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DSPD56367AG150 Datasheets | Digital Signal Processors LEAD FREE DSP56367

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DSPD56367AG150
Manufacturer Part#: DSPD56367AG150
Product Category: Digital Signal Processors
Stock: On Order
Manufacturer: NXP / Freescale
Description: LEAD FREE DSP56367
Datasheet: N/A
Package: 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-144
Minimum: 1
Quantity: On Order

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Product Attributes

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Manufacturer Part Number: DSPD56367AG150
Brand Name: Freescale
Part Life Cycle Code: Transferred
Ihs Manufacturer: FREESCALE SEMICONDUCTOR INC
Part Package Code: QFP
Package Description: 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-144
Pin Count: 144
Reach Compliance Code: compliant
ECCN Code: 3A991.A.2
HTS Code: 8542.31.00.01
Risk Rank: 5.25
Address Bus Width: 18
Barrel Shifter: YES
Bit Size: 24
Clock Frequency-Max: 150 MHz
Format: FIXED POINT
Internal Bus Architecture: MULTIPLE
JESD-30 Code: S-PQFP-G144
Length: 20 mm
Package Body Material: PLASTIC/EPOXY
Package Code: LFQFP
Package Equivalence Code: QFP144,.87SQ,20
Package Shape: SQUARE
Package Style: FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel): 260
Power Supplies: 1.8,3.3 V
Qualification Status: Not Qualified
RAM (words): 20480
Seated Height-Max: 1.6 mm
Subcategory: Digital Signal Processors
Supply Voltage-Max: 1.89 V
Supply Voltage-Min: 1.71 V
Supply Voltage-Nom: 1.8 V
Technology: CMOS
Terminal Form: GULL WING
Terminal Pitch: 0.5 mm
Terminal Position: QUAD
uPs/uCs/Peripheral ICs Type: DIGITAL SIGNAL PROCESSOR, OTHER
JESD-609 Code: e3
Moisture Sensitivity Level: 3
Terminal Finish: Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s): 40
Manufacturer: Freescale Semiconductor
Pbfree Code: Yes
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FEATURES

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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