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Home  Microcontrollers  MPC556LFMZP40 Datasheets | Microcontrollers IC,MICROCONTROLLER,32-BIT,CMOS,BGA,272PIN,PLASTIC

Jun 21 2021

MPC556LFMZP40 Datasheets | Microcontrollers IC,MICROCONTROLLER,32-BIT,CMOS,BGA,272PIN,PLASTIC

Product Overview

Image:
MPC556LFMZP40
Manufacturer Part#: MPC556LFMZP40
Product Category: Microcontrollers
Stock: No
Manufacturer: Freescale semiconductor
Description: IC,MICROCONTROLLER,32-BIT,CMOS,BGA,272PIN,PLASTIC
Datasheet: N/A
Package: BGA
Minimum: 1
Lead Time: 3(168 Hours)
Quantity: On Order
Send RFQ: Inquiry

MPC556LFMZP40 Images are for reference only.

MPC556LFMZP40

CAD Models

Product Attributes

Manufacturer part number: Mpc556lfmzp40
Part life cycle code: Obsolete
Ihs manufacturer: Freescale semiconductor inc
Reach compliance code: Unknown
Manufacturer: Freescale semiconductor
Risk rank: 5.83
Bit size: 32
Jesd-30 code: S-pbga-b272
OperaN/Ang temperature-max: 125 °c
OperaN/Ang temperature-min: -40 °c
Package body material: PlasN/Ac/epoxy
Package shape: Square
Package style: Grid array
Rom programmability: Flash
Speed: 40 mhz
Technology: Cmos
Temperature grade: AutomoN/Ave
Terminal form: Ball
Terminal pitch: 1.27 mm
Terminal posiN/Aon: Bottom
Rohs code: No
Number of terminals: 272
Package code: Bga
Package equivalence code: Bga272,20x20,50
Power supplies: 3.3,5 v
QualificaN/Aon status: Not qualified
Ram (bytes): 26624
Rom (words): 458752
Subcategory: Microcontrollers
Surface mount: Yes
Supply current-max: 22 ma

Descriptions

There is no relevant information available for this part yet.

features

Environmental & Export Classifications

There is no relevant information available for this part yet.

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MPC556LFMZP40
Ic,microcontroller,32-bit,cmos,bga,272pin,plasN/Ac
  • Product Attributes
  • Descriptions
  • Features
  • CAD Models
Manufacturer Part Number: MPC556LFMZP40
Part Life Cycle Code: Obsolete
Ihs Manufacturer: FREESCALE SEMICONDUCTOR INC
Reach Compliance Code: unknown
Manufacturer: Freescale Semiconductor
Risk Rank: 5.83
Bit Size: 32
JESD-30 Code: S-PBGA-B272
Operating Temperature-Max: 125 °C
Operating Temperature-Min: -40 °C
Package Body Material: PLASTIC/EPOXY
Package Shape: SQUARE
Package Style: GRID ARRAY
ROM Programmability: FLASH
Speed: 40 MHz
Technology: CMOS
Temperature Grade: AUTOMOTIVE
Terminal Form: BALL
Terminal Pitch: 1.27 mm
Terminal Position: BOTTOM
Rohs Code: No
Number of Terminals: 272
Package Code: BGA
Package Equivalence Code: BGA272,20X20,50
Power Supplies: 3.3,5 V
Qualification Status: Not Qualified
RAM (bytes): 26624
ROM (words): 458752
Subcategory: Microcontrollers
Surface Mount: YES
Supply Current-Max: 22 mA

There is no relevant information available for this part yet.

features

There is no relevant information available for this part yet.