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XC3S100E-4VQG100I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 24 Jul 2019
 1827
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC3S100E-4VQG100I

Manufacturer Part#:

XC3S100E-4VQG100I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 66 I/O 100VQFP

Datasheet:

XC3S100E-4VQG100I Datasheet

Package:

100-TQFP

Quantity:

899 PCS


XC3S100E-4VQG100I Images are for reference only.

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CAD Models

 XC3S100E-4VQG100I Symbol

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XC3S100E-4VQG100I Footprint 

XC3S100E-4VQG100I Footprint


Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Spartan®-3E

Base Part Number

XC3S100E

Package Description

16 X 16 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VQFP-100

REACH Compliant

Yes

EU RoHS Compliant

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Basic Package Type

Ball Grid Array

Contact Plating

Tin/Lead

Clock Frequency-Max

572 MHz

Combinatorial Delay of a CLB-Max

0.76 ns

Distributed RAM  

15 kbit

Device System Gates

100,000

Embedded Block RAM - EBR

72 kbit

In System Programmability

Yes

JESD-30 Code

S-PQFP-G100

JESD-609 Code

e3

Lead Finish

Tin/Lead

Moisture Sensitivity Level

3

Maximum Number of User I/Os

66

Maximum Operating Frequency

300 MHz

Maximum Internal Frequency

572 MHz

Number of Registers

1,920

Number of CLBs

240

Number of Inputs

66

Number of Logic Cells

2,160

Number of Logic Units

2,160

Number of Outputs  

59

Number of Gates

100,000

Number of Terminals

100

Number of Multipliers

4 (18 x 18)

Number of I/O

66

Number of Logic Blocks (LABs)

240

Operating Temperature

-40°C ~ 100°C (TJ)

Organization

240 CLBS, 100000 GATES

Package Body Material

PLASTIC/EPOXY

Package Code

TFQFP

Package Equivalence Code

TQFP100,.63SQ

Product Dimensions

14 x 14 x 1 mm

Package Shape

SQUARE

Pbfree Code

No

Package Style

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Packaging

Tray

Programmability

Yes

Power Supplies

1.2,1.2/3.3,2.5 V

Pin Count

100

PCB

100

Package / Case

100-TQFP

Supplier Device Package

100-VQFP (14x14)

Qualification Status  

Not Qualified

RAM Bits

73,728 b

Rohs Code

No

Risk Rank

1.32

Radiation Hardening

No

Re-programmability Support

1

Seated Height-Max

1.2 mm

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

1.2 V

Supply Voltage-Min

1.14 V

Supply Voltage-Max

1.26 V

Surface Mount  

Yes

Speed Grade

4

Screening Level

Industrial

Typical Operating Supply Voltage

1.2000 V

Technology

CMOS

Terminal Finish

Matte Tin (Sn)

Terminal Form

GULL WING

Terminal Pitch  

0.5 mm

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

30

Height

1 mm

Length

14 mm

Width

14 mm

Tradename

Spartan


Features

  • Very low cost, high-performance logic solution for high-volume, consumer-oriented applications

  • Proven advanced 90-nanometer process technology

  • Multi-voltage, multi-standard SelectIO™ interface pins

  • Up to 376 I/O pins or 156 differential signal pairs

  • LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards

  • 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling

  • 622+ Mb/s data transfer rate per I/O

  • True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O

  • Enhanced Double Data Rate (DDR) support

  • DDR SDRAM support up to 333 Mb/s

  • Abundant, flexible logic resources

  • Densities up to 33,192 logic cells, including optional shift register or distributed RAM support

  • Efficient wide multiplexers, wide logic

  • Fast look-ahead carry logic

  • Enhanced 18 x 18 multipliers with optional pipeline

  • IEEE 1149.1/1532 JTAG programming/debug port

  • Hierarchical SelectRAM™ memory architecture

  • Up to 648 Kbits of fast block RAM

  • Up to 231 Kbits of efficient distributed RAM

  • Up to eight Digital Clock Managers (DCMs)

  • Clock skew elimination (delay locked loop)

  • Frequency synthesis, multiplication, division

  • High-resolution phase shifting

  • Wide frequency range (5 MHz to over 300 MHz)

  • Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing

  • Configuration interface to industry-standard PROMs

  • Low-cost, space-saving SPI serial Flash PROM

  • x8 or x8/x16 parallel NOR Flash PROM

  • Low-cost Xilinx® Platform Flash with JTAG

  • Complete Xilinx ISE® and WebPACK™ software

  • MicroBlaze™ and PicoBlazeä embedded processor cores

  • Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices)

  • Low-cost QFP and BGA packaging options

  • Common footprints support easy density migration

  • Pb-free packaging options


Advantages and Disadvantages

Advantages

The Spartan®-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications.

It builds on the success of the earlier Spartan-3 family by increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features improve system performance and reduce the cost of configuration. These Spartan-3E FPGA enhancements, combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.

Because of their exceptionally low cost, Spartan-3E FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection, and digital television equipment.

It is also a superior alternative to mask programmed ASICs. FPGAs avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

Spartan-3E FPGA Family

Design Resources

Development Tool Selector

PCN Assembly/Origin

Mult Dev LeadFrame Chg 29/Oct/2018

HTML Datasheet

Spartan-3E FPGA Family


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

899 PCS

Xilinx, Inc.

IC FPGA 66 I/O 100VQFP

Digi-Key

Limited Supply

Xilinx, Inc.

IC FPGA 66 I/O 100VQFP

Avnet

Americas - 0

Asia - 0

Xilinx, Inc.

FPGA Spartan-3E Family 100K Gates 2160 Cells 572MHz 90nm (CMOS) Technology 1.2V 100-Pin VTQFP - Trays (Alt: XC3S100E-4VQG100I)

Mouser

180 PCS

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

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Popularity by Region

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Market Price Analysis

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