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May 29 2020

MT41J256M16RE-125:D Datasheets| MICRON| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-MT41J256M16RE-125:D

Manufacturer Part#:

MT41J256M16RE-125:D

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

MICRON

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Purchase

Description:

-

Datasheet:

MT41J256M16RE-125:D Datasheet

Package:

FBGA

Quantity:

2074 PCS


MT41J256M16RE-125:D Images are for reference only.

 MT41J256M16RE-125:D Image


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

EU RoHS Compliant

Yes

REACH Compliant

Yes

Status

Obsolete

Package Description

10 X 14 MM, LEAD FREE, FBGA-96

Base Part Number

MT41J256M4

Brand

MICRON

Sub Category

DRAMs

Access Mode

MULTI BANK PAGE BURST

Access Time-Max

0.225 ns

Address Bus Width

18 Bit

Clock Frequency-Max (fCLK)

800 MHz

Data Bus Width

16 Bit

I/O Type

COMMON

Interleaved Burst Length

8

JESD-30 Code

R-PBGA-B96

JESD-609 Code

e1

Memory Density

4294967296 bit

Memory IC Type

DDR DRAM

Memory Width

16

Maximum Clock Rate

1600 MHz

Maximum Operating Current

280 mA

Memory Type

Volatile

Memory Format

DRAM

Memory Size

4Gb (256M x 16)

Number of Terminals

96

Number of Words

268435456 words

Number of Words Code

256000000

Number of Functions

1

Number of Ports

1

Number of Bits per Word

16 Bit

Number of I/O Lines

16 Bit

Number of Banks

8

Organization

256MX16

Operating Mode

SYNCHRONOUS

Operating Temperature

0°C~85°C

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Parallel/Serial

PARALLEL

Package Equivalence Code

BGA96,9X16,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Pbfree Code

Yes

Peak Reflow Temperature (Cel)

260

Power Supplies

1.5 V

Pin Count

96

Packaging

Bulk

Product Dimensions

14 x 10 x 0.75 mm

Package / Case

96-TFBGA

Supplier Device Package

96-FBGA (10x14)

Qualification Status

Not Qualified

Risk Rank

5.66

Refresh Cycles

8192

Rohs Code

Yes

Screening Level

Commercial

Supplier Package

FBGA

Sequential Burst Length

8

Standby Current-Max

0.02 A

Supply Current-Max

0.32 mA

Supply Voltage-Nom (Vsup)

1.5 V

Supply Voltage-Min (Vsup)

1.425 V

Supply Voltage-Max (Vsup)

1.575 V

Seated Height-Max

1.2 mm

Surface Mount

Yes

Technology

SDRAM - DDR3

Type

DDR3 SDRAM

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Length

14 mm

Width

10 mm

Write Cycle Time - Word, Page

-


Features

  • VDD = VDDQ = 1.5V ±0.075V
  • 1.5V center-terminated push/pull I/O
  • Differential bidirectional data strobe
  • 8n-bit prefetch architecture
  • Differential clock inputs (CK, CK#)
  • 8 internal banks
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Programmable CAS READ latency (CL)
  • Posted CAS additive latency (AL)
  • Programmable CAS WRITE latency (CWL) based on tCK
  • Fixed burst length (BL) of 8 and burst chop (BC) of 4 (via the mode register set [MRS])
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Self refresh mode
  • TC of 0°C to 95°C
  • 64ms, 8192 cycle refresh at 0°C to 85°C
  • 32ms, 8192 cycle refresh at 85°C to 95°C
  • Self refresh temperature (SRT)
  • Automatic self refresh temperature (ASR)
  • Write leveling
  • Multipurpose register
  • Output driver calibration

Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

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Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542320036

SCHEDULE B

8542320023


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Micron Technology, Inc. is an American producer of computer memory and computer data storage including dynamic random-access memory, flash memory, and USB flash drives. It is headquartered in Boise, Idaho. Its consumer products are marketed under the brands Crucial[3] and Ballistix. Micron and Intel together created IM Flash Technologies, which produces NAND flash memory.


Product Range

Memory

Storage

Advanced Solutions

DRAM

DRAM Modules

Graphics Memory

Managed NAND

Multichip Packages

NAND Flash

NOR Flash

Memory Cards

Solid State Drives

3D XPoint Technology

Advanced Computing Solutions

Authenta Security Solution

Heterogeneous-Memory Storage Engine


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

2074 PCS

Micron Technology

-

Digi-Key

1000 PCS

Micron Technology

IC DRAM 4G PARALLEL 96FBGA

Avnet

Not Available

Micron Technology

DRAM Chip DDR3 SDRAM 4G-Bit 256Mx16 1.5V 96-Pin F-BGA

Arrow

Not Available

Micron Technology

DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 96-Pin FBGA


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

 MT41J256M16RE-125:D Popularity by Region

MT41J256M16RE-125:D Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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