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XC4VFX60-11FFG672I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 23 Jul 2019
 1219
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC4VFX60-11FFG672I

Manufacturer Part#:

XC4VFX60-11FFG672I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 352 I/O 672FCBGA

Datasheet:

XC4VFX60-11FFG672I Datasheet

Package:

672-BBGA, FCBGA

Quantity:

82 PCS


XC4VFX60-11FFG672I Images are for reference only.

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CAD Models

XC4VFX60-11FFG672I Symbol 

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Series

Virtex®-4 FX

Part Status

Active

Base Part Number

XC4VFX60

Package Description

LEAD FREE, FBGA-672

REACH Compliant

Yes

EU RoHS Compliant

Yes

Clock Frequency-Max

1,181 MHz

Data Rate     

6.5 Gb/s

Distributed RAM

395 kbit

Ethernet MACs

4

Embedded Block RAM - EBR

4176 kbit

JESD-30 Code

S-PBGA-B672

JESD-609 Code

e1

Lead Finish

Tin/Silver/Copper

Manufacturer

Xilinx Inc.

Max Processing Temp

245

Maximum Operating Frequency

500 MHz

Maximum Number of User I/Os

352

Maximum Operating Supply Voltage

1.26 V

Minimum Operating Supply Voltage

1.14 V

Mounting

Surface Mount

Number of LABs/CLBs

6,320

Number of Logic Elements/Cells

56,880

Number of I/O

352

Number of Transceivers  

16

Number of Inputs

352

Number of Outputs

352

Operating Temperature

-40°C ~ 100°C (TJ)

Organization

6,320 CLBS

Pin Count

672

PCB

672

Package Shape

SQUARE

Package Equivalence Code

BGA672,26X26,40

Package Style

GRID ARRAY

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Process Technology  

90 nm

Processor Blocks  

2

Product Dimensions

27 x 27 x 2.4 mm

Programmability   

No

Program Memory Type  

SRAM

Package / Case

672-BBGA, FCBGA

Package Body Material

PLASTIC/EPOXY

Peak Reflow Temperature (Cel)

245

Pin Count

672

Pbfree Code

Yes

Supplier Device Package

672-FCBGA (27x27)

RAM Bits

4,276,224 Bit

Risk Rank

5.19

Rohs Code

Yes

Reflow Solder Time (Sec)

30

Re-programmability Support

No

Screening Level

Commercial

Speed Grade

11

Seated Height-Max

3 mm

Width

27 mm

Length

27 mm

Terminal Pitch

1 mm

Transceiver Blocks  

16

Technology

CMOS

Transceiver Speed  

6.5Gbps

Total Number of Block RAM

232

Terminal Base Material  

CuNi

Terminal Finish

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Time@Peak Reflow Temperature-Max (s)

30

Terminal Form

BALL

Terminal Position

BOTTOM

Typical Operating Supply Voltage

1.2000 V


Features

lHigh-performance, full-featured solution for embedded platform applications

lXesium™ Clock Technology

    Digital clock manager (DCM) blocks

    Additional phase-matched clock dividers (PMCD)

    Differential global clocks

lXtremeDSP™ Slice

    18 x 18, two's complement, signed Multiplier

    Optional pipeline stages

    Built-in Accumulator (48-bit) and Adder/Subtracter

lSmart RAM Memory Hierarchy

    Distributed RAM

    Dual-port 18-Kbit RAM blocks · Optional pipeline stages · Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals

    High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.

lSelectIO™ Technology

    1.5V to 3.3V I/O operation

    Built-in ChipSync™ source-synchronous technology

    Digitally controlled impedance (DCI) active termination

    Fine grained I/O banking (configuration in one bank)

lFlexible Logic Resources

lSecure Chip AES Bitstream Encryption

l90 nm Copper CMOS Process

l1.2V Core Voltage

lFlip-Chip Packaging including Pb-Free Package Choices

lRocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit Transceiver (MGT) [FX only]

lIBM PowerPC RISC Processor Core [FX only]

    PowerPC 405 (PPC405) Core

    Auxiliary Processor Unit Interface (User Coprocessor)

lMultiple Tri-Mode Ethernet MACs [FX only]


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.D

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status

Lead free


Documents & Media

Datasheets

Virtex-4 Family Overview

Virtex-4 FPGA User Guide

PCN Design/Specification

Substrate BallPad Metal Change 8/Feb/2016


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

82 PCS

Xilinx, Inc.

IC FPGA 352 I/O 672FCBGA

Digi-Key

Limited Supply

Xilinx, Inc.

IC FPGA 352 I/O 672FCBGA

Avnet

Americas - 0

Europe - 0

Xilinx, Inc.

FPGA Virtex-4 FX Family 56880 Cells 90nm (CMOS) Technology 1.2V 672-Pin FCBGA (Alt: XC4VFX60-11FFG672I)

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC4VFX60-11FFG672I Popularity by Region 

XC4VFX60-11FFG672I Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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