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W631GG6KB-15 Datasheets | DRAMs DDR DRAM, 64MX16, 0.255ns, CMOS, PBGA96, WBGA-96

By apogeeweb, W631GG6KB-15, W631GG6KB-15 Datasheet,W631GG6KB-15 PDF,Winbond Electronics Corp

Product Overview

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W631GG6KB-15
Manufacturer Part#: W631GG6KB-15
Product Category: DRAMs
Stock: On Order
Manufacturer: Winbond
Description: DDR DRAM, 64MX16, 0.255ns, CMOS, PBGA96, WBGA-96
Datasheet: N/A
Package: TFBGA, BGA96,9X16,32
Minimum: 1
Quantity: On Order

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Product Attributes

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Manufacturer Part Number: W631GG6KB-15
Rohs Code: Yes
Part Life Cycle Code: Obsolete
Ihs Manufacturer: WINBOND ELECTRONICS CORP
Package Description: TFBGA, BGA96,9X16,32
Reach Compliance Code: compliant
Manufacturer: Winbond Electronics Corp
Risk Rank: 7.81
Access Mode: MULTI BANK PAGE BURST
Access Time-Max: 0.255 ns
Additional Feature: AUTO/SELF REFRESH
I/O Type: COMMON
JESD-30 Code: R-PBGA-B96
Length: 13 mm
Memory Density: 1073741824 bit
Memory IC Type: DDR DRAM
Memory Width: 16
Number of Functions: 1
Number of Words: 67108864 words
Number of Words Code: 64000000
Operating Mode: SYNCHRONOUS
Operating Temperature-Max: 85 °C
Organization: 64MX16
Output Characteristics: 3-STATE
Package Body Material: PLASTIC/EPOXY
Package Code: TFBGA
Package Equivalence Code: BGA96,9X16,32
Package Shape: RECTANGULAR
Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH
Power Supplies: 1.5 V
Qualification Status: Not Qualified
Refresh Cycles: 8192
Seated Height-Max: 1.2 mm
Self Refresh: YES
Standby Current-Max: 0.014 A
Subcategory: DRAMs
Supply Current-Max: 0.38 mA
Supply Voltage-Max (Vsup): 1.575 V
Supply Voltage-Min (Vsup): 1.425 V
Technology: CMOS
Temperature Grade: OTHER
Terminal Form: BALL
Terminal Pitch: 0.8 mm
Terminal Position: BOTTOM
Width: 9 mm
Clock Frequency-Max (fCLK): 667 MHz
Interleaved Burst Length: 8
ECCN Code: EAR99
HTS Code: 8542.32.00.32
Part Package Code: BGA
Pin Count: 96
Peak Reflow Temperature (Cel): NOT SPECIFIED
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Alternative Models

Part Compare Manufacturers Category Description
Mfr.Part#:W631GG6KB-15 Compare: Current Part Manufacturers:Winbond electronics Category:Memory Chip Description: Ddr dram, 64mx16, 0.255ns, cmos, pbga96, 9 x 13mm, 0.8mm pitch, rohs compliant, wbga-96
Mfr.Part#:W631GG6KB-12 Compare: W631GG6KB-15 VS W631GG6KB-12 Manufacturers:Winbond electronics Category:RAM Memory Description: Ddr dram, 64mx16, 0.225ns, cmos, pbga96, 9 x 13mm, 0.8mm pitch, rohs compliant, wbga-96
  • Features
  • Product Manufacturer

GENERAL DESCRIPTION

The W631GG6KB is a 1G bits DDR3 SDRAM, organized as 8,388,608 words x 8 banks x 16 bits. This device achieves high speed transfer rates up to 1866 Mb/sec/pin (DDR3-1866) for various applications. W631GG6KB is sorted into the following speed grades: -11, -12, 12I, 12A, 12K -15, 15I, 15A and 15K. The -11 speed grade is compliant to the DDR3-1866 (13-13-13) specification. The -12, 12I, 12A and 12K speed grades are compliant to the DDR3-1600 (11-11-11) specification (the 12I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C). The -15, 15I, 15A and 15K speed grades are compliant to the DDR3-1333 (9-9-9) specification (the 15I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C).

FEATURES

 Power Supply: VDD, VDDQ = 1.5V ± 0.075V
 Double Data Rate architecture: two data transfers per clock cycle
 Eight internal banks for concurrent operation
 8 bit prefetch architecture
 CAS Latency: 6, 7, 8, 9, 10, 11 and 13
 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable On The-Fly (OTF)
 Programmable read burst ordering: interleaved or nibble sequential
 Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received with data
 Edge-aligned with read data and center-aligned with write data
 DLL aligns DQ and DQS transitions with clock
 Differential clock inputs (CK and CK#)
 Commands entered on each positive CK edge, data and data mask are referenced to both edges of a differential data strobe pair (double data rate)
 Posted CAS with programmable additive latency (AL = 0, CL - 1 and CL - 2) for improved command, address and data bus efficiency
 Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
 Auto-precharge operation for read and write bursts
 Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR)
 Precharged Power Down and Active Power Down

Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM. Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

  • Environmental & Export Classifications
Description Value
Description Value
RoHS Status: ROHS3 Compliant
Moisture Sensitivity Level (MSL): 3 (168 Hours)
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