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374324B00035G 374324B00035G VS ICK BGA 27X27
374324B00035G 374324B00035G VS ICK BGA 27X27374324B00035G vs ICK BGA 27 X 27 X 10 vs ICK BGA 27X27 Comparison
- Hide Shared Attributes
- Part No.
- 374324B00035G
- ICK BGA 27 X 27 X 10
- ICK BGA 27X27
- Description
- AAVID THERMALLOY 374324B00035G Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 30.6℃/W, 10mm, 27mm, 27mm
- FISCHER ELEKTRONIK ICK BGA 27 X 27 X 10 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 18.5℃/W, 10mm, 27mm, 27mm
- FISCHER ELEKTRONIK ICK BGA 27X27 Heat Sink, For Ball Grid Array, BGA, 20℃/W, 6mm, 27mm, 27mm
- Manufacturer
- Aavid Thermalloy
- Fischer Connectors
- Fischer Connectors
- Classification
- Heatsinks
- Heatsinks
- Heatsinks
- Reference Price(USD)
- $2.012
- $0.843
- $1.299
- Inventory（pcs）
- 6.6k
- 345
- 0
- Case/Package
- BGA
- BGA
- BGA
- Thermal Resistance
- 30.6 ℃/W
- 18.5 ℃/W
- 20 ℃/W
- Material
- Aluminum
- Aluminum Alloy
- Aluminum
- Color
- Black
- Black
- -
- Size-Length
- 27 mm
- 27 mm
- 27.0 mm
- Size-Width
- 27 mm
- 27 mm
- 27 mm
- Size-Height
- 10 mm
- 10 mm
- 6 mm
- Mounting Style
- Surface Mount
- Surface Mount
- Surface Mount
- Packaging
- Tray
- -
- -
- REACH SVHC Compliance
- No SVHC
- No SVHC
- No SVHC
- Lead-Free Status
- Lead Free
- -
- Lead Free
- RoHS
- RoHS Compliant
- RoHS Compliant
- RoHS Compliant
- Product Lifecycle Status
- Active
- -
- -
- REACH SVHC Compliance Edition
- 2015/12/17
- 2015/12/17
- 2015/12/17
- Overview
-
374324B00035G Product overview
* Tape mounting saves board space by eliminating mounting holes
- .
- Convenient peel and stick assembly is quick and clean
- .
- Pin-Fin array allows omni-directional airflow to maximize heat dissipation
- .
- Fin dimensions (LxW): 13x12mm
View all -
ICK BGA 27 X 27 X 10 Product overview
The ICK BGA 27 X 27 X 10 is a Heat Sink made of aluminium with black anodised finish. It is suitable for use with universal processors IC design BGA. It offers thermal conductive foil and thermal conductive adhesive way of fixation.
- .
- Universal socket
- .
- 3.3W Dissipation loss (Pv)
View all -
ICK BGA 27X27 Product overview
The ICK BGA 27X27 is a Heat Sink made of aluminium with black anodised finish. It is suitable for use with universal processors IC design BGA. It offers thermal conductive foil and thermal conductive adhesive way of fixation.
- .
- Universal socket
- .
- 3.1W Dissipation loss (Pv)
View all
374324B00035G Alternative Parts
| Image | Part | Compare | Manufacturer | Category | Description | |
Image: |
Mfr.Part#:374324B00035G | Compare: Current Part | Manufacturers:Aavid Thermalloy | Category:Heatsinks | Description:AAVID THERMALLOY 374324B00035G Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 30.6℃/W, 10mm, 27mm, 27mm | |
Image: |
Mfr.Part#:ICK BGA 27 X 27 X 10 | Compare: 374324B00035G VS ICK BGA 27 X 27 X 10 | Manufacturers:Fischer Connectors | Category:Heatsinks | Description:FISCHER ELEKTRONIK ICK BGA 27 X 27 X 10 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 18.5℃/W, 10mm, 27mm, 27mm | |
Image: |
Mfr.Part#:ICK BGA 27X27 | Compare: 374324B00035G VS ICK BGA 27X27 | Manufacturers:Fischer Connectors | Category:Heatsinks | Description:FISCHER ELEKTRONIK ICK BGA 27X27 Heat Sink, For Ball Grid Array, BGA, 20℃/W, 6mm, 27mm, 27mm | |
Image: |
Mfr.Part#:ICK BGA 27X27X10 | Compare: 374324B00035G VS ICK BGA 27X27X10 | Manufacturers:Fischer Connectors | Category:Heatsinks | Description:FISCHER ELEKTRONIK ICK BGA 27X27X10 Heat Sink, BGA, 18.5℃/W, 10mm, 27mm, 27mm |
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