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The HD6417760BP200AD is IC MCU 32BIT 256LFBGA, that includes SuperHR SH7750 Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 256-LFBGA, it has an Operating Temperature range of -40°C ~ 85°C (TA), Supplier Device Package is designed to work in 256-LFBGA (17x17), as well as the 69 Number of I O, the device can also be used as 200MHz Speed. In addition, the Core Processor is SH-4, the device is offered in 48K x 8 RAM Size, the device has a ROMless of Program Memory Type, and Peripherals is DMA, LCD, POR, WDT, and the Connectivity is Audio Codec, CAN, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB, and Voltage Supply Vcc Vdd is 1.4 V ~ 1.6 V, and the Core Size is 32-Bit, and Data Converters is A/D 4x10b, and the Oscillator Type is Internal.
The HD6417760BP200DQ is IC MCU 32BIT 256LFBGA, that includes 1.4 V ~ 1.6 V Voltage Supply Vcc Vdd, they are designed to operate with a 256-LFBGA (17x17) Supplier Device Package, Speed is shown on datasheet note for use in a 200MHz, that offers Series features such as SuperHR SH7750, RAM Size is designed to work in 48K x 8, as well as the ROMless Program Memory Type, the device can also be used as DMA, LCD, POR, WDT Peripherals. In addition, the Packaging is Tray, the device is offered in 256-LFBGA Package Case, the device has a Internal of Oscillator Type, it has an Operating Temperature range of -40°C ~ 85°C (TA), and the Number of I O is 69, and Data Converters is A/D 4x10b, and the Core Size is 32-Bit, and Core Processor is , and the Connectivity is Audio Codec, CAN, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB.
HD6417760BP200ADV with circuit diagram manufactured by RENESAS. The HD6417760BP200ADV is available in BGA Package, is part of the IC Chips.
HD6417760BP200QSTR with EDA / CAD Models manufactured by HIT. The HD6417760BP200QSTR is available in BGA Package, is part of the IC Chips.