The 573400D00000G is a surface-mount Heat Sink with tin-plated finish for use with D3 Pak (TO-268) package semiconductors. Its unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through-hole solutions. The semiconductor"s conventional copper drain pad is modified to extend beyond the edges of the semiconductor package providing space to mount the heat sink. The device and heat sink are soldered directly to the modified drain pad creating a thermal transfer path from the package tab to the surface mount heat sink. The elevated "Wings" of the heat sink provide ample surface area to dissipate the heat into the surrounding environment.
The 7109DG is a 25mm surface mount Heat Sink with copper, tin-plated, 11 thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.