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OMAP3503ECUS vs OMAP3515ECUSA vs OMAP3503ECUSA Comparison

  • OMAP3503ECUS
    OMAP3503ECUS
    OMAP3515ECUSA
    OMAP3515ECUSA
    OMAP3503ECUSA
    OMAP3503ECUSA
  • Part No.
    OMAP3503ECUS
    OMAP3515ECUSA
    OMAP3503ECUSA
  • Description
    Applications Processor 423Pin FCBGA Tray
    Applications Processor 423Pin FCBGA Tray
    Applications Processor 423Pin FCBGA Tray
  • Manufacturer
    TI
    TI
    TI
  • Classification
    Microprocessors
    Microprocessors
    Microprocessors
  • Reference Price(USD)
    $11.087
    $19.792
    $17.193
  • Inventory(pcs)
    339
    132
    1.3k
  • Case/Package
    FCBGA-423
    FCBGA-423
    FCBGA-423
  • Number of Pins
    423
    423
    423
  • Number of UARTs
    3
    3
    3
  • RAM Memory Size
    64 KB
    64 KB
    64 KB
  • ECCN Code
    5A992.c
    5A992.c
    5A992.c
  • HK STC License
    NLR
    -
    -
  • Operating Temperature
    0℃ ~ 90℃ (TJ)
    -40℃ ~ 105℃ (TJ)
    -40℃ ~ 105℃ (TJ)
  • Mounting Style
    Surface Mount
    Surface Mount
    Surface Mount
  • Packaging
    Tray
    Tray
    Tray
  • Lead-Free Status
    Lead Free
    Lead Free
    Lead Free
  • RoHS
    RoHS Compliant
    RoHS Compliant
    RoHS Compliant
  • Product Lifecycle Status
    Active
    Active
    Active
  • Operating Temperature (Max)
    90 ℃
    105 ℃
    105 ℃
  • Operating Temperature (Min)
    0 ℃
    -40 ℃
    -40 ℃
  • Overview
    OMAP3503ECUS Product overview

    Description OMAP3515 and OMAP3503 devices are based on the enhanced OMAP 3 architecture. The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: • Streaming video • Video conferencing • High-resolution still image The device supports high-level operating systems (HLOSs), such as: • Linux® • Windows® CE • Android™ This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device: • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor • PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3515 device only) • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out. • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals The device also offers: • A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption. • Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

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    OMAP3515ECUSA Product overview

    Description OMAP3515 and OMAP3503 devices are based on the enhanced OMAP 3 architecture. The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: • Streaming video • Video conferencing • High-resolution still image The device supports high-level operating systems (HLOSs), such as: • Linux® • Windows® CE • Android™ This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device: • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor • PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3515 device only) • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out. • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals The device also offers: • A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption. • Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

    View all
    OMAP3503ECUSA Product overview

    Description OMAP3515 and OMAP3503 devices are based on the enhanced OMAP 3 architecture. The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: • Streaming video • Video conferencing • High-resolution still image The device supports high-level operating systems (HLOSs), such as: • Linux® • Windows® CE • Android™ This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device: • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor • PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3515 device only) • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out. • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals The device also offers: • A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption. • Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

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OMAP3515ECUSA Alternative Parts

Image Part Compare Manufacturer Category Description
Image:OMAP3515ECUSA Mfr.Part#:OMAP3515ECUSA Compare: Current Part Manufacturers:TI Category:Microprocessors Description:Applications Processor 423Pin FCBGA Tray
Image:OMAP3503ECUSA Mfr.Part#:OMAP3503ECUSA Compare: OMAP3515ECUSA VS OMAP3503ECUSA Manufacturers:TI Category:Microprocessors Description:Applications Processor 423Pin FCBGA Tray
Image:OMAP3503DCUSA Mfr.Part#:OMAP3503DCUSA Compare: OMAP3515ECUSA VS OMAP3503DCUSA Manufacturers:TI Category:Microprocessors Description:IC MPU OMAP-35XX 600MHz 423FCBGA
Image:OMAP3503ECUS Mfr.Part#:OMAP3503ECUS Compare: OMAP3515ECUSA VS OMAP3503ECUS Manufacturers:TI Category:Microprocessors Description:Applications Processor 423Pin FCBGA Tray