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Home  DRAMs  K4X1G163PC-FGC3 Datasheets| Samsung Semiconductor | PDF| Price| In Stock

Jun 21 2021

K4X1G163PC-FGC3 Datasheets | DRAMs DDR DRAM, 1GX16, CMOS, PBGA60, 11 X 11.50 MM, ROHS COMPLIANT, FBGA-60

Product Overview

Image:
K4X1G163PC-FGC3
Manufacturer Part#: K4X1G163PC-FGC3
Product Category: DRAMs
Stock: No
Manufacturer: Samsung semiconductor
Description: DDR DRAM, 1GX16, CMOS, PBGA60, 11 X 11.50 MM, ROHS COMPLIANT, FBGA-60
Datasheet: N/A
Package: BGA,
Minimum: 1
Lead Time: 3(168 Hours)
Quantity: On Order
Send RFQ: Buy

CAD Models

Product Attributes

Manufacturer part number: K4x1g163pc-fgc3
Rohs code: Yes
Part life cycle code: Obsolete
Ihs manufacturer: Samsung semiconductor inc
Package descripN/Aon: Bga,
Reach compliance code: Compliant
Manufacturer: Samsung semiconductor
Risk rank: 5.82
Access mode: Four bank page burst
Jesd-30 code: R-pbga-b60
Memory density: 17179869184 bit
Memory ic type: Ddr dram
Memory width: 16
Number of funcN/Aons: 1
Number of words: 1073741824 words
Number of words code: 1000000000
OperaN/Ang mode: Asynchronous
OrganizaN/Aon: 1gx16
Package body material: PlasN/Ac/epoxy
Package shape: Rectangular
Package style: Grid array
QualificaN/Aon status: Not qualified
Technology: Cmos
Terminal form: Ball
Terminal posiN/Aon: Bottom
Surface mount: Yes
Eccn code: Ear99
Hts code: 8542.32.00.36
Part package code: Bga
Pin count: 60
Peak reflow temperature (cel): 260
N/Ame@peak reflow temperature-max (s): Not specified
Supply voltage-nom (vsup): 1.8 v
Moisture sensiN/Avity level: 3

Descriptions

There is no relevant information available for this part yet.

features

Environmental & Export Classifications

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Product Manufacturer

Samsung semiconductor's business aims to achieve excellence as a long life, energy saving and eco-friendly light source supplier in displays and lighN/Ang applicaN/Aons. samsung's advanced semiconductor manufacturing experN/Ase serves as a strong foundaN/Aon to deliver state-of-the-art led devices. samsung offers led based lighN/Ang soluN/Aons in the form of back light units in display panels, exterior and dashboard lighN/Ang in automoN/Aves, lighN/Ang packages and engines with and without integrated opN/Acs, and drivers.

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K4X1G163PC-FGC3
Ddr dram, 1gx16, cmos, pbga60, 11 x 11.50 mm, rohs compliant, fbga-60
  • Product Attributes
  • Descriptions
  • Features
  • CAD Models
Manufacturer Part Number: K4X1G163PC-FGC3
Rohs Code: Yes
Part Life Cycle Code: Obsolete
Ihs Manufacturer: SAMSUNG SEMICONDUCTOR INC
Package Description: BGA,
Reach Compliance Code: compliant
Manufacturer: Samsung Semiconductor
Risk Rank: 5.82
Access Mode: FOUR BANK PAGE BURST
JESD-30 Code: R-PBGA-B60
Memory Density: 17179869184 bit
Memory IC Type: DDR DRAM
Memory Width: 16
Number of Functions: 1
Number of Words: 1073741824 words
Number of Words Code: 1000000000
Operating Mode: ASYNCHRONOUS
Organization: 1GX16
Package Body Material: PLASTIC/EPOXY
Package Shape: RECTANGULAR
Package Style: GRID ARRAY
Qualification Status: Not Qualified
Technology: CMOS
Terminal Form: BALL
Terminal Position: BOTTOM
Surface Mount: YES
ECCN Code: EAR99
HTS Code: 8542.32.00.36
Part Package Code: BGA
Pin Count: 60
Peak Reflow Temperature (Cel): 260
Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
Supply Voltage-Nom (Vsup): 1.8 V
Moisture Sensitivity Level: 3

There is no relevant information available for this part yet.

features

There is no relevant information available for this part yet.