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XC3S200AN-4FT256I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 16 Jul 2019
 1569
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC3S200AN-4FT256I

Manufacturer Part#:

XC3S200AN-4FT256I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 195 I/O 256FTBGA

Datasheet:

XC3S200AN-4FT256I Datasheet

Package:

BGA

Quantity:

79 PCS


XC3S200AN-4FT256I Images are for reference only.

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Spartan®-3AN

Base Part Number

XC3S200AN

Package Description

17 X 17 MM, FTBGA-256

REACH Compliant

Yes

Ethernet

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

280 MHz

Contact Plating

Matte Tin (Sn)

Combinatorial Delay of a CLB-Max

4.97 ns

Clock Management

DLL

Dedicated DSP

Yes

Distributed RAM    

28 kbit

Embedded Block RAM - EBR

288 kbit

In System Programmability

Yes

JESD-30 Code

S-PBGA-B256

JESD-609 Code

e0

Lead Finish

Tin/Lead

Moisture Sensitivity Level

3

Maximum Number of User I/Os

195

Max Processing Temp

240

Number of CLBs

448

Number of Multipliers

3 (18 x 18)

Number of Inputs

195

Number of Logic Cells

4,032

Number of Logic Units

4,032

Number of Outputs  

160

Number of Terminals

256

Number of Gates   

20,0000

Number of I/O

108

Number of Macrocells  

1,584

Number of Logic Blocks (LABs)

448

Operating Temperature

-40°C ~ 100°C (TJ)

Organization

448 CLBS, 200000 GATES

Package Body Material

PLASTIC/EPOXY

Package Code

LBGA

Package Equivalence Code

BGA256,16X16,40

Package Shape

SQUARE

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

240

Power Supplies

1.2,1.2/3.3,3.3 V

Product Dimensions

17 x 17 x 1 mm

Pin Count

256

Pbfree Code

No

PCB

256

Packaging

Tray

Package / Case

256-LBGA

Supplier Device Package

256-FTBGA (17x17)

Qualification Status  

Not Qualified

RAM Bits

294,912 b

Rohs Code

No

Risk Rank

5.06

Re-programmability Support

1

Radiation Hardening

No

Seated Height-Max

1.55 mm

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

3.0 V

Supply Voltage-Min

3.3 V

Supply Voltage-Max

3.6 V

Surface Mount  

Yes

Speed Grade

4

Screening Level

Industrial

Typical Operating Supply Voltage

1.2000 V

Technology

CMOS

Tradename  

Spartan

Termination

SMD/SMT

Temperature Grade

Industrial

Terminal Form

Ball

Terminal Pitch  

1.0 mm

Terminal Position

Bottom

Terminal Finish

Tin/Lead (Sn63Pb37)

Time@Peak Reflow Temperature-Max (s)

30

Height

1.45 mm

Length

17 mm

Width

17 mm


Features

The new standard for low cost nonvolatile FPGA solutions

  • Eliminates traditional nonvolatile FPGA limitations with the advanced 90 nm Spartan-3A device feature set

  • Memory, multipliers, DCMs, SelectIO, hot swap, power management, etc.

  • Integrated robust configuration memory

  • Saves board space

  • Improves ease-of-use

  • Simplifies design

  • Reduces support issues

  • Plentiful amounts of nonvolatile memory available to the user

  • Up to 11+ Mb available

  • MultiBoot support

  • Embedded processing and code shadowing

  • Scratchpad memory

  • Robust 100K Flash memory program/erase cycles

  • 20 years Flash memory data retention

  • Security features provide bitstream anti-cloning protection

  • Buried configuration interface

  • Unique Device DNA serial number in each device for design Authentication to prevent unauthorized copying

  • Flash memory sector protection and lockdown

  • Configuration watchdog timer automatically recovers from configuration errors

  • Suspend mode reduces system power consumption

  • Retains all design state and FPGA configuration data

  • Fast response time, typically less than 100 μs

  • Full hot-swap compliance

  • Multi-voltage, multi-standard SelectIO™ interface pins

  • Up to 502 I/O pins or 227 differential signal pairs

  • LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards

  • 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling

  • Up to 24 mA output drive

  • 3.3V ±10% compatibility and hot swap compliance

  • 622+ Mb/s data transfer rate per I/O

  • DDR/DDR2 SDRAM support up to 400 Mb/s

  • LVDS, RSDS, mini-LVDS, PPDS, and HSTL/SSTL differential I/O

  • Abundant, flexible logic resources

  • Densities up to 25,344 logic cells

  • Optional shift register or distributed RAM support

  • Enhanced 18 x 18 multipliers with optional pipeline

  • Hierarchical SelectRAM™ memory architecture

  • Up to 576 Kbits of dedicated block RAM

  • Up to 176 Kbits of efficient distributed RAM

  • Up to eight Digital Clock Managers (DCMs)

  • Eight global clocks and eight additional clocks per each half of device, plus abundant low-skew routing

  • Complete Xilinx® ISE® and WebPACK™ software development system support

  • MicroBlaze™ and PicoBlazeä embedded processor cores

  • Fully compliant 32-/64-bit 33 MHz PCI™ technology support

  • Low-cost QFP and BGA Pb-free (RoHS) packaging options

  • Pin-compatible with the same packages in the Spartan-3A FPGA family


Advantages and Disadvantages

Advantages

The Spartan®-3AN FPGA family combines the best attributes of a leading edge, low cost FPGA with nonvolatile technology across a broad range of densities. The family combines all the features of the Spartan-3A FPGA family plus leading technology in-system Flash memory for configuration and nonvolatile data storage.

The Spartan-3AN FPGA internal configuration interface is completely self-contained, increasing design security. The family maintains full support for external configuration. The Spartan-3AN FPGA is the world’s first nonvolatile FPGA with MultiBoot, supporting two or more configuration files in one device, allowing alternative configurations for field upgrades, test modes, or multiple system configurations.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant


Documents & Media

Datasheets

Spartan-3AN FPGA Datasheet

Design Resources

Development Tool Selector

PCN Other

Wafer Fab Transfer/Copper Wire 05/May/2014

HTML Datasheet

Spartan-3AN FPGA Datasheet


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

79 PCS

Xilinx, Inc.

IC FPGA 195 I/O 256FTBGA

Digi-Key

Limited Supply

Xilinx, Inc.

IC FPGA 195 I/O 256FTBGA

Avnet

Americas - 0

Europe - 0

Asia - 0

Xilinx, Inc.

FPGA Spartan-3AN Family 200K Gates 4032 Cells 667MHz 90nm Technology 1.2V 256-Pin FTBGA (Alt: XC3S200AN-4FT256I)

Mouser

180 PCS

Xilinx, Inc.

FPGA - Field Programmable Gate Array Connect EBOM


Alternative Models

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Popularity by Region

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Market Price Analysis

There is no relevant information available for this part yet.


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