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Jun 3 2020

K4J55323QG-BC14 Datasheets| SAMSUNG| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-K4J55323QG-BC14

Manufacturer Part#:

K4J55323QG-BC14

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

SAMSUNG

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K4J55323QG-BC14

Description:

-

Datasheet:

K4J55323QG-BC14 Datasheet

Package:

BGA

Quantity:

1005 PCS


K4J55323QG-BC14 Images are for reference only.

 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Manufacturer Part Number

K4J55323QG-BC14

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

FBGA-136

Reach Compliance Code

unknown

Manufacturer

Samsung Semiconductor

Risk Rank

5.84

Access Mode

FOUR BANK PAGE BURST

Access Time-Max

0.26 ns

Additional Feature

AUTO/SELF REFRESH

Clock Frequency-Max (fCLK)

700 MHz

I/O Type

COMMON

Interleaved Burst Length

4,8

JESD-30 Code

R-PBGA-B136

JESD-609 Code

e1

Length

14 mm

Memory Density

268435456 bit

Memory IC Type

DDR DRAM

Memory Width

32

Moisture Sensitivity Level

3

Number of Functions

1

Number of Ports

1

Number of Terminals

136

Number of Words

8388608 words

Number of Words Code

8000000

Operating Mode

SYNCHRONOUS

Operating Temperature-Min

0.0  Cel

Operating Temperature-Max

85.0  Cel

Organization

8MX32

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Equivalence Code

BGA136,12X17,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies

1.8 V

Qualification Status

Not Qualified

Refresh Cycles

4096

Seated Height-Max

1.2 mm

Sequential Burst Length

4,8

Standby Current-Max

0.09 A

Subcategory

DRAMs

Supply Current-Max

0.935 mA

Supply Voltage-Max (Vsup)

1.9 V

Supply Voltage-Min (Vsup)

1.7 V

Supply Voltage-Nom (Vsup)

1.8 V

Surface Mount

Yes

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Width

11 mm


Features

  • 1.8V + 0.1V power supply for device operation
  • 1.8V + 0.1V power supply for I/O interface
  • On-Die Termination (ODT)
  • Output Driver Strength adjustment by EMRS
  • Calibrated output drive
  • 1.8V Pseudo Open drain compatible inputs/outputs
  • 4 internal banks for concurrent operation
  • Differential clock inputs (CK and CK)
  • Commands entered on each positive CK edge
  • CAS latency : 4, 5, 6, 7, 8, 9, 10, 11 (clock)
  • Programmable Burst length : 4 and 8
  • Programmable Write latency : 1, 2, 3, 4, 5, 6 and 7 (clock)
  • Single ended READ strobe (RDQS) per byte
  • Single ended WRITE strobe (WDQS) per byte
  • RDQS edge-aligned with data for READs
  • WDQS center-aligned with data for WRITEs
  • Data Mask(DM) for masking WRITE data
  • Auto & Self refresh modes
  • Auto Precharge option
  • 32ms, auto refresh (4K cycle)
  • 136 Ball FBGA
  • Maximum clock frequency up to 800MHz
  • Maximum data rate up to 1.6Gbps/pin
  • DLL for outputs
  • Boundary scan function with SEN pin
  • Mirror function with MF pin

Advantages and Disadvantages

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Applications

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Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

There is no relevant information available for this part yet.


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / Non-Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

1005

Samsung Semiconductor

-

Express Electronics

2411

Samsung Semiconductor

-

Starlit Technology Co.,ltd

2000

Samsung Semiconductor

-

Ic Agent

16650

Samsung Semiconductor

-


Alternative Models

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Popularity by Region

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Market Price Analysis

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