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XC2V2000-4FGG676C Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 27 Jul 2019
 1302
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC2V2000-4FGG676C

Manufacturer Part#:

XC2V2000-4FGG676C

Product Category:

Embedded - FPGAs (Field Programmable Gate Array)

Stock:

Yes

Manufacturer:

Xilinx Inc.

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XC2V2000-4FGG676C

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Description:

IC FPGA 456 I/O 676FBGA

Datasheet:

XC2V2000-4FGG676C Datasheet

Package:

676-BGA

Quantity:

796 PCS

XC2V2000-4FGG676C Images are for reference only.

XC2V2000-4FGG676C 


CAD Models

 XC2V2000-4FGG676C Symbol

XC2V2000-4FGG676C Symbol

XC2V2000-4FGG676C Footprint 

XC2V2000-4FGG676C Footprint


Product Attributes

Manufacturer

Xilinx Inc.

Mfr Package Description

27 X 27 MM, 1 MM PITCH, LEAD FREE, MS-034AAL-1, FBGA-676

Product Category

Embedded - FPGAs (Field Programmable Gate Array)

Series

VirtexR-II

EU RoHS Compliant

Yes

Status

Discontinued

Package-Case

676-BGA

Operating-Temperature

0°C ~ 85°C (TJ)

Mounting-Type

Surface Mount

Supplier-Device-Package

676-FBGA (27x27)

Moisture Sensitivity Level

3

Base Part Number

XC2V2000

Clock Frequency-Max

650.0  MHz

Combinatorial Delay of a CLB-Max

0.44  ns

Distributed RAM

336 kbit

Embedded Block RAM - EBR

1008 kbit

JESD-30 Code

S-PBGA-B676

JESD-609 Code

e1

Mount

Surface Mount

Number of Gates

2000000

Number of I/O

456

Number of Logic Cells

24192

Number of Pins

676

Number of Registers

21504

Number of Terminals

676

Number-of-LABs-CLBs

2688

Number-of-Logic-Elements-Cells

-

Package / Case

676-BGA

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA676,26X26,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Part Status

Obsolete

Peak Reflow Temperature (Cel)

250

Power Supplies

1.5,1.5/3.3,3.3

Qualification Status

Not Qualified

RAM Size

1032192 b

RoHS

Compliant

Seated Height-Max

2.6  mm

Series

Virtex®-II

Speed Grade

4

Subcategory

Programmable Logic ICs

Supplier Device Package

676-FBGA (27x27)

Supply Voltage-Max

1.575  V

Supply Voltage-Min

1.425  V

Supply Voltage-Nom

1.5  V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Form

BALL

Terminal Pitch

1.0  mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Total RAM Bits

1032192

Tradename

Virtex

Length

27.0  mm

Width

27.0  mm


Features

  • Industry First Platform FPGA Solution

  • IP-Immersion Architecture

− Densities from 40K to 8M system gates

− 420 MHz internal clock speed (Advance Data)

− 840+ Mb/s I/O (Advance Data)

  • SelectRAM™ Memory Hierarchy

− 3 Mb of dual-port RAM in 18 Kbit block SelectRAM resources

− Up to 1.5 Mb of distributed SelectRAM resources

  • High-Performance Interfaces to External Memory

− DRAM interfaces

▪ SDR / DDR SDRAM

▪ Network FCRAM

▪ Reduced Latency DRAM

− SRAM interfaces

▪ SDR / DDR SRAM

▪ QDR™ SRAM

− CAM interfaces

  • Arithmetic Functions

− Dedicated 18-bit x 18-bit multiplier blocks

− Fast look-ahead carry logic chains

  • Flexible Logic Resources

− Up to 93,184 internal registers / latches with Clock Enable

− Up to 93,184 look-up tables (LUTs) or cascadable 16-bit shift registers

−  Wide multiplexers and wide-input function support

− Horizontal cascade chain and sum-of-products support

− Internal 3-state bussing

  • High-Performance Clock Management Circuitry

− Up to 12 DCM (Digital Clock Manager) modules

▪ Precise clock de-skew

▪ Flexible frequency synthesis

▪ High-resolution phase shifting

− 16 global clock multiplexer buffers

  • Active Interconnect Technology

− Fourth generation segmented routing structure

− Predictable, fast routing delay, independent of fanout

  • SelectIO™-Ultra Technology

− Up to 1,108 user I/Os

− 19 single-ended and six differential standards

− Programmable sink current (2 mA to 24 mA) per I/O

− Digitally Controlled Impedance (DCI) I/O:on-chip termination resistors for single-ended I/O standards

− PCI-X compatible (133 MHz and 66 MHz) at 3.3V

− PCI compliant (66 MHz and 33 MHz) at 3.3V

− CardBus compliant (33 MHz) at 3.3V

− Differential Signaling

▪ 840 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers

▪ Bus LVDS I/O

▪ Lightning Data Transport (LDT) I/O with current driver buffers

▪ Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O

▪ Built-in DDR input and output registers

− Proprietary high-performance SelectLink Technology

▪ High-bandwidth data path

▪ Double Data Rate (DDR) link

▪ Web-based HDL generation methodology

  • Supported by Xilinx Foundation™ and Alliance Series™ Development Systems

− Integrated VHDL and Verilog design flows

− Compilation of 10M system gates designs

− Internet Team Design (ITD) tool

  • SRAM-Based In-System Configuration

− Fast SelectMAP configuration

− Triple Data Encryption Standard (DES) security option (Bitstream Encryption)

− IEEE 1532 support

− Partial reconfiguration

− Unlimited reprogrammability

− Readback capability

  • 0.15 µm 8-Layer Metal Process with 0.12 µm High-Speed Transistors

  • 1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies

  • IEEE 1149.1 Compatible Boundary-Scan Logic Support

  • Flip-Chip and Wire-Bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm,1.00 mm, and 1.27 mm)

  • Wire-Bond BGA Devices Available in Pb-Free Packaging (www.xilinx.com/pbfree)

  • 100% Factory Tested


Advantages and Disadvantages  

Advantages

The Virtex-II family is a platform FPGA developed for high performance from low-density to high-density designs that are based on IP cores and customized modules. The family delivers complete solutions for telecommunication, wireless, networking, video, and DSP applications, including PCI, LVDS, and DDR interfaces. The leading-edge 0.15 µm / 0.12 µm CMOS 8-layer metal process and the Virtex-II architecture are optimized for high speed with low power consumption. Combining a wide variety of flexible features and a large range of densities up to 10 million system gates, the Virtex-II family enhances programmable logic design capabilities and is a powerful alternative to mask-programmed gates arrays.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

USHTS

8542390001

TARIC

8542399000

Schedule B

8542390000

ECCN

3A991.d


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheet

Virtex-II Platform FPGAs

PCN Design/Specification

FG(G) and BG(G) Wire Bond 25/Jan/2013

PCN Obsolescence/ EOL

Spartan, Virtex, XC17V00 24/Apr/2013

Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

796 PCS

Xilinx, Inc.

IC FPGA 456 I/O 676FBGA

Digi-Key

0

Xilinx, Inc.

IC FPGA 456 I/O 676FBGA

Avnet

-

Xilinx, Inc.

-

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region  

There is no relevant information available for this part yet.


Market Price Analysis  

There is no relevant information available for this part yet.


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