FEATURES
Features
•Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
•Low profile surface mounted application in order to optimize board space.
•Low power loss, high efficiency.
•High current capability, low forward voltage drop.
•High surge capability.
•Guardring for overvoltage protection.
•Ultra high-speed switching.
•Silicon epitaxial planar chip, metal silicon junction.
•Lead-free parts meet environmental standards of MIL-STD-19500 /228
• Suffix "-H" indicates Halogen-free parts, ex. FM120-H.
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic,DO-214AC / SMA-F
• Terminals : Solder plated, solderable per MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.05 gram
Cypress targets innovative markets growing faster than the overall semiconductor industry, including key segments of the automotive, industrial, home automation and appliances, medical products and consumer electronics businesses. With the help of Digi-Key Electronics, we supply customers with market-leading solutions based on our MCUs, wireless SoCs, memories, analog ICs and USB controllers. Our world-class wireless technology gives us an unparalleled position in the fast-growing Internet of Things, a business that cuts across our conventional markets and gives us a stake in exciting, next-generation segments such as connected and autonomous cars.