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H55S5122DFR-60M Datasheets | DRAMs Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90

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Product Overview

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H55S5122DFR-60M
Manufacturer Part#: H55S5122DFR-60M
Product Category: DRAMs
Stock: On Order
Manufacturer: SK Hynix Inc
Description: Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90
Datasheet: N/A
Package: FBGA, BGA90,9X15,32
Minimum: 1
Quantity: On Order

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Product Attributes

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Manufacturer Part Number: H55S5122DFR-60M
Rohs Code: Yes
Part Life Cycle Code: Obsolete
Ihs Manufacturer: SK HYNIX INC
Package Description: FBGA, BGA90,9X15,32
Reach Compliance Code: compliant
Manufacturer: SK Hynix Inc
Risk Rank: 5.81
Access Time-Max: 5.4 ns
I/O Type: COMMON
JESD-30 Code: R-PBGA-B90
JESD-609 Code: e1
Memory Density: 536870912 bit
Memory IC Type: SYNCHRONOUS DRAM
Memory Width: 32
Number of Terminals: 90
Number of Words: 16777216 words
Number of Words Code: 16000000
Operating Temperature-Max: 85 °C
Organization: 16MX32
Output Characteristics: 3-STATE
Package Body Material: PLASTIC/EPOXY
Package Code: FBGA
Package Equivalence Code: BGA90,9X15,32
Package Shape: RECTANGULAR
Package Style: GRID ARRAY, FINE PITCH
Power Supplies: 1.8 V
Qualification Status: Not Qualified
Refresh Cycles: 8192
Standby Current-Max: 0.0003 A
Subcategory: DRAMs
Supply Current-Max: 0.1 mA
Technology: CMOS
Temperature Grade: OTHER
Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form: BALL
Terminal Pitch: 0.8 mm
Terminal Position: BOTTOM
Clock Frequency-Max (fCLK): 166 MHz
Interleaved Burst Length: 1,2,4,8
Sequential Burst Length: 1,2,4,8,FP
Surface Mount: YES
Operating Temperature-Min: -30 °C
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