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Jun 6 2020

K4H561638F-TCA2 Datasheets| SAMSUNG| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-K4H561638F-TCA2

Manufacturer Part#:

K4H561638F-TCA2

Product Category:

Memory

Stock:

Yes

Manufacturer:

SAMSUNG

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K4H561638F-TCA2

Description:

-

Datasheet:

K4H561638F-TCA2 Datasheet

Package:

TSOP

Quantity:

5138 PCS


K4H561638F-TCA2 Images are for reference only.

 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Manufacturer Part Number

K4T51083QC-ZCCC

Pbfree Code

No

Rohs Code

No

Part Life Cycle Code

TSOP2

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

TSOP2, TSSOP66,.46

Pin Count

66

Reach Compliance Code

Compliant

Manufacturer

Samsung Semiconductor

Risk Rank

5.39

Access Mode

FOUR BANK PAGE BURST

Access Time-Max

0.75 ns

Additional Feature

AUTO/SELF REFRESH

Clock Frequency-Max (fCLK)

133 MHz

I/O Type

COMMON

Interleaved Burst Length

2,4,8

JESD-30 Code

R-PDSO-G66

JESD-609 Code

e0

Length

22.22 mm

Memory Density

268435456 bit

Memory IC Type

DDR DRAM

Memory Width

16

Number of Functions

1

Number of Ports

1

Number of Terminals

66

Number of Words

16777216 words

Number of Words Code

16000000

Operating Mode

SYNCHRONOUS

Operating Temperature-Max

70 °C

Operating Temperature-Min

0 °C

Organization

16MX16

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TSOP2

Package Equivalence Code

TSSOP66,.46

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

2.5 V

Qualification Status

Not Qualified

Refresh Cycles

8192

Seated Height-Max

1.2 mm

Sequential Burst Length

2,4,8

Subcategory

DRAMs

Supply Current-Max

0.3 mA

Supply Voltage-Max (Vsup)

2.7 V

Supply Voltage-Min (Vsup)

2.3 V

Supply Voltage-Nom (Vsup)

2.5 V

Surface Mount

Yes

Technology

CMOS

Temperature Grade

COMMERCIAL

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Form

GULL WING

Terminal Pitch

0.65 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Width

10.16 mm


Features

  • VDD : 2.5V ± 0.2V, VDDQ : 2.5V ± 0.2V for DDR266, 333
  • VDD : 2.6V ± 0.1V, VDDQ : 2.6V ± 0.1V for DDR400
  • Double-data-rate architecture; two data transfers per clock cycle
  • Bidirectional data strobe [DQS] (x4,x8) & [L(U)DQS] (x16)
  • Four banks operation
  • Differential clock inputs(CK and CK)
  • DLL aligns DQ and DQS transition with CK transition
  • MRS cycle with address key programs

 -. Read latency : DDR266(2, 2.5 Clock), DDR333(2.5 Clock), DDR400(3 Clock)

 -. Burst length (2, 4, 8)

 -. Burst type (sequential & interleave)

  • All inputs except data & DM are sampled at the positive going edge of the system clock(CK)
  • Data I/O transactions on both edges of data strobe
  • Edge aligned data output, center aligned data input
  • LDM,UDM for write masking only (x16)
  • DM for write masking only (x4, x8)
  • Auto & Self refresh
  • 7.8us refresh interval(8K/64ms refresh)
  • Maximum burst refresh cycle : 8
  • 66pin TSOP II Leaded & Pb-Free(RoHS compliant) package

Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

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Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

There is no relevant information available for this part yet.


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

-

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

5138

Samsung Semiconductor

-

Rantle East Electronic

2096

Samsung Semiconductor

-

Bernal Technology Ltd

1000

Samsung Semiconductor

-

Ande Electronics Co.,limited

4154

Samsung Semiconductor

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

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Market Price Analysis

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