 3．8V ~ 5V 3V 5V 3V ~ 3．6V 3V ~ 5．5V 3V ~ 5V 3V ~ 6V 4．5V ~ 13．2V 4．5V ~ 20V 4．5V ~ 5．5V 4．75V ~ 35V 4．75V ~ 5．25V 4．75V ~ 9V 4．8V ~ 5．25V 5．4V -5．5V ~ -4．9V 5V 6V ~ 12V 7V 8V ~ 18V 970mV 1．2V
Show Similar

Descriptions

TS117 Series SPST 120 mA 350 V Dual Channel Solid State Relay SMT - FLATPACK-8:Future Electronics
Solid State Relay 50mA 1.4V DC-IN 0.12A 350V AC/DC-OUT 8-Pin FPAK T/R:Arrow.cn
RELAY 120MA OPTO TELCOM 8FLTPAK:Digi-Key
Multifunction Telecom Switch 8-Pin FPAK T/R:Verical

Features
Product Manufacturer

FEATURES

Description

TS112 is a 350V, 120mA, 20Ω 1-Form-A relay with an optocouper in a single package for telecom applications.
It features lower on-resistance and high sensitivity.

Features

• Small 8 Pin SOIC Narrow Package
• Low Drive Power Requirements (TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• 1500VRMS Input/Output Isolation
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Tape & Reel Version Available

Applications

• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hookswitch
• Dial Pulsing
• Ground Start
• Ringer Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls

IXYS Integrated Circuits Division/Littelfuse, formerly Clare, Inc., an IXYS/Littelfuse Company, designs, manufactures, and markets high-voltage integrated circuits (ICs) and optically isolated Solid State Relays (OptoMOS®) for the communication, industrial, power, and consumer markets. As a pioneer in the development of Solid State Relays (SSRs), they have become a leading supplier to the telecommunications, security, utility metering, and industrial control industries. IXYS Integrated Circuits Division/Littelfuse SSR solutions are rapidly replacing older electromechanical devices in many applications and enhancing overall system performance. They continue to develop leadership products that offer higher levels of integration and electrical performance. With the acquisition of IXYS, Littelfuse significantly expands their portfolio, with solutions spanning a full range of technologies. This diverse portfolio will provide customers with the best technology and enhanced, differentiated capabilities in target markets and geographies as well as deliver greater industry access and increased growth opportunities.

ECCN/UNSPSC

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