Home arrow Electronic Components arrow XC2V1000-5BG575I Datasheets| Xilinx Inc.| PDF| Price| In Stock

arrow left

arrow right

XC2V1000-5BG575I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 24 Jul 2019
 1339
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC2V1000-5BG575I

Manufacturer Part#:

XC2V1000-5BG575I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

Click Purchase button to buy original genuine XC2V1000-5BG575I

Purchase 

Description:

IC FPGA 328 I/O 575PBGA

Datasheet:

XC2V1000-5BG575I Datasheet

Package:

-

Quantity:

84 PCS


XC2V1000-5BG575I Images are for reference only.

XC2V1000-5BG575I Image 


CAD Models

XC2V1000-5BG575I Symbol 

XC2V1000-5BG575I Symbol

XC2V1000-5BG575I Footprint 

XC2V1000-5BG575I Footprint


Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Virtex®-II

Base Part Number

XC2V1000

Package Description

31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575

REACH Compliant

Yes

Status

Obsolete

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Basic Package Type

Ball Grid Array

Contact Plating

Tin/Lead

Clock Frequency-Max

750 MHz

Combinatorial Delay of a CLB-Max

0.39 ns

Device System Gates

1,000,000

Distributed RAM

160 kbit

Embedded Block RAM - EBR  

720 kbit

In System Programmability

Yes

JESD-30 Code

S-PBGA-B575

JESD-609 Code

e0

Lead Finish

Tin/Lead

Moisture Sensitivity Level

3

Maximum Number of User I/Os

328

Number of Registers

10,240

Number of CLBs

1,280

Number of Inputs

328

Number of Logic Cells

11,520

Number of Logic Units

11,520

Number of Outputs  

328

Number of Gates

1,000,000

Number of Terminals

575

Number of I/O

328

Number of Logic Blocks (LABs)

1,280

Operating Temperature

-40°C ~ 100°C (TJ)

Operating Supply Voltage

1.5 V

Organization

1280 CLBS, 1000000 GATES

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Type

FCBGA

Package Equivalence Code

BGA575,24X24,50

Product Dimensions

31 x 31 mm

Package Shape

SQUARE

Pbfree Code

No

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Packaging

Tray

Programmability

Yes

Power Supplies

1.5,1.5/3.3,3.3 V

Pin Count

575

PCB

575

Package Code

BGA

Package / Case

575-BBGA

Supplier Device Package

575-BGA (31x31)

Qualification Status  

Not Qualified

RAM Bits

737,280 b

Rohs Code

No

Risk Rank

5.86

Radiation Hardening

No

Re-programmability Support

1

Seated Height-Max

2.6 mm

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

1.5 V

Supply Voltage-Min

1.425 V

Supply Voltage-Max

1.575 V

Surface Mount  

Yes

Speed Grade

5

Screening Level

Industrial

Typical Operating Supply Voltage

1.5000 V

Technology

CMOS

Tradename  

Virtex

Terminal Finish

Tin/Lead (Sn63Pb37)

Terminal Form

Ball

Terminal Pitch  

1.27 mm

Terminal Position

Bottom

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

31 mm

Width

31 mm


Features

Summary of Virtex-II™ Features

• Industry First Platform FPGA Solution

• IP-Immersion Architecture

   - Densities from 40K to 8M system gates

   - 420 MHz internal clock speed (Advance Data)

   - 840+ Mb/s I/O (Advance Data)

• SelectRAM™ Memory Hierarchy

   - 3 Mb of dual-port RAM in 18 Kbit block SelectRAM resources

   - Up to 1.5 Mb of distributed SelectRAM resources

• High-Performance Interfaces to External Memory

   - DRAM interfaces

    · SDR / DDR SDRAM

    · Network FCRAM

    · Reduced Latency DRAM

   - SRAM interfaces

    · SDR / DDR SRAM

    · QDR™ SRAM

   - CAM interfaces

• Arithmetic Functions

   - Dedicated 18-bit x 18-bit multiplier blocks

   - Fast look-ahead carry logic chains

• Flexible Logic Resources

   - Up to 93,184 internal registers / latches with Clock Enable

   - Up to 93,184 look-up tables (LUTs) or cascadable 16-bit shift registers

   - Wide multiplexers and wide-input function support

   - Horizontal cascade chain and sum-of-products support

   - Internal 3-state bussing

• High-Performance Clock Management Circuitry

   - Up to 12 DCM (Digital Clock Manager) modules

    · Precise clock de-skew

    · Flexible frequency synthesis

    · High-resolution phase shifting

   - 16 global clock multiplexer buffers

• Active Interconnect Technology

   - Fourth generation segmented routing structure

   - Predictable, fast routing delay, independent of fanout

• SelectIO™-Ultra Technology

   - Up to 1,108 user I/Os

   - 19 single-ended and six differential standards

   - Programmable sink current (2 mA to 24 mA) per I/O

   - Digitally Controlled Impedance (DCI) I/O: on-chip termination resistors for single-ended I/O standards

   - PCI-X compatible (133 MHz and 66 MHz) at 3.3V

   - PCI compliant (66 MHz and 33 MHz) at 3.3V

   - CardBus compliant (33 MHz) at 3.3V

   - Differential Signaling

    · 840 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers

    · Bus LVDS I/O

    · Lightning Data Transport (LDT) I/O with current driver buffers

    · Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O

    · Built-in DDR input and output registers

   - Proprietary high-performance SelectLink Technology

    · High-bandwidth data path

    · Double Data Rate (DDR) link

    · Web-based HDL generation methodology

• Supported by Xilinx Foundation™ and Alliance Series™ Development Systems

   - Integrated VHDL and Verilog design flows

   - Compilation of 10M system gates designs

   - Internet Team Design (ITD) tool

• SRAM-Based In-System Configuration

   - Fast SelectMAP configuration

   - Triple Data Encryption Standard (DES) security option (Bitstream Encryption)

   - IEEE 1532 support

   - Partial reconfiguration

   - Unlimited reprogrammability

   - Readback capability

• 0.15 µm 8-Layer Metal Process with 0.12 µm High-Speed Transistors

• 1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies

• IEEE 1149.1 Compatible Boundary-Scan Logic Support

• Flip-Chip and Wire-Bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm, 1.00 mm, and 1.27 mm)

• Wire-Bond BGA Devices Available in Pb-Free Packaging

• 100% Factory Tested


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.D

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliantt


Documents & Media

Datasheets

Virtex-II Platform FPGAs

Design Resources

Development Tool Selector

PCN Obsolescence/ EOL

Spartan, Virtex, XC17V00 24/Apr/2013


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

84 PCS

Xilinx, Inc.

IC FPGA 328 I/O 575PBGA

Digi-Key

Limited Supply

Xilinx, Inc.

IC FPGA 328 I/O 575PBGA

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

There is no relevant information available for this part yet.


You May Also Be Interested In

Part Number

Manufacturer

Package

Quantity

Description

XC4VLX100-10FFG1513C

Xilinx Inc.

1513-BBGA, FCBGA

455 PCS

IC FPGA 960 I/O 1513FCBGA

XC3S400A-5FGG400C

Xilinx Inc.

BGA

76 PCS

-

XC4VLX25-11FFG676I

Xilinx Inc.

FBGA

82 PCS

IC FPGA 448 I/O 676FCBGA

XC4VLX15-11FF668I

Xilinx Inc.

BGA

83 PCS

IC FPGA 320 I/O 668FCBGA

XC6SLX16-3FTG256I

Xilinx Inc.

256-LBGA

82 PCS

IC FPGA 186 I/O 256FTBGA

XC6SLX45T-N3FGG484I

Xilinx Inc.

FBGA

82 PCS

IC FPGA 296 I/O 484FBGA



Best Sales of diode

Photo Part Company Description Pricing (USD)

Alternative Models

Part Compare Manufacturers Category Description

Ordering & Quality

Image Mfr. Part # Company Description Package PDF Qty Pricing (USD)

pinglun 0 comment

Leave a Reply

Your email address will not be published.

 
 
   
 
code image
Rating: poor fair good very good excellent

# 0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z