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H55S2562JFR-60M Datasheets | DRAMs Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 1 MM HEIGHT, 0.80 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-54

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Product Overview

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H55S2562JFR-60M
Manufacturer Part#: H55S2562JFR-60M
Product Category: DRAMs
Stock: On Order
Manufacturer: SK Hynix Inc
Description: Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 1 MM HEIGHT, 0.80 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-54
Datasheet: N/A
Package: VFBGA, BGA54,9X9,32
Minimum: 1
Quantity: On Order

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Product Attributes

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Manufacturer Part Number: H55S2562JFR-60M
Rohs Code: Yes
Part Life Cycle Code: Obsolete
Ihs Manufacturer: SK HYNIX INC
Package Description: VFBGA, BGA54,9X9,32
Reach Compliance Code: compliant
Manufacturer: SK Hynix Inc
Risk Rank: 5.8
Access Mode: FOUR BANK PAGE BURST
Access Time-Max: 5.4 ns
Additional Feature: AUTO/SELF REFRESH
I/O Type: COMMON
JESD-30 Code: S-PBGA-B54
JESD-609 Code: e1
Length: 8 mm
Memory Density: 268435456 bit
Memory IC Type: SYNCHRONOUS DRAM
Memory Width: 16
Number of Functions: 1
Number of Words: 16777216 words
Number of Words Code: 16000000
Operating Mode: SYNCHRONOUS
Operating Temperature-Max: 85 °C
Organization: 16MX16
Output Characteristics: 3-STATE
Package Body Material: PLASTIC/EPOXY
Package Code: VFBGA
Package Equivalence Code: BGA54,9X9,32
Package Shape: SQUARE
Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Power Supplies: 1.8 V
Qualification Status: Not Qualified
Refresh Cycles: 8192
Seated Height-Max: 1 mm
Self Refresh: YES
Standby Current-Max: 0.0003 A
Subcategory: DRAMs
Supply Current-Max: 0.07 mA
Supply Voltage-Max (Vsup): 1.95 V
Supply Voltage-Min (Vsup): 1.7 V
Technology: CMOS
Temperature Grade: OTHER
Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form: BALL
Terminal Pitch: 0.8 mm
Terminal Position: BOTTOM
Clock Frequency-Max (fCLK): 166 MHz
Interleaved Burst Length: 1,2,4,8
Sequential Burst Length: 1,2,4,8,FP
ECCN Code: EAR99
HTS Code: 8542.32.00.24
Part Package Code: BGA
Pin Count: 54
Operating Temperature-Min: -30 °C
Peak Reflow Temperature (Cel): 260
Time@Peak Reflow Temperature-Max (s): 20
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Alternative Models

Part Compare Manufacturers Category Description
Mfr.Part#:H55S2562JFR-60M Compare: Current Part Manufacturers:Sk hynix Category: Description: Dram chip mobile sdram 256mbit 16mx16 1.8v 54pin fbga
Mfr.Part#:MT48H16M16LFBF-75:H Compare: H55S2562JFR-60M VS MT48H16M16LFBF-75:H Manufacturers:Micron Category:RAM Memory Description: Dram chip mobile sdram 256mbit 16mx16 1.8v 54pin vfbga tray
Mfr.Part#:MT48H16M16LFBF-75IT:H Compare: H55S2562JFR-60M VS MT48H16M16LFBF-75IT:H Manufacturers:Micron Category: Description: Dram chip mobile sdram 256mbit 16mx16 1.8v 54pin vfbga tray
Mfr.Part#:MT48H16M16LFBF-75 Compare: H55S2562JFR-60M VS MT48H16M16LFBF-75 Manufacturers:Micron Category:RAM Memory Description: 256mb x16, x32 mobile sdram
Description Value
Description Value
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