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The AXD200201 is CONN BRD TO BRD .1MM 100 POS DIP, that includes AXD Series, they are designed to operate with a Tape & Box (TB) Packaging, Termination is shown on datasheet note for use in a Solder, that offers Mounting Type features such as Through Hole, Right Angle, Style is designed to work in B, as well as the Header, Male Pins Connector Type, the device can also be used as Gold Contact Finish. In addition, the Number of Positions is 100, the device is offered in All Number of Positions Loaded, the device has a 0.100" (2.54mm) of Pitch, and Number of Rows is 2, and the Level Class is .
The AXD100811 is CONN BRD TO BRD .1MM 100 POS DIP, that includes Solder Termination, they are designed to operate with a Q Style, Series is shown on datasheet note for use in a AXD, that offers Pitch features such as 0.100" (2.54mm), Packaging is designed to work in Bulk, as well as the 2 Number of Rows, the device can also be used as All Number of Positions Loaded. In addition, the Number of Positions is 100, the device is offered in Through Hole, Right Angle Mounting Type, the device has a of Level Class, and Contact Finish is Gold, and the Connector Type is Receptacle, Female Sockets.
The AXD232211 is CONN BRD TO BRD .1MM 32 POS DIP, that includes Header, Male Pins Connector Type, they are designed to operate with a Gold Contact Finish, Level Class is shown on datasheet note for use in a , that offers Mounting Type features such as Through Hole, Right Angle, Number of Positions is designed to work in 32, as well as the All Number of Positions Loaded, the device can also be used as 2 Number of Rows. In addition, the Packaging is Bulk, the device is offered in 0.100" (2.54mm) Pitch, the device has a AXD of Series, and Style is B, and the Termination is Solder.
AXD2000DUT3C with EDA / CAD Models manufactured by AMD. The AXD2000DUT3C is available in SMD Package, is part of the IC Chips.