08055C474K4T2A vs 08055C474K4Z2A vs C0805X474K5RACAUTO Comparison

The MLCC series Multilayer Ceramic Capacitor cover a wide range of case sizes, capacitance values and working voltages. The X7R dielectric components containing BME electrode with epoxy finish for conductive glue mounting and copper terminations with a Ni/Sn plated overcoat. The NP0 dielectric components containing Pd/Ag electrode and silver termination with a Ni/Sn plated overcoat. These products are not suitable for automotive industry only, but for all improved reliability applications as well. All components comply with AEC-Q200 standard - stress test qualification for passive components.

The AVX FLEXITERM automotive MLCC are multilayer ceramic chip capacitors with X7R dielectric material and flexible terminations. The capacitance value ranges from 0.22nF to 22µF. FLEXITERM is designed to enhance mechanical flexure and temperature cycling performance of a standard ceramic capacitor. The industry standard for flexure is 2mm, FLEXITERM provides up to 5mm of flexure without internal cracks. These capacitors provide improved performance compared to standard termination capacitors. The automotive grade FLEXITERM capacitors provide a design engineer with satisfactory solution for designing PCB"s which may be subject to high levels of board flexure.

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Automotive grade AEC-Q200 compliant

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EIA 0402, 0603, 0805, 1206, 1210, 1812, 2220 case sizes available

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Rated voltage of 16VDC, 25VDC, 50VDC, 100VDC, 200VDC and 500VDC

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±1%, ±2%, ±5%, ±10% and ±20% tolerance

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Reduction in circuit board flex failures

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Soft termination offers improved reliability performance

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Operating temperature range -55°C to 125°C

The Automotive Grade X series (FT-CAP) MLCC in X7R dielectric incorporates a unique, flexible termination system that is integrated with KEMET"s standard termination materials. A conductive silver epoxy is utilized between the base metal and nickel barrier layers of KEMET"s standard termination system in order to establish pliability while maintaining terminal strength, solderability and electrical performance. This technology was developed in order to address the primary failure mode of MLCCs- flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Flexible termination technology mitigates flex cracks which can result in low IR or short circuit failures. These flexrobust devices offer up to 5mm of flex-bend capability and exhibit a predictable change in capacitance with respect to time and voltage. Capacitance change with reference to ambient temperature is limited to ±15% from -55°C to +125°C.