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HMC15DTES with pin details, that includes Blue Color, they are designed to operate with a Tube Packaging, Termination is shown on datasheet note for use in a Solder Eyelet(s), it has an Operating Temperature range of -65°C ~ 125°C, Mounting Type is designed to work in Panel Mount, as well as the Beryllium Copper Contact Material, the device can also be used as Gold Contact Finish. In addition, the Contact Finish Thickness is 30μin (0.76μm), the device is offered in 30 Number of Positions, the device has a 0.100" (2.54mm) of Pitch, and Number of Rows is 2, and the Gender is Female, and Contact Type is Full Bellows, and the Card Thickness is 0.062" (1.57mm), and Flange Feature is Side Mount Opening, Unthreaded, 0.125" (3.18mm) Dia, and the Card Type is Non Specified - Dual Edge, and Number of Positions Bay Row is 15.
HMC15DTEN with user guide, that includes Solder Eyelet(s) Termination, they are designed to operate with a 0.100" (2.54mm) Pitch, Packaging is shown on datasheet note for use in a Tube, it has an Operating Temperature range of -65°C ~ 125°C, Number of Rows is designed to work in 2, as well as the 15 Number of Positions Bay Row, the device can also be used as 30 Number of Positions. In addition, the Mounting Type is Free Hanging (In-Line), the device is offered in Female Gender, the device has a Full Bellows of Contact Type, and Contact Material is Beryllium Copper, and the Contact Finish Thickness is 30μin (0.76μm), and Contact Finish is Gold, and the Color is Blue, and Card Type is Non Specified - Dual Edge, and the Card Thickness is 0.062" (1.57mm).
HMC165S14 with circuit diagram manufactured by HITTITE. The HMC165S14 is available in SOP14 Package, is part of the IC Chips.