573300D00000G vs 573400D00000G vs 573300D00010G Comparison

The 573400D00000G is a surface-mount Heat Sink with tin-plated finish for use with D3 Pak (TO-268) package semiconductors. Its unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through-hole solutions. The semiconductor"s conventional copper drain pad is modified to extend beyond the edges of the semiconductor package providing space to mount the heat sink. The device and heat sink are soldered directly to the modified drain pad creating a thermal transfer path from the package tab to the surface mount heat sink. The elevated "Wings" of the heat sink provide ample surface area to dissipate the heat into the surrounding environment.

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Horizontal mount orientation

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No attachment holes required in the printed circuit board

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Wing configuration will not interfere with adjacent components

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Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders

The 573300D00010G is a 26.16mm surface mount Heat Sink with copper construction, tin-plated finish, 18°C/W thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. It features no attachment holes required in the printed circuit board, 100% matte tin plating with nickel underplate, wing configuration will not interfere with adjacent components, their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders. Suitable for power supplies, telecommunication equipment, motor Controls, medical equipment, industrial process control equipment and consumer products applications.

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Horizontal mount orientation