Product Overview
Kynix Part #: | KY32-XC2V1000-5BG575I |
Manufacturer Part#: | XC2V1000-5BG575I |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC2V1000-5BG575I |
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Description: | IC FPGA 328 I/O 575PBGA |
Datasheet: | XC2V1000-5BG575I Datasheet |
Package: | - |
Quantity: | 84 PCS |
XC2V1000-5BG575I Images are for reference only.
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Manufacturer | Xilinx Inc. |
Series | Virtex®-II |
Base Part Number | XC2V1000 |
Package Description | 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575 |
REACH Compliant | Yes |
Status | Obsolete |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Basic Package Type | Ball Grid Array |
Contact Plating | Tin/Lead |
Clock Frequency-Max | 750 MHz |
Combinatorial Delay of a CLB-Max | 0.39 ns |
Device System Gates | 1,000,000 |
Distributed RAM | 160 kbit |
Embedded Block RAM - EBR | 720 kbit |
In System Programmability | Yes |
JESD-30 Code | S-PBGA-B575 |
JESD-609 Code | e0 |
Lead Finish | Tin/Lead |
Moisture Sensitivity Level | 3 |
Maximum Number of User I/Os | 328 |
Number of Registers | 10,240 |
Number of CLBs | 1,280 |
Number of Inputs | 328 |
Number of Logic Cells | 11,520 |
Number of Logic Units | 11,520 |
Number of Outputs | 328 |
Number of Gates | 1,000,000 |
Number of Terminals | 575 |
Number of I/O | 328 |
Number of Logic Blocks (LABs) | 1,280 |
Operating Temperature | -40°C ~ 100°C (TJ) |
Operating Supply Voltage | 1.5 V |
Organization | 1280 CLBS, 1000000 GATES |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Type | FCBGA |
Package Equivalence Code | BGA575,24X24,50 |
Product Dimensions | 31 x 31 mm |
Package Shape | SQUARE |
Pbfree Code | No |
Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Packaging | Tray |
Programmability | Yes |
Power Supplies | 1.5,1.5/3.3,3.3 V |
Pin Count | 575 |
PCB | 575 |
Package Code | BGA |
Package / Case | 575-BBGA |
Supplier Device Package | 575-BGA (31x31) |
Qualification Status | Not Qualified |
RAM Bits | 737,280 b |
Rohs Code | No |
Risk Rank | 5.86 |
Radiation Hardening | No |
Re-programmability Support | 1 |
Seated Height-Max | 2.6 mm |
Sub Category | Field Programmable Gate Arrays |
Supply Voltage-Nom | 1.5 V |
Supply Voltage-Min | 1.425 V |
Supply Voltage-Max | 1.575 V |
Surface Mount | Yes |
Speed Grade | 5 |
Screening Level | Industrial |
Typical Operating Supply Voltage | 1.5000 V |
Technology | CMOS |
Tradename | Virtex |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Terminal Form | Ball |
Terminal Pitch | 1.27 mm |
Terminal Position | Bottom |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Length | 31 mm |
Width | 31 mm |
Features
Summary of Virtex-II™ Features
• Industry First Platform FPGA Solution
• IP-Immersion Architecture
- Densities from 40K to 8M system gates
- 420 MHz internal clock speed (Advance Data)
- 840+ Mb/s I/O (Advance Data)
• SelectRAM™ Memory Hierarchy
- 3 Mb of dual-port RAM in 18 Kbit block SelectRAM resources
- Up to 1.5 Mb of distributed SelectRAM resources
• High-Performance Interfaces to External Memory
- DRAM interfaces
· SDR / DDR SDRAM
· Network FCRAM
· Reduced Latency DRAM
- SRAM interfaces
· SDR / DDR SRAM
· QDR™ SRAM
- CAM interfaces
• Arithmetic Functions
- Dedicated 18-bit x 18-bit multiplier blocks
- Fast look-ahead carry logic chains
• Flexible Logic Resources
- Up to 93,184 internal registers / latches with Clock Enable
- Up to 93,184 look-up tables (LUTs) or cascadable 16-bit shift registers
- Wide multiplexers and wide-input function support
- Horizontal cascade chain and sum-of-products support
- Internal 3-state bussing
• High-Performance Clock Management Circuitry
- Up to 12 DCM (Digital Clock Manager) modules
· Precise clock de-skew
· Flexible frequency synthesis
· High-resolution phase shifting
- 16 global clock multiplexer buffers
• Active Interconnect Technology
- Fourth generation segmented routing structure
- Predictable, fast routing delay, independent of fanout
• SelectIO™-Ultra Technology
- Up to 1,108 user I/Os
- 19 single-ended and six differential standards
- Programmable sink current (2 mA to 24 mA) per I/O
- Digitally Controlled Impedance (DCI) I/O: on-chip termination resistors for single-ended I/O standards
- PCI-X compatible (133 MHz and 66 MHz) at 3.3V
- PCI compliant (66 MHz and 33 MHz) at 3.3V
- CardBus compliant (33 MHz) at 3.3V
- Differential Signaling
· 840 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers
· Bus LVDS I/O
· Lightning Data Transport (LDT) I/O with current driver buffers
· Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O
· Built-in DDR input and output registers
- Proprietary high-performance SelectLink Technology
· High-bandwidth data path
· Double Data Rate (DDR) link
· Web-based HDL generation methodology
• Supported by Xilinx Foundation™ and Alliance Series™ Development Systems
- Integrated VHDL and Verilog design flows
- Compilation of 10M system gates designs
- Internet Team Design (ITD) tool
• SRAM-Based In-System Configuration
- Fast SelectMAP configuration
- Triple Data Encryption Standard (DES) security option (Bitstream Encryption)
- IEEE 1532 support
- Partial reconfiguration
- Unlimited reprogrammability
- Readback capability
• 0.15 µm 8-Layer Metal Process with 0.12 µm High-Speed Transistors
• 1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies
• IEEE 1149.1 Compatible Boundary-Scan Logic Support
• Flip-Chip and Wire-Bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm, 1.00 mm, and 1.27 mm)
• Wire-Bond BGA Devices Available in Pb-Free Packaging
• 100% Factory Tested
Advantages and Disadvantages
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Product Functions
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ECCN / UNSPSC
Description | Value |
ECCN | 3A991.D |
HTSN | 8542.39.00.01 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliantt |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 84 PCS | Xilinx, Inc. | IC FPGA 328 I/O 575PBGA |
Digi-Key | Limited Supply | Xilinx, Inc. | IC FPGA 328 I/O 575PBGA |
Mouser | 0 | Xilinx, Inc. | FPGA - Field Programmable Gate Array |
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