Product Overview
Kynix Part#: | KY32-XC2S300E-6FGG456C |
Manufacturer Part#: | XC2S300E-6FGG456C |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | XILINX |
Click Purchase button to buy original genuine XC2S300E-6FGG456C |
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Description: | - |
Datasheet: | XC2S300E-6FGG456C Datasheet |
Package: | BGA456 |
Quantity: | 606 PCS |
XC2S300E-6FGG456C Images are for reference only:
CAD Models
There is no relevant information available for this part yet.
Product Attributes
Manufacturer: | XILINX |
Product Category: | IC Chips |
Status: | Discontinued |
Clock Frequency-Max: | 357.0 MHz |
Device Logic Cells: | 6912 |
Device Logic Gates | 300000 |
Device Logic Units: | 6912 |
Device System Gates | 300000 |
EU RoHS Compliant: | Yes |
In System Programmability | Yes |
.JESD-30 Code: | S-PBGA-B456 |
JESD-609 Code: | e1 |
Length: | 23.0 mm |
Lead Finish | Tin/Silver/Copper |
Mounting Type: | Surface Mount |
Maximum Internal Frequency | 357 MHz |
Max Processing Temp | 250 °C |
Moisture Sensitivity Level | 3 |
Number of CLBs: | 1536.0 |
Number of Equivalent Gates | 93000.0 |
Number of Inputs: | 329.0 |
Number of Outputs: | 329.0 |
Number of Terminals: | 456 |
Number of Logic Cells: | 6912.0 |
Organization | 1536 CLBS, 93000 GATES |
Operating Temperature-Min: | 0.0 °C |
Operating Temperature-Max: | 85.0 °C |
Pin Count: | 456 |
Product Dimensions | 23 x 23 x 2(Max) mm |
Package Code: | BGA |
Package Style: | GRID ARRAY |
Package Shape: | SQUARE |
Package Body Material: | PLASTIC/EPOXY |
Package Equivalence Code: | BGA456,22X22,40 |
Programmable Logic Type: | FIELD PROGRAMMABLE GATE ARRAY |
Peak Reflow Temperature: | 250 |
Qualification Status | Not Qualified |
RAM Bits: | 65536 Bit |
REACH Compliant: | Yes |
Re-programmability Support | Yes |
Speed Grade: | 6 |
Sub Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
Screening Level: | Commercial |
Seated Height-Max: | 2.6 mm |
Supply Voltage-Nom: | 1.8 V |
Supply Voltage-Min: | 1.71 V |
Supply Voltage-Max: | 1.89 V |
Technology : | CMOS |
Temperature Grade: | COMMERCIAL EXTENDED |
Terminal Form: | BALL |
Terminal Pitch: | 1.0 mm |
Terminal Finish: | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Terminal Position: | BOTTOM |
Time@Peak Reflow Temperature-Max: | 30 |
Voltage - Supply: | 1.71V ~ 1.89V |
Width: | 23.0 mm |
Product Features
• Second generation ASIC replacement technology
- Densities as high as 5,292 logic cells with up to
200,000 system gates
- Streamlined features based on Virtex® FPGA
architecture
- Unlimited reprogrammability
- Very low cost
- Cost-effective 0.18 micron process
• System level features
- SelectRAM™ hierarchical memory:
· 16 bits/LUT distributed RAM
· Configurable 4K bit block RAM
· Fast interfaces to external RAM
- Fully PCI compliant
- Low-power segmented routing architecture
- Full readback ability for verification/observability
- Dedicated carry logic for high-speed arithmetic
- Efficient multiplier support
- Cascade chain for wide-input functions
- Abundant registers/latches with enable, set, reset
- Four dedicated DLLs for advanced clock control
- Four primary low-skew global clock distribution
nets
- IEEE 1149.1 compatible boundary scan logic
• Versatile I/O and packaging
- Pb-free package options
- Low-cost packages available in all densities
- Family footprint compatibility in common packages
- 16 high-performance interface standards
- Hot swap Compact PCI friendly
- Zero hold time simplifies system timing
• Core logic powered at 2.5V and I/Os powered at 1.5V,
2.5V, or 3.3V
• Fully supported by powerful Xilinx® ISE® development
system
- Fully automatic mapping, placement, and routing
Advantages and Disadvantages
There is no relevant information available for this part yet.
ECCN / UNSPSC
ECCN: | 3A991.D |
HTSN: | 8542390001 |
SCHEDULE B: | 8542390000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3(168 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Product Compliance
There is no relevant information available for this part yet.
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributors | Stock | Manufacturers | Descriptions |
Kynix | 606 | XILINX | - |
DigiKey | - | - | - |
Mouser | - | - | - |
Alternative Models
There is no relevant information available for this part yet.
Popularity by Region
XC2S300E-6FGG456C Popularity by Region
Market Price Analysis
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