Product Overview
Kynix Part #: | KY32-XC3S200AN-4FT256I |
Manufacturer Part#: | XC3S200AN-4FT256I |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC3S200AN-4FT256I | |
Description: | IC FPGA 195 I/O 256FTBGA |
Datasheet: | XC3S200AN-4FT256I Datasheet |
Package: | BGA |
Quantity: | 79 PCS |
XC3S200AN-4FT256I Images are for reference only.
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Manufacturer | Xilinx Inc. |
Series | Spartan®-3AN |
Base Part Number | XC3S200AN |
Package Description | 17 X 17 MM, FTBGA-256 |
REACH Compliant | Yes |
Ethernet | Yes |
Status | Active |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Clock Frequency-Max | 280 MHz |
Contact Plating | Matte Tin (Sn) |
Combinatorial Delay of a CLB-Max | 4.97 ns |
Clock Management | DLL |
Dedicated DSP | Yes |
Distributed RAM | 28 kbit |
Embedded Block RAM - EBR | 288 kbit |
In System Programmability | Yes |
JESD-30 Code | S-PBGA-B256 |
JESD-609 Code | e0 |
Lead Finish | Tin/Lead |
Moisture Sensitivity Level | 3 |
Maximum Number of User I/Os | 195 |
Max Processing Temp | 240 |
Number of CLBs | 448 |
Number of Multipliers | 3 (18 x 18) |
Number of Inputs | 195 |
Number of Logic Cells | 4,032 |
Number of Logic Units | 4,032 |
Number of Outputs | 160 |
Number of Terminals | 256 |
Number of Gates | 20,0000 |
Number of I/O | 108 |
Number of Macrocells | 1,584 |
Number of Logic Blocks (LABs) | 448 |
Operating Temperature | -40°C ~ 100°C (TJ) |
Organization | 448 CLBS, 200000 GATES |
Package Body Material | PLASTIC/EPOXY |
Package Code | LBGA |
Package Equivalence Code | BGA256,16X16,40 |
Package Shape | SQUARE |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | 240 |
Power Supplies | 1.2,1.2/3.3,3.3 V |
Product Dimensions | 17 x 17 x 1 mm |
Pin Count | 256 |
Pbfree Code | No |
PCB | 256 |
Packaging | Tray |
Package / Case | 256-LBGA |
Supplier Device Package | 256-FTBGA (17x17) |
Qualification Status | Not Qualified |
RAM Bits | 294,912 b |
Rohs Code | No |
Risk Rank | 5.06 |
Re-programmability Support | 1 |
Radiation Hardening | No |
Seated Height-Max | 1.55 mm |
Sub Category | Field Programmable Gate Arrays |
Supply Voltage-Nom | 3.0 V |
Supply Voltage-Min | 3.3 V |
Supply Voltage-Max | 3.6 V |
Surface Mount | Yes |
Speed Grade | 4 |
Screening Level | Industrial |
Typical Operating Supply Voltage | 1.2000 V |
Technology | CMOS |
Tradename | Spartan |
Termination | SMD/SMT |
Temperature Grade | Industrial |
Terminal Form | Ball |
Terminal Pitch | 1.0 mm |
Terminal Position | Bottom |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Height | 1.45 mm |
Length | 17 mm |
Width | 17 mm |
Features
The new standard for low cost nonvolatile FPGA solutions
Eliminates traditional nonvolatile FPGA limitations with the advanced 90 nm Spartan-3A device feature set
Memory, multipliers, DCMs, SelectIO, hot swap, power management, etc.
Integrated robust configuration memory
Saves board space
Improves ease-of-use
Simplifies design
Reduces support issues
Plentiful amounts of nonvolatile memory available to the user
Up to 11+ Mb available
MultiBoot support
Embedded processing and code shadowing
Scratchpad memory
Robust 100K Flash memory program/erase cycles
20 years Flash memory data retention
Security features provide bitstream anti-cloning protection
Buried configuration interface
Unique Device DNA serial number in each device for design Authentication to prevent unauthorized copying
Flash memory sector protection and lockdown
Configuration watchdog timer automatically recovers from configuration errors
Suspend mode reduces system power consumption
Retains all design state and FPGA configuration data
Fast response time, typically less than 100 μs
Full hot-swap compliance
Multi-voltage, multi-standard SelectIO™ interface pins
Up to 502 I/O pins or 227 differential signal pairs
LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
Up to 24 mA output drive
3.3V ±10% compatibility and hot swap compliance
622+ Mb/s data transfer rate per I/O
DDR/DDR2 SDRAM support up to 400 Mb/s
LVDS, RSDS, mini-LVDS, PPDS, and HSTL/SSTL differential I/O
Abundant, flexible logic resources
Densities up to 25,344 logic cells
Optional shift register or distributed RAM support
Enhanced 18 x 18 multipliers with optional pipeline
Hierarchical SelectRAM™ memory architecture
Up to 576 Kbits of dedicated block RAM
Up to 176 Kbits of efficient distributed RAM
Up to eight Digital Clock Managers (DCMs)
Eight global clocks and eight additional clocks per each half of device, plus abundant low-skew routing
Complete Xilinx® ISE® and WebPACK™ software development system support
MicroBlaze™ and PicoBlazeä embedded processor cores
Fully compliant 32-/64-bit 33 MHz PCI™ technology support
Low-cost QFP and BGA Pb-free (RoHS) packaging options
Pin-compatible with the same packages in the Spartan-3A FPGA family
Advantages and Disadvantages
Advantages
The Spartan®-3AN FPGA family combines the best attributes of a leading edge, low cost FPGA with nonvolatile technology across a broad range of densities. The family combines all the features of the Spartan-3A FPGA family plus leading technology in-system Flash memory for configuration and nonvolatile data storage.
The Spartan-3AN FPGA internal configuration interface is completely self-contained, increasing design security. The family maintains full support for external configuration. The Spartan-3AN FPGA is the world’s first nonvolatile FPGA with MultiBoot, supporting two or more configuration files in one device, allowing alternative configurations for field upgrades, test modes, or multiple system configurations.
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ECCN / UNSPSC
Description | Value |
ECCN | EAR99 |
HTSN | 8542.39.00.01 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 79 PCS | Xilinx, Inc. | IC FPGA 195 I/O 256FTBGA |
Digi-Key | Limited Supply | Xilinx, Inc. | IC FPGA 195 I/O 256FTBGA |
Avnet | Americas - 0 Europe - 0 Asia - 0 | Xilinx, Inc. | FPGA Spartan-3AN Family 200K Gates 4032 Cells 667MHz 90nm Technology 1.2V 256-Pin FTBGA (Alt: XC3S200AN-4FT256I) |
Mouser | 180 PCS | Xilinx, Inc. | FPGA - Field Programmable Gate Array Connect EBOM |
Alternative Models
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