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XC7K325T-L2FBG900E Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 29 Jul 2019
 1301
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC7K325T-L2FBG900E

Manufacturer Part#:

XC7K325T-L2FBG900E

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 500 I/O 900FCBGA

Datasheet:

XC7K325T-L2FBG900E Datasheet

Package:

BGA

Quantity:

88 PCS


XC7K325T-L2FBG900E Images are for reference only.

XC7K325T-L2FBG900E Image 


CAD Models

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Kintex®-7

Base Part Number

XC7K325T

Audio I/O

No

Configuration Memory

16MB QSPI; 128MB BPI FLASH

Display Mode

HMDI Output

Package Description

FBGA-900

REACH Compliant

Yes

Ethernet

Yes

GPIO

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Management  

MMCM, PLL

Combinatorial Delay of a CLB-Max

0.91 ns

Data Rate  

6.6 Gb/s

Distributed RAM   

4,000 kbit

Embedded Block RAM - EBR   

16,020 kbit

In System Programmability

No

Interface Standards

FMC LPC; I2C; HPC; XADC; SMA; SFP+

JESD-30 Code

S-PBGA-B900

JESD-609 Code

e1

Lead Finish

Tin/Silver/Copper

Memory Card Interface

SD Card

Memory Size

1GB

Memory Type

DDR3

Maximum Number of User I/Os

350

Moisture Sensitivity Level

4

Maximum Operating Frequency    

710 MHz

Number of CLBs

25,475

Number of Inputs

500

Number of Logic Cells

326,080

Number of Logic Units

203,800

Number of Outputs  

500

Number of Terminals

900

Number of I/O

500

Number of Logic Blocks (LABs)

25,475

Number of Registers

407,600

Operating Temperature

0°C ~ 100°C (TJ)

Operating Frequency Max   

741 MHz

Organization

25,475 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Packaging

Tray

Product Dimensions

31 x 31 mm

PCIe

PCIe

Package Type

FCBGA

Package Equivalence Code

BGA, BGA900,30X30,40

Package Shape

SQUARE

Programmability   

No

Pbfree Code

Yes

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

0.9,1.8,3.3 V

Pin Count

900

PCB

900

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

Qualification Status  

Not Qualified

RAM Bits

16,404,480 b

Rohs Code

Yes

Re-programmability Support

1

Radiation Hardening

No

Risk Rank

5.81

Seated Height-Max

2.54 mm

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

0.9 V

Supply Voltage-Min

0.87V

Supply Voltage-Max

0.93 V

Surface Mount  

Yes

Speed Grade

2L

Screening Level

Extended

Technology

CMOS

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form

Ball

Terminal Pitch  

1.0 mm

Terminal Position

Bottom

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Typical Operating Supply Voltage

1.0000 V

Tradename  

Kintex

USB

USB-Serial Bridge

Length

31 mm

Width

31 mm


Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

Advantages 

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991D

HTSN

8542390001"8542.39.00.01

SCHEDULE B

8542390000"8542.39.00.00


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status

Lead free


Documents & Media

Datasheets

Kintex-7 FPGAs Datasheet 

7 Series FPGA Overview

Design Resources

Development Tool Selector

Featured Product

TE0741 Series with Xilinx Kintex®-7

PCN Design/Specification

Cross-Ship Lead-Free Notice 31/Oct/2016

Zynq-7000 Datasheet Update 02/Jun/2014

Product Marking Chg 31/Oct/2016

PCN Packaging

Mult Devices 26/Jun/2017


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

88 PCS

Xilinx, Inc.

IC FPGA 500 I/O 900FCBGA

Digi-Key

0

Xilinx, Inc.

IC FPGA 500 I/O 900FCBGA

Avnet

Americas - 0

Asia - 0

Xilinx, Inc.

FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 900-Pin Lidless FC-BGA (Alt: XC7K325T-L2FBG900E)

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

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Popularity by Region

XC7K325T-L2FBG900E Popularity by Region 

XC7K325T-L2FBG900E Popularity by Region


Market Price Analysis

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