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531002B02500G vs 637-10ABP vs 637-10ABPE Comparison

  • Hide Shared Attributes
    531002B02500G
    531002B02500G
    637-10ABP
    637-10ABP
    637-10ABPE
    637-10ABPE
  • Part No.
    531002B02500G
    637-10ABP
    637-10ABPE
  • Description
    Heat Sink, Square, PCB, With Radial Fins, TO-220, 13.4℃/W, 12.7mm, 34.92mm, 25.4mm
    WAKEFIELD SOLUTIONS 637-10ABP Heat Sink, Square, Black Anodized, Wave-Solderable, TO-220, 76℃/W, 25.4mm, 34.9mm, 12.7mm
    WAKEFIELD SOLUTIONS 637-10ABPE Heat Sink, Square, PCB, Black Anodized, Wave-Solderable, TO-220, 12.67℃/W, 25.4mm, 34.9mm
  • Manufacturer
    Aavid Thermalloy
    Wakefield Engineering
    Wakefield Engineering
  • Classification
    Heatsinks
    Heatsinks
    Heatsinks
  • Reference Price(USD)
    $0.769
    $0.958
    $0.392
  • Inventory(pcs)
    17.1k
    0
    21k
  • Case/Package
    TO-220
    TO-220
    TO-220
  • Power Rating
    -
    6.00 W
    -
  • Power Dissipation
    -
    6.00 W
    6 W
  • Thermal Resistance
    13.4 ℃/W
    76 ℃/W
    12.67 ℃/W
  • Material
    Aluminum
    Aluminum
    Aluminum
  • Color
    Black
    Black
    Black
  • Size-Length
    25.40 mm
    25.40 mm
    25.40 mm
  • Size-Width
    35.052 mm
    34.9 mm
    34.9 mm
  • Size-Height
    25.4 mm
    12.7 mm
    25.4 mm
  • Mounting Style
    Through Hole
    Through Hole
    Through Hole
  • Weight
    -
    10.43 g
    10.43 g
  • Packaging
    Tray
    Bulk
    Bulk
  • REACH SVHC Compliance
    No SVHC
    -
    -
  • Lead-Free Status
    Lead Free
    Contains Lead
    Lead Free
  • RoHS
    RoHS Compliant
    Non-Compliant
    RoHS Compliant
  • Product Lifecycle Status
    Active
    Not Recommended for New Design
    Active
  • Industrial-Spec
    Yes
    Yes
    -
  • REACH SVHC Compliance Edition
    2013/06/20
    2015/12/17
    2015/12/17
  • Thermal Resistance @ Forced Air Flow
    4℃/W @400LFM
    5.80℃/W @200LFM
    5.80℃/W @200LFM
  • Overview
    531002B02500G Product overview

    The 531002B02500G is a 25.4 x 12.7 x 34.92mm extruded Heat Sink with radial fins and notched base and solderable pins. This board level heat sink is made of aluminium with black anodized finish and features vertical mount orientation. This heat sink is suitable for use with TO-220, TO-220-single gauge devices. This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.

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    637-10ABP Product overview

    Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products.

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    637-10ABPE Product overview

    Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products.

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531002B02500G Alternative Parts

Image Part Compare Manufacturer Category Description
Image:531002B02500G Mfr.Part#:531002B02500G Compare: Current Part Manufacturers:Aavid Thermalloy Category:Heatsinks Description:Heat Sink, Square, PCB, With Radial Fins, TO-220, 13.4℃/W, 12.7mm, 34.92mm, 25.4mm
Image:637-10ABPE Mfr.Part#:637-10ABPE Compare: 531002B02500G VS 637-10ABPE Manufacturers:Wakefield Engineering Category:Heatsinks Description:WAKEFIELD SOLUTIONS 637-10ABPE Heat Sink, Square, PCB, Black Anodized, Wave-Solderable, TO-220, 12.67℃/W, 25.4mm, 34.9mm
Image:637-10ABP Mfr.Part#:637-10ABP Compare: 531002B02500G VS 637-10ABP Manufacturers:Wakefield Engineering Category:Heatsinks Description:WAKEFIELD SOLUTIONS 637-10ABP Heat Sink, Square, Black Anodized, Wave-Solderable, TO-220, 76℃/W, 25.4mm, 34.9mm, 12.7mm