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Jun 22 2020

MC33882PEP Datasheets| NXP| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-MC33882PEP

Manufacturer Part#:

MC33882PEP

Product Category:

PMIC - Power Distribution Switches, Load Drivers

Stock:

Yes

Manufacturer:

Freescale Semiconductor - NXP

Click Purchase button to buy original genuine MC33882PEP

Description:

IC SW LO SIDE 6-OUTPUT 32QFN

Datasheet:

MC33882PEP Datasheet

Package:

32-VQFN Exposed Pad

Quantity:

451 PCS


MC33882PEP Images are for reference only.


CAD Models

MC33882PEP Footprint


Product Attributes

Base Part Number

MC33882

Built-in Protections

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Case/Package

VQFN

Category

Integrated Circuits (ICs)

Clamping Voltage

64V

Current - Output (Max)

-

Current Rating

2mA

Description

IC SW LO SIDE 6-OUTPUT 32QFN

Driver Number of Bits

8

ECCN Code

EAR99

Fault Protection

Current Limiting (Fixed), Open Load Detect, Over Voltage

Halogen Free

Halogen Free

HTS Code

8542.39.00.01

Ihs Manufacturer

NXP SEMICONDUCTORS

Input Type

-

Interface

SPI, Parallel

Interface IC Type

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

JESD-30 Code

S-XQCC-N32

JESD-609 Code

e3

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Length

7 mm

Manufacturer

NXP Semiconductors / Freescale

Manufacturer Part Number

MC33882PEP

Max Input Voltage

25V

Max Operating Temperature

125°C

Min Input Voltage

8V

Min Operating Temperature

-40°C

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Mount

Surface Mount

Nominal Supply Current

7.5mA

Number of Functions

1

Number of Pins

32

Number of Terminals

32

On-State Resistance

600mR

Operating Supply Voltage

25V

Operating Temperature

-40°C ~ 150°C (TJ)

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Other Names

568-14394 
935321548557 
MC33882PEP-ND

Output Configuration

Low Side

Output Current

3A

Output Current Flow Direction

SINK

Output Peak Current Limit-Nom

3 A

Output Type

N-Channel

Package / Case

32-VQFN Exposed Pad

Package Body Material

UNSPECIFIED

Package Code

HVQCCN

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packaging

Tray

Part Life Cycle Code

Active

Part Number

MC33882PEP

Peak Reflow Temperature (Cel)

260

Power Supplies

5,9/17 V

Qualification Status

Not Qualified

Radiation Hardening

No

Ratio - Input:Output

1:1

Rds On (Typ)

400 mOhm

Reach Compliance Code

Compliant

Risk Rank

1.33

Rohs Code

Yes

Seated Height-Max

1 mm

Series

-

Subcategory

Peripheral Drivers

Supplier Device Package

32-QFN-EP

Supply Voltage1-Max

25 V

Supply Voltage1-Min

8 V

Supply Voltage1-Nom

13 V

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

Surface Mount

YES

Switch Type

General Purpose

Technology

MOS

Temperature Grade

AUTOMOTIVE

Terminal Finish

MATTE TIN

Terminal Form

NO LEAD

Terminal Pitch

0.65 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

40

Turn-Off Delay Time

10us

Turn-On Delay Time

10us

Voltage - Load

8 V ~ 25 V

Voltage - Supply (Vcc/Vdd)

4.5 V ~ 5.5 V

Weight

0.005039oz

Width

7 mm


Features

  • Outputs clamped for switching inductive loads
  • Very low operational bias currents (< 2.0 mA)
  • CMOS input logic compatible with 5.0 V logic levels
  • Robust load dump (60 V transient at VPWRon OUT0–OUT5)
  • Daisy chain operation of multiple devices possible
  • Switch outputs can be paralleled for higher currents
  • RDS(ON)of 0.4 Ωper output (25 °C) at 13 V VPWR
  • SPI operation guaranteed to 2.0 MHz

Advantages and Disadvantages

Advantages

The 33882 is a smart 6 output low-side switch able to control system loads up to 1.0 A. The six outputs can be controlled via both serial peripheral interface (SPI) and parallel input control, making the device attractive for fault tolerant system applications. There are two additional 30 mA low-side switches with SPI diagnostic reporting (parallel input control only).

The 33882 is designed to interface directly with industry standard microcontrollers via SPI to control both inductive and incandescent loads. Outputs are configured as open drain power MOSFETs incorporating internal dynamic clamping and current limiting. The device has multiple monitoring and protection features, including low standby current, fault status reporting, internal 52 V clamp on each output, output specific diagnostics, and protective shutdown. Additionally, it has a mode select pin affording a dual means of input control.


Applications

There is no relevant information available for this part yet.


Product Functions

The 33882 incorporates six 1.0 A low-side switches using both Serial Peripheral Interface (SPI) I/O as well as optional parallel input control to each output. There are also two lowpower (30 mA) low-side switches with SPI diagnostic feedback, but parallel-only input control. The 33882 incorporates SMARTMOS technology with CMOS logic, bipolar/MOS analog circuitry, and DMOS power MOSFETs. Designed to interface directly with a microcontroller, it controls inductive or incandescent loads. Each output is configured as an open drain transistor with dynamic clamping.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

NXP Semiconductors N.V. is a Dutch global semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 people in more than 35 countries, including 11,200 engineers in 33 countries. NXP reported revenue of $6.1 billion in 2015, including one month of revenue contribution from recently merged Freescale Semiconductor.

On October 27, 2016, it was announced that Qualcomm would try to buy NXP, but because the Chinese merger authority did not approve the acquisition before the deadline set by Qualcomm, it was effectively canceled on 26 July 2018.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

451 PCS

NXP Semiconductors

IC SW LO SIDE 6-OUTPUT 32QFN

Digi-Key

245 PCS

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 32QFN

Min Qty:1

Rochester Electronics

260 PCS

Freescale Semiconductor

-

Mouser

161 PCS

NXP Semiconductors

Power Switch ICs - Power Distribution SIX OUTPUT LOW SIDE SW

RoHS: Compliant


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

 

MC33882PEP Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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