Product Overview
Kynix Part #: | KY32-XC2V2000-4FGG676C |
Manufacturer Part#: | XC2V2000-4FGG676C |
Product Category: | Embedded - FPGAs (Field Programmable Gate Array) |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC2V2000-4FGG676C | |
Description: | IC FPGA 456 I/O 676FBGA |
Datasheet: | XC2V2000-4FGG676C Datasheet |
Package: | 676-BGA |
Quantity: | 796 PCS |
XC2V2000-4FGG676C Images are for reference only.
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Product Attributes
Manufacturer | Xilinx Inc. |
Mfr Package Description | 27 X 27 MM, 1 MM PITCH, LEAD FREE, MS-034AAL-1, FBGA-676 |
Product Category | Embedded - FPGAs (Field Programmable Gate Array) |
Series | VirtexR-II |
EU RoHS Compliant | Yes |
Status | Discontinued |
Package-Case | 676-BGA |
Operating-Temperature | 0°C ~ 85°C (TJ) |
Mounting-Type | Surface Mount |
Supplier-Device-Package | 676-FBGA (27x27) |
Moisture Sensitivity Level | 3 |
Base Part Number | XC2V2000 |
Clock Frequency-Max | 650.0 MHz |
Combinatorial Delay of a CLB-Max | 0.44 ns |
Distributed RAM | 336 kbit |
Embedded Block RAM - EBR | 1008 kbit |
JESD-30 Code | S-PBGA-B676 |
JESD-609 Code | e1 |
Mount | Surface Mount |
Number of Gates | 2000000 |
Number of I/O | 456 |
Number of Logic Cells | 24192 |
Number of Pins | 676 |
Number of Registers | 21504 |
Number of Terminals | 676 |
Number-of-LABs-CLBs | 2688 |
Number-of-Logic-Elements-Cells | - |
Package / Case | 676-BGA |
Package Body Material | PLASTIC/EPOXY |
Package Equivalence Code | BGA676,26X26,40 |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Part Status | Obsolete |
Peak Reflow Temperature (Cel) | 250 |
Power Supplies | 1.5,1.5/3.3,3.3 |
Qualification Status | Not Qualified |
RAM Size | 1032192 b |
RoHS | Compliant |
Seated Height-Max | 2.6 mm |
Series | Virtex®-II |
Speed Grade | 4 |
Subcategory | Programmable Logic ICs |
Supplier Device Package | 676-FBGA (27x27) |
Supply Voltage-Max | 1.575 V |
Supply Voltage-Min | 1.425 V |
Supply Voltage-Nom | 1.5 V |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | OTHER |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Terminal Form | BALL |
Terminal Pitch | 1.0 mm |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Total RAM Bits | 1032192 |
Tradename | Virtex |
Length | 27.0 mm |
Width | 27.0 mm |
Features
− Densities from 40K to 8M system gates
− 420 MHz internal clock speed (Advance Data)
− 840+ Mb/s I/O (Advance Data)
− 3 Mb of dual-port RAM in 18 Kbit block SelectRAM resources
− Up to 1.5 Mb of distributed SelectRAM resources
− DRAM interfaces
▪ SDR / DDR SDRAM
▪ Network FCRAM
▪ Reduced Latency DRAM
− SRAM interfaces
▪ SDR / DDR SRAM
▪ QDR™ SRAM
− CAM interfaces
− Dedicated 18-bit x 18-bit multiplier blocks
− Fast look-ahead carry logic chains
− Up to 93,184 internal registers / latches with Clock Enable
− Up to 93,184 look-up tables (LUTs) or cascadable 16-bit shift registers
− Wide multiplexers and wide-input function support
− Horizontal cascade chain and sum-of-products support
− Internal 3-state bussing
− Up to 12 DCM (Digital Clock Manager) modules
▪ Precise clock de-skew
▪ Flexible frequency synthesis
▪ High-resolution phase shifting
− 16 global clock multiplexer buffers
− Fourth generation segmented routing structure
− Predictable, fast routing delay, independent of fanout
− Up to 1,108 user I/Os
− 19 single-ended and six differential standards
− Programmable sink current (2 mA to 24 mA) per I/O
− Digitally Controlled Impedance (DCI) I/O:on-chip termination resistors for single-ended I/O standards
− PCI-X compatible (133 MHz and 66 MHz) at 3.3V
− PCI compliant (66 MHz and 33 MHz) at 3.3V
− CardBus compliant (33 MHz) at 3.3V
− Differential Signaling
▪ 840 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers
▪ Bus LVDS I/O
▪ Lightning Data Transport (LDT) I/O with current driver buffers
▪ Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O
▪ Built-in DDR input and output registers
− Proprietary high-performance SelectLink Technology
▪ High-bandwidth data path
▪ Double Data Rate (DDR) link
▪ Web-based HDL generation methodology
− Integrated VHDL and Verilog design flows
− Compilation of 10M system gates designs
− Internet Team Design (ITD) tool
− Fast SelectMAP configuration
− Triple Data Encryption Standard (DES) security option (Bitstream Encryption)
− IEEE 1532 support
− Partial reconfiguration
− Unlimited reprogrammability
− Readback capability
0.15 µm 8-Layer Metal Process with 0.12 µm High-Speed Transistors
1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies
IEEE 1149.1 Compatible Boundary-Scan Logic Support
Flip-Chip and Wire-Bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm,1.00 mm, and 1.27 mm)
Wire-Bond BGA Devices Available in Pb-Free Packaging (www.xilinx.com/pbfree)
100% Factory Tested
Advantages and Disadvantages
Advantages
The Virtex-II family is a platform FPGA developed for high performance from low-density to high-density designs that are based on IP cores and customized modules. The family delivers complete solutions for telecommunication, wireless, networking, video, and DSP applications, including PCI, LVDS, and DDR interfaces. The leading-edge 0.15 µm / 0.12 µm CMOS 8-layer metal process and the Virtex-II architecture are optimized for high speed with low power consumption. Combining a wide variety of flexible features and a large range of densities up to 10 million system gates, the Virtex-II family enhances programmable logic design capabilities and is a powerful alternative to mask-programmed gates arrays.
Applications
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Product Functions
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ECCN / UNSPSC
Description | Value |
USHTS | 8542390001 |
TARIC | 8542399000 |
Schedule B | 8542390000 |
ECCN | 3A991.d |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 796 PCS | Xilinx, Inc. | IC FPGA 456 I/O 676FBGA |
Digi-Key | 0 | Xilinx, Inc. | IC FPGA 456 I/O 676FBGA |
Avnet | - | Xilinx, Inc. | - |
Mouser | 0 | Xilinx, Inc. | FPGA - Field Programmable Gate Array |
Alternative Models
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Popularity by Region
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Market Price Analysis
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