

OMAP3503ECUS vs OMAP3515ECUSA vs OMAP3503ECUSA Comparison
- Hide Shared Attributes
- OMAP3503ECUS
- OMAP3503ECUSA
- Part No.
- OMAP3503ECUS
- OMAP3515ECUSA
- OMAP3503ECUSA
- Description
- Applications Processor 423Pin FCBGA Tray
- Applications Processor 423Pin FCBGA Tray
- Applications Processor 423Pin FCBGA Tray
- Manufacturer
- N/A
- N/A
- N/A
- Classification
- Microprocessors
- Microprocessors
- Microprocessors
- Reference Price(USD)
- $11.087
- $19.792
- $17.193
- Inventory(pcs)
- 339
- 132
- 1.3k
- Case/Package
- FCBGA-423
- FCBGA-423
- FCBGA-423
- Number of Pins
- 423
- 423
- 423
- Number of UARTs
- 3
- 3
- 3
- RAM Memory Size
- 64 KB
- 64 KB
- 64 KB
- ECCN Code
- 5A992.c
- 5A992.c
- 5A992.c
- HK STC License
- NLR
- -
- -
- Operating Temperature
- 0℃ ~ 90℃ (TJ)
- -40℃ ~ 105℃ (TJ)
- -40℃ ~ 105℃ (TJ)
- Mounting Style
- Surface Mount
- Surface Mount
- Surface Mount
- Packaging
- Tray
- Tray
- Tray
- Lead-Free Status
- Lead Free
- Lead Free
- Lead Free
- RoHS
- RoHS Compliant
- RoHS Compliant
- RoHS Compliant
- Product Lifecycle Status
- Active
- Active
- Active
- Operating Temperature (Max)
- 90 ℃
- 105 ℃
- 105 ℃
- Operating Temperature (Min)
- 0 ℃
- -40 ℃
- -40 ℃
- Overview
-
OMAP3503ECUS Product overview
Description OMAP3515 and OMAP3503 devices are based on the enhanced OMAP 3 architecture. The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: • Streaming video • Video conferencing • High-resolution still image The device supports high-level operating systems (HLOSs), such as: • Linux® • Windows® CE • Android™ This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device: • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor • PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3515 device only) • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out. • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals The device also offers: • A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption. • Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)
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OMAP3515ECUSA Product overview
Description OMAP3515 and OMAP3503 devices are based on the enhanced OMAP 3 architecture. The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: • Streaming video • Video conferencing • High-resolution still image The device supports high-level operating systems (HLOSs), such as: • Linux® • Windows® CE • Android™ This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device: • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor • PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3515 device only) • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out. • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals The device also offers: • A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption. • Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)
View all -
OMAP3503ECUSA Product overview
Description OMAP3515 and OMAP3503 devices are based on the enhanced OMAP 3 architecture. The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: • Streaming video • Video conferencing • High-resolution still image The device supports high-level operating systems (HLOSs), such as: • Linux® • Windows® CE • Android™ This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device: • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor • PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3515 device only) • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out. • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals The device also offers: • A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption. • Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)
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OMAP3515ECUSA Alternative Parts
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Mfr.Part#:OMAP3515ECUSA | Compare: Current Part | Manufacturers:N/A | Category:Microprocessors | Description:ApplicaN/Aons processor 423pin fcbga tray | |
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Mfr.Part#:OMAP3503ECUSA | Compare: OMAP3515ECUSA VS OMAP3503ECUSA | Manufacturers:N/A | Category:Microprocessors | Description:ApplicaN/Aons processor 423pin fcbga tray | |
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Mfr.Part#:OMAP3503DCUSA | Compare: OMAP3515ECUSA VS OMAP3503DCUSA | Manufacturers:N/A | Category:Microprocessors | Description:Ic mpu omap-35xx 600mhz 423fcbga | |
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Mfr.Part#:OMAP3503ECUS | Compare: OMAP3515ECUSA VS OMAP3503ECUS | Manufacturers:N/A | Category:Microprocessors | Description:ApplicaN/Aons processor 423pin fcbga tray |