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K4D263238G-GC33 Datasheets | DRAMs DDR DRAM, 4MX32, 0.55ns, CMOS, PBGA144

By apogeeweb, K4D263238G-GC33, K4D263238G-GC33 Datasheet,K4D263238G-GC33 PDF,Samsung Semiconductor

Product Overview

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K4D263238G-GC33
Manufacturer Part#: K4D263238G-GC33
Product Category: DRAMs
Stock: On Order
Manufacturer: Samsung
Description: DDR DRAM, 4MX32, 0.55ns, CMOS, PBGA144
Datasheet: N/A
Package: FBGA, BGA144,12X12,32
Minimum: 1
Quantity: On Order

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Product Attributes

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Manufacturer Part Number: K4D263238G-GC33
Rohs Code: No
Part Life Cycle Code: Obsolete
Ihs Manufacturer: SAMSUNG SEMICONDUCTOR INC
Package Description: FBGA, BGA144,12X12,32
Reach Compliance Code: unknown
Manufacturer: Samsung Semiconductor
Risk Rank: 5.84
Access Time-Max: 0.55 ns
I/O Type: COMMON
JESD-30 Code: S-PBGA-B144
JESD-609 Code: e0
Memory Density: 134217728 bit
Memory IC Type: DDR DRAM
Memory Width: 32
Number of Terminals: 144
Number of Words: 4194304 words
Number of Words Code: 4000000
Operating Temperature-Max: 65 °C
Organization: 4MX32
Output Characteristics: 3-STATE
Package Body Material: PLASTIC/EPOXY
Package Code: FBGA
Package Equivalence Code: BGA144,12X12,32
Package Shape: SQUARE
Package Style: GRID ARRAY, FINE PITCH
Power Supplies: 2.5 V
Qualification Status: Not Qualified
Refresh Cycles: 4096
Standby Current-Max: 0.015 A
Subcategory: DRAMs
Supply Current-Max: 0.424 mA
Technology: CMOS
Temperature Grade: COMMERCIAL
Terminal Finish: Tin/Lead (Sn/Pb)
Terminal Form: BALL
Terminal Pitch: 0.8 mm
Terminal Position: BOTTOM
Clock Frequency-Max (fCLK): 300 MHz
Interleaved Burst Length: 2,4,8
Surface Mount: YES
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  • Features
  • Product Manufacturer

GENERAL DESCRIPTION

FOR 1M x 32Bit x 4 Bank DDR SDRAM
The K4D263238G is 134,217,728 bits of hyper synchronous data rate Dynamic RAM organized as 4 x1,048,576 words by 32 bits, fabricated with SAMSUNG’s high performance CMOS technology. Synchronous features with Data Strobe allow extremely high performance up to 2.8GB/s/chip. I/O transactions are possible on both edges of the clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the device to be useful for a variety of high performance memory system applications.

FEATURES

• 2.5V ± 5% power supply for device operation
• 2.5V ± 5% power supply for I/O interface
• SSTL_2 compatible inputs/outputs
• 4 banks operation
• MRS cycle with address key programs
-. Read latency 3, 4 (clock)
-. Burst length (2, 4 and 8)
-. Burst type (sequential & interleave)
• All inputs except data & DM are sampled at the positive going edge of the system clock
• Differential clock input
• No Wrtie-Interrupted by Read Function
• 4 DQS’s ( 1DQS / Byte )
• Data I/O transactions on both edges of Data strobe
• DLL aligns DQ and DQS transitions with Clock transition
• Edge aligned data & data strobe output
• Center aligned data & data strobe input
• DM for write masking only
• Auto & Self refresh
• 32ms refresh period (4K cycle)
• 144-Ball FBGA
• Maximum clock frequency up to 350MHz
• Maximum data rate up to 700Mbps/pin

 

Samsung ARTIK, a product line of Samsung Semiconductor, is an integrated IoT platform that provides a fast path to deliver secure, interoperable, and intelligent IoT products and services. ARTIK unifies hardware, software, cloud, security, and a partner ecosystem in a single integrated offering. It hides the inherent complexity of IoT behind easy-to-use, open, and enterprise-grade APIs, SDKs, and tools, enabling any device to interact with any third-party device, app, or service. Using Samsung ARTIK, enterprises can quickly bring new IoT solutions to market, tap into new revenue streams, and grow their businesses.

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