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W971GG8KB-25 Datasheets | Memory IC DRAM 1G PARALLEL 60WBGA

By apogeeweb, W971GG8KB-25, W971GG8KB-25 Datasheet,W971GG8KB-25 PDF,Winbond Electronics

Product Overview

Image:
W971GG8KB-25
Manufacturer Part#: W971GG8KB-25
Product Category: Memory
Stock: On Order
Manufacturer: Winbond
Description: IC DRAM 1G PARALLEL 60WBGA
Datasheet: W971GG8KB
Package: 60-TFBGA
Minimum: 1
Quantity: On Order

CAD Models

Product Attributes

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Manufacturer: Winbond Electronics
Series: -
Packaging: Tray
Part Status: Obsolete
Memory Type: Volatile
Memory Format: DRAM
Technology: SDRAM - DDR2
Memory Size: 1Gb (128M x 8)
Memory Interface: Parallel
Write Cycle Time - Word Page: 15ns
Access Time: 400ps
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: 0°C ~ 85°C (TC)
Mounting Type: Surface Mount
Package / Case: 60-TFBGA
Supplier Device Package: 60-WBGA (8x12.5)
Clock Frequency: 200MHz
Show Similar

Descriptions

DDR II; DDR II 1G -800 WBGA 8*12mm2:WPG Americas
DRAM Chip DDR2 SDRAM 1Gbit 128Mx8 1.8V:Verical
IC SDRAM 1GBIT 400MHZ 60BGA:Digi-Key

  • Features
  • Product Manufacturer

FEATURES

GENERAL DESCRIPTION

The W971GG8KB is a 1G bits DDR2 SDRAM, organized as 16,777,216 words  8 banks  8 bits. This device achieves high speed transfer rates up to 1066Mb/sec/pin (DDR2-1066) for various applications. W971GG8KB is sorted into the following grade parts: -18, -25, 25I and -3. The -18 grade parts is compliant to the DDR2-1066 (7-7-7) specification. The -25 and 25I grade parts are compliant to the DDR2-800 (5-5-5) or DDR2-800 (6-6-6) specification (the 25I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C). The -3 grade parts is compliant to the DDR2-667 (5-5-5) specification.

FEATURES

• Power Supply: VDD, VDDQ = 1.8 V ± 0.1 V
• Double Data Rate architecture: two data transfers per clock cycle
• CAS Latency: 3, 4, 5, 6 and 7
• Burst Length: 4 and 8
• Bi-directional, differential data strobes (DQS and DQS ) are transmitted / received with data
• Edge-aligned with Read data and center-aligned with Write data
• DLL aligns DQ and DQS transitions with clock
• Differential clock inputs (CLK and CLK )
• Data masks (DM) for write data
• Commands entered on each positive CLK edge, data and data mask are referenced to both edges of DQS
• Posted CAS programmable additive latency supported to make command and data bus efficiency
• Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
• Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal quality
• Auto-precharge operation for read and write bursts
• Auto Refresh and Self Refresh modes
• Precharged Power Down and Active Power Down
• Write Data Mask
• Write Latency = Read Latency - 1 (WL = RL - 1)
• Interface: SSTL_18
• Packaged in WBGA 60 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant

Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM. Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

  • Environmental & Export Classifications
  • Documents & Media
Description Value
Description Value
RoHS Status: ROHS3 Compliant
Moisture Sensitivity Level (MSL): 3 (168 Hours)
Documents Media
Datasheets: W971GG8KB
PCN Packaging: Dessicant Supplier Chg 3/May/2016
PCN Obsolescence/ EOL: W971GG6KB 23/Nov/206
PCN Assembly/Origin: Mult Dev Test Site Add 11/Oct/2017
EDA / CAD Models: Download from Ultra Librarian

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  • Returning/warranty

    Returning

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