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Home  Solder  1993881 Datasheets | Solder Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)

Jan 5 2021

1993881 Datasheets | Solder Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)

Product Overview

Image:
1993881
Manufacturer Part#: 1993881
Product Category: Solder
Stock: No
Manufacturer: LOCTITE
Description: Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet: GC 10 Datasheet
Package: N/A
Minimum: 1
Lead Time: 3 Weeks
Quantity: On Order
Send RFQ: Inquiry

Reference Price

Qty Unit Price Ext. Price
1: 108.00000 108.00000

1993881 Images are for reference only.

1993881

CAD Models

Product Attributes

Series: LOCTITE® GC 10
Type: Solder Paste
Mfr: LOCTITE
Package: Jar
Wire Gauge: -
Weight: -
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: -
Melting Point: 423°F (217°C)
Flux Type: No-Clean
Process: Lead Free
Form: Jar 17.64 oz (500g)
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shipping Info: -

Descriptions

LOCTITE GC 10 SAC305T4 885 52U:Digi-Key

FEATURES

[OK International]

INTRODUCTION AND GENERAL OVERVIEW

Thank you for your purchase of a Metcal BGA/CSP-3500 Series Rework System. Each unit has been inspected thoroughly by Metcal prior to shipment and, with proper maintenance, will give you years of reliable performance.

SYSTEM FEATURES AND ACCESSORIES

BGA/CSP-3500 REWORK SYSTEM INCLUDES:
• BGA/CSP-3500 Series Base Unit
• BGA/CSP-3500 Control Unit with BGA-1 Microprocessor digital module
• High Resolution Camera, 1/2” CCD with “C” mount.
• Open-ended adjustable size board holder with under board support.
• 20” High Resolution Color Monitor (Optional)
• BGA-3528 Micro Oven Head Assembly

ACCESSORIES INCLUDED WITH SYSTEM

• MX-500S-11 or MX-500S-21
• SMTC-061 Blade tip cartridge with BGA version, SMTC-0167 with CSP version
• High temperature vacuum pads (19219)
• Spatula Handle (20534)
• Folding Hex Key Set (12236)
• Type “K” thermocouple (30 AWG (21104), 24 AWG (19984))
• One (1) roll of Kapton tape (20207)
• Stencil Adapter (21149)
• Manual for BGA/CSP-3500 Series.
• BGA-S1 Windows™ based software (19759)
• RS-232 PC interface cable (19756)
• SVHS video cable (20092)
• Adjustable BGA (19993) or CSP (20987)Tooling Plate.
• Vacuum Heads
• Height Reference Block 19993
• Gun-sight alignment assembly (20066)
• Hex Wrenches ( 3/32”, 1/16” & .050”)
• FS-24 Footswitch
• Adjustable Board Holder Fingers (AC-CLAMPSET)

Environmental & Export Classifications

Description Value
RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): Not Applicable
ECCN: EAR99
HTSUS: 3810.10.0000

Documents & Media

Datasheets: GC 10 Datasheet
Product Training Modules: GC 10 Fact Sheet
MSDS Material Safety Datasheet: GC 10, GC 3W Properties
Featured Product: Introduction to Solder Paste
PCN Packaging: GC 10 Solder Paste
HTML Datasheet: 1993881 MSDS

Distributors

Image PartNo Manufacturer Descriptions Stock Step Price
1993881 1993881 LOCTITE Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) On Order

1:$$108.00000

1993881 1993881 Loctite LOCTITE GC 10 SAC305T4 885 52U:Digi-Key
On Order

1:$108.000

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You can also find the tracking number in order history.
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Parts should be unused and in original packaging.
Customer has to take charge for the shipping.
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1993881
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
  • Product Attributes
  • Descriptions
  • Features
  • CAD Models
Series: LOCTITE® GC 10
Type: Solder Paste
Mfr: LOCTITE
Package: Jar
Wire Gauge: -
Weight: -
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: -
Melting Point: 423°F (217°C)
Flux Type: No-Clean
Process: Lead Free
Form: Jar 17.64 oz (500g)
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 41°F ~ 77°F (5°C ~ 25°C)
Shipping Info: -

LOCTITE GC 10 SAC305T4 885 52U:Digi-Key

FEATURES

[OK International]

INTRODUCTION AND GENERAL OVERVIEW

Thank you for your purchase of a Metcal BGA/CSP-3500 Series Rework System. Each unit has been inspected thoroughly by Metcal prior to shipment and, with proper maintenance, will give you years of reliable performance.

SYSTEM FEATURES AND ACCESSORIES

BGA/CSP-3500 REWORK SYSTEM INCLUDES:
• BGA/CSP-3500 Series Base Unit
• BGA/CSP-3500 Control Unit with BGA-1 Microprocessor digital module
• High Resolution Camera, 1/2” CCD with “C” mount.
• Open-ended adjustable size board holder with under board support.
• 20” High Resolution Color Monitor (Optional)
• BGA-3528 Micro Oven Head Assembly

ACCESSORIES INCLUDED WITH SYSTEM

• MX-500S-11 or MX-500S-21
• SMTC-061 Blade tip cartridge with BGA version, SMTC-0167 with CSP version
• High temperature vacuum pads (19219)
• Spatula Handle (20534)
• Folding Hex Key Set (12236)
• Type “K” thermocouple (30 AWG (21104), 24 AWG (19984))
• One (1) roll of Kapton tape (20207)
• Stencil Adapter (21149)
• Manual for BGA/CSP-3500 Series.
• BGA-S1 Windows™ based software (19759)
• RS-232 PC interface cable (19756)
• SVHS video cable (20092)
• Adjustable BGA (19993) or CSP (20987)Tooling Plate.
• Vacuum Heads
• Height Reference Block 19993
• Gun-sight alignment assembly (20066)
• Hex Wrenches ( 3/32”, 1/16” & .050”)
• FS-24 Footswitch
• Adjustable Board Holder Fingers (AC-CLAMPSET)

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