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Jun 6 2020

K4S641633H-BN75 Datasheets| SAMSUNG| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-K4S641633H-BN75

Manufacturer Part#:

K4S641633H-BN75

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

SAMSUNG

Click Purchase button to buy original genuine

K4S641633H-BN75

Description:

-

Datasheet:

K4S641633H-BN75 Datasheet

Package:

BGA

Quantity:

142238 PCS

K4S641633H-BN75 Images are for reference only.

 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Manufacturer Part Number

K4S641633H-BN75

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Reach Compliance Code

Compliant

Manufacturer

Samsung Semiconductor

Risk Rank

5.75

Access Time-Max

5.4 ns

Clock Frequency-Max (fCLK)

133 MHz

I/O Type

COMMON

Interleaved Burst Length

1,2,4,8

JESD-30 Code

S-PBGA-B54

Memory Density

67108864 bit

Memory IC Type

SYNCHRONOUS DRAM

Memory Width

16

Number of Terminals

54

Number of Words

4194304 words

Number of Words Code

4000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Organization

4MX16

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA54,9X9,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Power Supplies

3/3.3 V

Qualification Status

Not Qualified

Refresh Cycles

4096

Sequential Burst Length

1,2,4,8,FP

Standby Current-Max

0.0005 A

Subcategory

DRAMs

Supply Current-Max

0.135 mA

Surface Mount

Yes

Technology

CMOS

Temperature Grade

OTHER

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Status

NRFND


Features

  • 3.0V & 3.3V power supply.
  • LVCMOS compatible with multiplexed address.
  • Four banks operation.
  • MRS cycle with address key programs.

 -. CAS latency (1, 2 & 3).

 -. Burst length (1, 2, 4, 8 & Full page).

 -. Burst type (Sequential & Interleave).

  • EMRS cycle with address key programs.
  • All inputs are sampled at the positive going edge of the system

 clock.

  • Burst read single-bit write operation.
  • Special Function Support.

 -. PASR (Partial Array Self Refresh).

 -. Internal TCSR (Temperature Compensated Self Refresh)

  • DQM for masking.
  • Auto refresh.
  • 64ms refresh period (4K cycle).
  • Commercial Temperature Operation (-25°C ~ 70°C).
  • Extended Temperature Operation (-25°C ~ 85°C).
  • 54Balls FBGA with 0.8mm ball pitch

( -RXXX : Leaded, -BXXX : Lead Free)

Advantages and Disadvantages

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Applications

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Product Functions

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ECCN / UNSPSC

There is no relevant information available for this part yet.


Environmental & Export Classifications

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Documents & Media

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Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

142238

Samsung Semiconductor

-

Hamilton Americas

5125

Samsung Semiconductor

-

LTL Group

324

Samsung Semiconductor

-

Bison Technologies

105,351

Samsung Semiconductor

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

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Market Price Analysis

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