Adjust the voltage level of your devices with this step down TPS826711SIPR DC to DC converter from Texas Instruments. This converter"s single output can produce a current up to 0.6 A. Supply your circuit with sufficient power by implementing this, which requires a minimum input voltage of 2.3 V that does not exceed 4.8 V. With a fixed output that has a voltage of 1.8 V, this is power management at its best. By operating at a load regulation of -0.00085%/mA(Typ) and line regulation of 0.23%/V(Typ) you can provide a constant voltage at your output. This converter is 90 % efficient. It has a switching frequency of 4900 to 6000 kHz. In order to guarantee safe delivery and allow for quick mounting of this component after delivery, it will be enclosed in tape and reel packaging during shipment. This converter has an operating temperature range of -40 °C to 85 °C.
Non-Isolated PoL Module DC DC Converter 1 Output 1.26V 600mA 2.3V - 4.8V Input
The TPS8267x device is a complete 600mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design. The TPS8267x is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSiP™ DC/DC converter operates at a regulated 5.5-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range. The PFM mode extends the battery life by reducing the quiescent current to 17µA (typ) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency. The TPS8267x is packaged in a compact (2.3mm × 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.