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SC8156SVT1000B Datasheets | Digital Signal Processors 0-BIT, OTHER DSP, PBGA783, 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783

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SC8156SVT1000B
Manufacturer Part#: SC8156SVT1000B
Product Category: Digital Signal Processors
Stock: On Order
Manufacturer: NXP / Freescale
Description: 0-BIT, OTHER DSP, PBGA783, 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783
Datasheet: N/A
Package: 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783
Minimum: 1
Quantity: On Order

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Product Attributes

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Manufacturer Part Number: MSC8156SVT1000B
Rohs Code: Yes
Part Life Cycle Code: Obsolete
Ihs Manufacturer: FREESCALE SEMICONDUCTOR INC
Part Package Code: BGA
Package Description: 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783
Pin Count: 783
Reach Compliance Code: not_compliant
ECCN Code: 3A991.A.2
HTS Code: 8542.31.00.01
Risk Rank: 8.39
Barrel Shifter: NO
Bit Size: 32
Format: FIXED POINT
Internal Bus Architecture: MULTIPLE
JESD-30 Code: S-PBGA-B783
Length: 29 mm
Operating Temperature-Max: 105 °C
Package Body Material: PLASTIC/EPOXY
Package Equivalence Code: BGA783,28X28,40
Package Shape: SQUARE
Package Style: GRID ARRAY
Peak Reflow Temperature (Cel): 245
Power Supplies: 1,2.5 V
Qualification Status: Not Qualified
RAM (words): 8192
Seated Height-Max: 3.94 mm
Subcategory: Digital Signal Processors
Supply Voltage-Max: 1.05 V
Supply Voltage-Min: 0.97 V
Supply Voltage-Nom: 1 V
Technology: CMOS
Temperature Grade: OTHER
Terminal Form: BALL
Terminal Pitch: 1 mm
Terminal Position: BOTTOM
uPs/uCs/Peripheral ICs Type: DIGITAL SIGNAL PROCESSOR, OTHER
Boundary Scan: YES
Moisture Sensitivity Level: 3
Terminal Finish: Tin/Silver/Copper - with Nickel barrier
Time@Peak Reflow Temperature-Max (s): 30
Manufacturer: Freescale Semiconductor
Pbfree Code: No
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FEATURES

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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