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XC3S1000-5FGG676C Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 17 Jul 2019
 1183
IC Chips

Product Overview

Kynix Part#:

KY32-XC3S1000-5FGG676C

Manufacturer Part#:

XC3S1000-5FGG676C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

Click Purchase button to buy original genuine

XC3S1000-5FGG676C

purchase

Description:

IC FPGA 391 I/O 676FBGA

Datasheet:

XC3S1000-5FGG676C Datasheet

Package:

BGA

Quantity:

278 PCS


XC3S1000-5FGG676C Images are for reference only:

XC3S1000-5FGG676C


CAD Models

XC3S1000-5FGG676C Symbol

XC3S1000-5FGG676C Symbol

XC3S1000-5FGG676C Footprint

XC3S1000-5FGG676C Footprint


Product Attributes

Manufacturer:

Xilinx Inc.

Product Category:

IC Chips

Status:

Active

Series:

Spartan®-3

Clock Frequency-Max:

725.0 MHz

Combinatorial Delay of a CLB-Max:

0.53 ns

Distributed RAM:

120 kbit

Device Logic Cells:

17280

Device Logic Units:

17280

Device Logic Gates:

1000000

Device System Gates:

1000000

EU RoHS Compliant

Yes

Embedded Block RAM - EBR:

432 kbit

In System Programmability:

Yes

.JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Length:

27.0 mm

Lead Finish:

Tin/Silver/Copper

Mounting Type:

Surface Mount

Mounting Style:

SMD/SMT

Maximum Internal Frequency:

725 MHz

Maximum Operating Frequency:

280 MHz

Number of I/O:

391

Number of Pins:

676

Number of CLBs:

1920.0

Number of Inputs:

391.0

Number of Outputs:

391.0

Number of Terminals:

676

Number of Logic Cells:

17280.0

Number of Equivalent Gates:

1000000.0

Organization:

1920 CLBS, 1000000 GATES

Operating Temperature-Min:

0.0 °C

Operating Temperature-Max:

85.0 °C

Pin Count:

676

Product Type:

FPGA - Field Programmable Gate Array

Power Supplies:

1.2,1.2/3.3,2.5

Package / Case:

676-BGA

Package Code:

BGA

Package Style:

GRID ARRAY

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA676,26X26,40

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Peak Reflow Temperature:

250.0 °C

RAM Bits:

442,368 Bit

REACH Compliant:

Yes

Re-programmability Support:

Yes

Speed Grade:

5

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Screening Level:

Commercial

Seated Height-Max:

2.6 mm

Supply Voltage-Nom:

1.2 V

Supply Voltage-Min:

1.14 V

Supply Voltage-Max:

1.26 V

Supplier Device Package:

676-FBGA (27x27)

Tradename:

Spartan

Technology:

CMOS

Total RAM Bits:

442368

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Position:

BOTTOM

Temperature Grade:

OTHER

Time@Peak Reflow Temperature-Max:

30 s

Voltage - Supply:

1.14 V ~ 1.26 V

Width:

27.0 mm


Product Features

• Low-cost, high-performance logic solution for high-volume, consumer-oriented applications

— Densities up to 74,880 logic cells

• SelectIO™ interface signaling

— Up to 633 I/O pins

— 622+ Mb/s data transfer rate per I/O

— 18 single-ended signal standards

— 8 differential I/O standards including LVDS, RSDS

— Termination by Digitally Controlled Impedance

— Signal swing ranging from 1.14V to 3.465V

— Double Data Rate (DDR) support

— DDR, DDR2 SDRAM support up to 333 Mb/s

• Logic resources

— Abundant logic cells with shift register capability

— Wide, fast multiplexers

— Fast look-ahead carry logic

— Dedicated 18 x 18 multipliers

— JTAG logic compatible with IEEE 1149.1/1532

• SelectRAM™ hierarchical memory

— Up to 1,872 Kbits of total block RAM

— Up to 520 Kbits of total distributed RAM

• Digital Clock Manager (up to four DCMs)

— Clock skew elimination

— Frequency synthesis

— High resolution phase shifting

• Eight global clock lines and abundant routing

• Fully supported by Xilinx ISE® and WebPACK™ software development systems

• MicroBlaze™ and PicoBlaze™ processor, PCI®, PCI Express® PIPE Endpoint, and other IP cores

• Pb-free packaging options

• Automotive Spartan-3 XA Family variant


Product Functions

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

3A991D

HTSN:

8542390001"8542.39.00.01

SCHEDULE B:

8542390000"8542.39.00.00


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

RoHS:

Compliant

USHTS:

8542390001

TARIC:

8542399000


Documents & Media

Datasheet

Spartan-3 FPGA

XC3S1000(L) FPGA Errata

Spartan-3/3A/3E FPGA User Guide

PCN Design/Specification

FG(G) and BG(G) Wire Bond 25/Jan/2013


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

278

Xilinx Inc.

IC FPGA 391 I/O 676FBGA

DigiKey

0

Xilinx Inc.

IC FPGA 391 I/O 676FBGA

Mouser

40

Xilinx

FPGA - Field Programmable Gate Array 1000000 SYSTEM GATE 1.2 VOLT FPGA


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC3S1000-5FGG676C Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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