* Tape mounting saves board space by eliminating mounting holes
The ICK BGA 27 X 27 X 10 is a Heat Sink made of aluminium with black anodised finish. It is suitable for use with universal processors IC design BGA. It offers thermal conductive foil and thermal conductive adhesive way of fixation.
The ICK BGA 27X27 is a Heat Sink made of aluminium with black anodised finish. It is suitable for use with universal processors IC design BGA. It offers thermal conductive foil and thermal conductive adhesive way of fixation.