Product Overview
Kynix Part#: | KY32-XC7K160T-2FBG484I |
Manufacturer Part#: | XC7K160T-2FBG484I |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | XILINX |
Click Purchase button to buy original genuine XC7K160T-2FBG484I |
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Description: | IC FPGA 285 I/O 484FCBGA |
Datasheet: | XC7K160T-2FBG484I Datasheet |
Package: | - |
Quantity: | 733 PCS |
XC7K160T-2FBG484I Images are for reference only:
CAD Models
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Product Attributes
Manufacturer: | XILINX |
Product Category: | IC Chips |
Status: | Active |
Series: | Kintex®-7 |
Clock Frequency-Max: | 1286.0 MHz |
Data Rate: | 10.3 Gb/s |
Distributed RAM: | 2188 kbit |
Device Logic Cells: | 162,240 |
Device Logic Units: | 101,400 |
EU RoHS Compliant: | Yes |
Embedded Block RAM - EBR: | 11700 kbit |
In System Programmability: | Yes |
.JESD-30 Code: | S-PBGA-B484 |
JESD-609 Code: | e1 |
Length: | 23.0 mm |
Lead Finish: | Tin/Silver/Copper |
Mounting Type: | Surface Mount |
Mounting Style: | SMD/SMT |
Maximum Operating Frequency: | 640 MHz |
Number of I/O: | 285 |
Number of CLBs: | 12675.0 |
Number of Inputs: | 285.0 |
Number of Outputs: | 285.0 |
Number of Terminals: | 484 |
Number of Transceivers: | 4 Transceiver |
Number of Logic Cells: | 162240 |
Organization: | 12675 CLBS |
Operating Temperature-Min: | -40.0 °C |
Operating Temperature-Max: | 100.0 °C |
Pin Count: | 484 |
Product Type: | FPGA - Field Programmable Gate Array |
Package / Case: | 484-BBGA, FCBGA |
Package Code: | BGA |
Package Style: | GRID ARRAY |
Package Shape: | SQUARE |
Package Body Material: | PLASTIC/EPOXY |
Package Equivalence Code: | BGA484,22X22,40 |
Programmable Logic Type: | FIELD PROGRAMMABLE GATE ARRAY |
RAM Bits: | 11,980,800 Bit |
REACH Compliant: | Yes |
Speed Grade: | 2 |
Sub Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
Seated Height-Max: | 2.54 mm |
Supply Voltage-Nom: | 1.0 V |
Supply Voltage-Min: | 0.97 V |
Supply Voltage-Max: | 1.03 V |
Supplier Device Package: | 484-FCBGA (23x23) |
Tradename: | Kintex |
Technology : | CMOS |
Total RAM Bits: | 11980800 |
Terminal Form: | BALL |
Terminal Pitch: | 1.0 mm |
Terminal Finish: | Tin/Silver/Copper(Sn/Ag/Cu) |
Terminal Position: | BOTTOM |
Time@Peak Reflow Temperature-Max: | NOT SPECIFIED |
Voltage - Supply: | 0.97V ~ 1.03V |
Width: | 23.0 mm |
Product Features
• Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
• High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
• High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
• A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
• Quickly deploy embedded processing with MicroBlaze™ processor.
• Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
Product Functions
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Applications
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Advantages and Disadvantages
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ECCN / UNSPSC
ECCN: | 3A991.D |
HTSN: | 8542390001 |
SCHEDULE B: | 8542390000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Product Compliance
USHTS: | 8542390001 |
TARIC: | 8542399000 |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributors | Stock | Manufacturers | Descriptions |
Kynix | 733 | XILINX | IC FPGA 285 I/O 484FCBGA |
DigiKey | 261 | Xilinx Inc. | IC FPGA 285 I/O 484FCBGA |
Mouser | 0 | Xilinx | FPGA - Field Programmable Gate Array |
Alternative Models
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Market Price Analysis
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