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Jun 19 2020

MC33663ALEF Datasheets| NXP| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-MC33663ALEF

Manufacturer Part#:

MC33663ALEF

Product Category:

Interface - Drivers, Receivers, Transceivers

Stock:

Yes

Manufacturer:

Freescale Semiconductor - NXP

Click Purchase button to buy original genuine MC33663ALEF

Description:

IC LIN INTERFACE W/WAKE 14SOIC

Datasheet:

MC33663ALEF Datasheet

Package:

14-SOIC (0.154", 3.90mm Width)

Quantity:

116 PCS

MC33663ALEF Images are for reference only.


CAD Models

MC33663ALEF Footprint


Product Attributes

Base Part Number

MC336

Case/Package

SOIC

Categories

Interface - Drivers, Receivers, Transceivers

Data Rate

-

Description

IC LIN INTERFACE W/WAKE 14SOIC

Detailed Description

2/2 Transceiver LINbus 14-SOIC

Duplex

-

ECCN Code

EAR99

Halogen Free

Halogen Free

HTS Code

8542.39.00.01

Ihs Manufacturer

NXP SEMICONDUCTORS

Is Samacsys

N

JESD-30 Code

R-PDSO-G14

JESD-609 Code

e3

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Length

8.65 mm

Manufacturer

NXP Semiconductors / Freescale

Manufacturer Part Number

MC33663ALEF

Max Operating Temperature

125°C

Min Operating Temperature

-40°C

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Mounting Type

Surface Mount

Nominal Supply Current

22uA

Number of Drivers/Receivers

2/2

Number of Functions

1

Number of Pins

14

Number of Terminals

14

Operating Supply Voltage

18V

Operating Temperature

-40°C ~ 125°C

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Other Names

935310968574

Package / Case

14-SOIC (0.154", 3.90mm Width)

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Packaging

Tube

Part Life Cycle Code

Obsolete

Part Number

MC33663ALEF

Peak Reflow Temperature (Cel)

260

Protocol

LINbus

Reach Compliance Code

Compliant

Risk Rank

5.76

Rohs Code

Yes

Seated Height-Max

1.75 mm

Series

-

Supplier Device Package

14-SOIC

Supply Voltage-Nom

13.5 V

Surface Mount

YES

Telecom IC Type

INTERFACE CIRCUIT

Temperature Grade

AUTOMOTIVE

Terminal Finish

Matte Tin (Sn)

Terminal Form

GULL WING

Terminal Pitch

1.27 mm

Terminal Position

DUAL

Time@Peak Reflow Temperature-Max (s)

40

Type

Transceiver

Voltage - Supply

7 V ~ 18 V

Weight

0.004452oz

Width

3.9 mm


Features

  • Operational from VSUP7.0 to 18 V DC,functional up to 27 V DC, and handles 40 V during load dump
  • Compatible with LIN protocol specification2.1, and SAEJ2602-2
  • Very high immunity againstelectromagnetic interference
  • Low standby current in Sleep mode
  • Over-temperature protection
  • Permanent dominant state detection
  • Fast baud rate mode selection reported byRXD
  • Active bus waveshaping offering excellentradiated emission performance
  • Sustains ±15.0 kV ESD IEC6100-4-2 onLIN BUS and VSUP pins
  • 5.0 and 3.3 V compatible digital inputswithout any external components required

Advantages and Disadvantages

Advantages

The local interconnect network (LIN) is a serial communication protocol designed to support automotive networks in conjunction with controller area network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required.

The 33663 product line integrates two physical layer LIN bus dedicated to automotive LIN sub-bus applications. The MC33663LEF and MC33663SEF devices offer normal baud rate (20 kbps) and the MC33663JEF slow baud rate (10kbps). Both devices integrate fast baud rate (above 100 kbps) for test and programming modes. The 33663 product line offers excellent electromagnetic compatibility (EMC) and radiated emission performance, electrostatic discharge (ESD) robustness and safe behavior, in the event of LIN bus short-to-ground or LIN bus leakage during low-power mode.


Applications

  • Body electronics
    • Body controller & gateways
    • Lighting modules
    • Door/seat module
  • Powertrain
    • Engine management/ Start Stop
    • Battery management systems

Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS3 Compliant


Documents & Media

Datasheets

MC33663 Datasheet

PCN Design/Specification

MC33662,3 Datasheet Update 26/Feb/2014
Copper Wire Revision A 07/Nov/2014

PCN Obsolescence/ EOL

Mult Dev EOL 9/Jun/2017

HTML Datasheet

MC33663 Datasheet


Product Manufacturer

NXP Semiconductors N.V. is a Dutch global semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 people in more than 35 countries, including 11,200 engineers in 33 countries. NXP reported revenue of $6.1 billion in 2015, including one month of revenue contribution from recently merged Freescale Semiconductor.

On October 27, 2016, it was announced that Qualcomm would try to buy NXP, but because the Chinese merger authority did not approve the acquisition before the deadline set by Qualcomm, it was effectively canceled on 26 July 2018.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

116 PCS

NXP Semiconductors

IC LIN INTERFACE W/WAKE 14SOIC

Digi-Key

Limited Supply - Call

NXP Semiconductors

IC TRANSCEIVER 2/2 14SOIC

Min Qty:55

Rochester Electronics

84 PCS

Freescale Semiconductor

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

There is no relevant information available for this part yet.


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