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XC2S300E-6FGG456C Datasheets| XILINX| PDF| Price| In Stock

Author: Apogeeweb
Date: 30 Jul 2019
 1451
IC Chips


Product Overview

Kynix Part#:

KY32-XC2S300E-6FGG456C

Manufacturer Part#:

XC2S300E-6FGG456C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

Click Purchase button to buy original genuine

XC2S300E-6FGG456C

purchase

Description:

-

Datasheet:

XC2S300E-6FGG456C Datasheet

Package:

BGA456

Quantity:

606 PCS


XC2S300E-6FGG456C Images are for reference only:

XC2S300E-6FGG456C


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Manufacturer:

XILINX

Product Category:

IC Chips

Status:

Discontinued

Clock Frequency-Max:

357.0 MHz

Device Logic Cells:

6912

Device Logic Gates

300000

Device Logic Units:

6912

Device System Gates

300000

EU RoHS Compliant:

Yes

In System Programmability

Yes

.JESD-30 Code:

S-PBGA-B456

JESD-609 Code:

e1

Length:

23.0 mm

Lead Finish

Tin/Silver/Copper

Mounting Type:

Surface Mount

Maximum Internal Frequency

357 MHz

Max Processing Temp

250 °C

Moisture Sensitivity Level

3

Number of CLBs:

1536.0

Number of Equivalent Gates

93000.0

Number of Inputs:

329.0

Number of Outputs:

329.0

Number of Terminals:

456

Number of Logic Cells:

6912.0

Organization

1536 CLBS, 93000 GATES

Operating Temperature-Min:

0.0 °C

Operating Temperature-Max:

85.0 °C

Pin Count:

456

Product Dimensions

23 x 23 x 2(Max) mm

Package Code:

BGA

Package Style:

GRID ARRAY

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA456,22X22,40

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Peak Reflow Temperature:

250

Qualification Status

Not Qualified

RAM Bits:

65536 Bit

REACH Compliant:

Yes

Re-programmability Support

Yes

Speed Grade:

6

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Screening Level:

Commercial

Seated Height-Max:

2.6 mm

Supply Voltage-Nom:

1.8 V

Supply Voltage-Min:

1.71 V

Supply Voltage-Max:

1.89 V

Technology :

CMOS

Temperature Grade:

COMMERCIAL EXTENDED

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max:

30

Voltage - Supply:

1.71V ~ 1.89V

Width:

23.0 mm


Product Features

• Second generation ASIC replacement technology

- Densities as high as 5,292 logic cells with up to

200,000 system gates

- Streamlined features based on Virtex® FPGA

architecture

- Unlimited reprogrammability

- Very low cost

- Cost-effective 0.18 micron process

• System level features

- SelectRAM™ hierarchical memory:

· 16 bits/LUT distributed RAM

· Configurable 4K bit block RAM

· Fast interfaces to external RAM

- Fully PCI compliant

- Low-power segmented routing architecture

- Full readback ability for verification/observability

- Dedicated carry logic for high-speed arithmetic

- Efficient multiplier support

- Cascade chain for wide-input functions

- Abundant registers/latches with enable, set, reset

- Four dedicated DLLs for advanced clock control

- Four primary low-skew global clock distribution

nets

- IEEE 1149.1 compatible boundary scan logic

• Versatile I/O and packaging

- Pb-free package options

- Low-cost packages available in all densities

- Family footprint compatibility in common packages

- 16 high-performance interface standards

- Hot swap Compact PCI friendly

- Zero hold time simplifies system timing

• Core logic powered at 2.5V and I/Os powered at 1.5V,

2.5V, or 3.3V

• Fully supported by powerful Xilinx® ISE® development

system

- Fully automatic mapping, placement, and routing


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

3A991.D

HTSN:

8542390001

SCHEDULE B:

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

There is no relevant information available for this part yet.


Documents & Media

Datasheets

XC2S300E-6FGG456C Datasheet

Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

606

XILINX

-

DigiKey

-

-

-

Mouser

-

-

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC2S300E-6FGG456C Popularity by Region

XC2S300E-6FGG456C Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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