Product Overview
Kynix Part #: | KY32-XC4VFX60-11FFG672I |
Manufacturer Part#: | XC4VFX60-11FFG672I |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC4VFX60-11FFG672I | |
Description: | IC FPGA 352 I/O 672FCBGA |
Datasheet: | XC4VFX60-11FFG672I Datasheet |
Package: | 672-BBGA, FCBGA |
Quantity: | 82 PCS |
XC4VFX60-11FFG672I Images are for reference only.
CAD Models
XC4VFX60-11FFG672I Symbol
XC4VFX60-11FFG672I Footprint
Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Series | Virtex®-4 FX |
Part Status | Active |
Base Part Number | XC4VFX60 |
Package Description | LEAD FREE, FBGA-672 |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
Clock Frequency-Max | 1,181 MHz |
Data Rate | 6.5 Gb/s |
Distributed RAM | 395 kbit |
Ethernet MACs | 4 |
Embedded Block RAM - EBR | 4176 kbit |
JESD-30 Code | S-PBGA-B672 |
JESD-609 Code | e1 |
Lead Finish | Tin/Silver/Copper |
Manufacturer | Xilinx Inc. |
Max Processing Temp | 245 |
Maximum Operating Frequency | 500 MHz |
Maximum Number of User I/Os | 352 |
Maximum Operating Supply Voltage | 1.26 V |
Minimum Operating Supply Voltage | 1.14 V |
Mounting | Surface Mount |
Number of LABs/CLBs | 6,320 |
Number of Logic Elements/Cells | 56,880 |
Number of I/O | 352 |
Number of Transceivers | 16 |
Number of Inputs | 352 |
Number of Outputs | 352 |
Operating Temperature | -40°C ~ 100°C (TJ) |
Organization | 6,320 CLBS |
Pin Count | 672 |
PCB | 672 |
Package Shape | SQUARE |
Package Equivalence Code | BGA672,26X26,40 |
Package Style | GRID ARRAY |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Process Technology | 90 nm |
Processor Blocks | 2 |
Product Dimensions | 27 x 27 x 2.4 mm |
Programmability | No |
Program Memory Type | SRAM |
Package / Case | 672-BBGA, FCBGA |
Package Body Material | PLASTIC/EPOXY |
Peak Reflow Temperature (Cel) | 245 |
Pin Count | 672 |
Pbfree Code | Yes |
Supplier Device Package | 672-FCBGA (27x27) |
RAM Bits | 4,276,224 Bit |
Risk Rank | 5.19 |
Rohs Code | Yes |
Reflow Solder Time (Sec) | 30 |
Re-programmability Support | No |
Screening Level | Commercial |
Speed Grade | 11 |
Seated Height-Max | 3 mm |
Width | 27 mm |
Length | 27 mm |
Terminal Pitch | 1 mm |
Transceiver Blocks | 16 |
Technology | CMOS |
Transceiver Speed | 6.5Gbps |
Total Number of Block RAM | 232 |
Terminal Base Material | CuNi |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Terminal Form | BALL |
Terminal Position | BOTTOM |
Typical Operating Supply Voltage | 1.2000 V |
Features
lHigh-performance, full-featured solution for embedded platform applications
lXesium™ Clock Technology
Digital clock manager (DCM) blocks
Additional phase-matched clock dividers (PMCD)
Differential global clocks
lXtremeDSP™ Slice
18 x 18, two's complement, signed Multiplier
Optional pipeline stages
Built-in Accumulator (48-bit) and Adder/Subtracter
lSmart RAM Memory Hierarchy
Distributed RAM
Dual-port 18-Kbit RAM blocks · Optional pipeline stages · Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals
High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.
lSelectIO™ Technology
1.5V to 3.3V I/O operation
Built-in ChipSync™ source-synchronous technology
Digitally controlled impedance (DCI) active termination
Fine grained I/O banking (configuration in one bank)
lFlexible Logic Resources
lSecure Chip AES Bitstream Encryption
l90 nm Copper CMOS Process
l1.2V Core Voltage
lFlip-Chip Packaging including Pb-Free Package Choices
lRocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit Transceiver (MGT) [FX only]
lIBM PowerPC RISC Processor Core [FX only]
PowerPC 405 (PPC405) Core
Auxiliary Processor Unit Interface (User Coprocessor)
lMultiple Tri-Mode Ethernet MACs [FX only]
Advantages and Disadvantages
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Applications
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Product Functions
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ECCN / UNSPSC
Description | Value |
ECCN | 3A991.D |
HTSN | 8542.39.00.01 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Lead Free Status | Lead free |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 82 PCS | Xilinx, Inc. | IC FPGA 352 I/O 672FCBGA |
Digi-Key | Limited Supply | Xilinx, Inc. | IC FPGA 352 I/O 672FCBGA |
Avnet | Americas - 0 Europe - 0 | Xilinx, Inc. | FPGA Virtex-4 FX Family 56880 Cells 90nm (CMOS) Technology 1.2V 672-Pin FCBGA (Alt: XC4VFX60-11FFG672I) |
Mouser | 0 | Xilinx, Inc. | FPGA - Field Programmable Gate Array |
Alternative Models
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Popularity by Region
XC4VFX60-11FFG672I Popularity by Region
Market Price Analysis
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