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XC2V2000-4BG575I Datasheets| XILINX| PDF| Price| In Stock

Author: Apogeeweb Date: 16 Jul 2019  475

IC Chips

Product Overview

Kynix Part#:

KY32-XC2V2000-4BG575I

Manufacturer Part#:

XC2V2000-4BG575I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

Click Purchase button to buy original genuine

XC2V2000-4BG575I

purchase

Description:

-

Datasheet:

XC2V2000-4BG575I Datasheet

Package:

BGA575

Quantity:

276 PCS


XC2V2000-4BG575I Images are for reference only:

XC2V2000-4BG575I


CAD Models

XC2V2000-4BG575I Symbol

XC2V2000-4BG575I Symbol

XC2V2000-4BG575I Footprint

XC2V2000-4BG575I Footprint


Product Attributes

Manufacturer:

XILINX

Product Category:

IC Chips

Series:

Virtex®-II

Clock Frequency-Max:

650.0 MHz

Combinatorial Delay of a CLB-Max:

0.44 ns

Distributed RAM:

336 kbit

Embedded Block RAM - EBR:

1008 kbit

.JESD-30 Code:

S-PBGA-B575

JESD-609 Code:

e0

Length:

31.0 mm

Mounting Type:

Surface Mount

Mounting Style:

SMD/SMT

Number of I/O:

408

Number of Pins:

575

Number of CLBs:

2688.0

Number of Inputs:

408.0

Number of Outputs:

408.0

Number of Terminals:

575

Number of Registers:

21504

Number of Logic Cells:

24192

Number of Equivalent Gates:

2000000.0

Organization:

2688 CLBS, 2000000 GATES

Operating Temperature-Min:

-40.0 °C

Operating Temperature-Max:

100.0 °C

Product Type:

FPGA - Field Programmable Gate Array

Power Supplies:

1.5,1.5/3.3,3.3

Package / Case:

575-BBGA

Package Code:

BGA

Package Style:

GRID ARRAY

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA575,24X24,50

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Peak Reflow Temperature:

225.0 °C

RAM Bits:

1,032,192 Bit

REACH Compliant:

Yes

Speed Grade:

4

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Seated Height-Max:

2.6 mm

Supply Voltage-Nom:

1.5 V

Supply Voltage-Min:

1.425 V

Supply Voltage-Max:

1.575 V

Supplier Device Package:

575-BGA (31x31)

Tradename:

Virtex

Technology:

CMOS

Total RAM Bits:

1032192

Terminal Form:

BALL

Terminal Pitch:

1.27 mm

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max:

30 s

Voltage - Supply:

1.425 V ~ 1.575 V

Width:

31.0 mm


Product Features

• Industry First Platform FPGA Solution

• IP-Immersion Architecture

- Densities from 40K to 8M system gates

- 420 MHz internal clock speed (Advance Data)

- 840+ Mb/s I/O (Advance Data)

• SelectRAM™ Memory Hierarchy

- 3 Mb of dual-port RAM in 18 Kbit block SelectRAM resources

- Up to 1.5 Mb of distributed SelectRAM resources

• High-Performance Interfaces to External Memory

- DRAM interfaces

· SDR / DDR SDRAM

· Network FCRAM

· Reduced Latency DRAM

- SRAM interfaces

· SDR / DDR SRAM

· QDR™ SRAM

- CAM interfaces

• Arithmetic Functions

- Dedicated 18-bit x 18-bit multiplier blocks

- Fast look-ahead carry logic chains

• Flexible Logic Resources

- Up to 93,184 internal registers / latches with Clock Enable

- Up to 93,184 look-up tables (LUTs) or cascadable 16-bit shift registers

- Wide multiplexers and wide-input function support

- Horizontal cascade chain and sum-of-products support

- Internal 3-state bussing

• High-Performance Clock Management Circuitry

- Up to 12 DCM (Digital Clock Manager) modules

· Precise clock de-skew

· Flexible frequency synthesis

· High-resolution phase shifting

- 16 global clock multiplexer buffers

• Active Interconnect Technology

- Fourth generation segmented routing structure

- Predictable, fast routing delay, independent of fanout

• SelectIO™-Ultra Technology

- Up to 1,108 user I/Os

- 19 single-ended and six differential standards

- Programmable sink current (2 mA to 24 mA) per I/O

- Digitally Controlled Impedance (DCI) I/O: on-chip termination resistors for single-ended I/O standards

- PCI-X compatible (133 MHz and 66 MHz) at 3.3V

- PCI compliant (66 MHz and 33 MHz) at 3.3V

- CardBus compliant (33 MHz) at 3.3V

- Differential Signaling

· 840 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers

· Bus LVDS I/O

· Lightning Data Transport (LDT) I/O with current driver buffers

· Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O

· Built-in DDR input and output registers

- Proprietary high-performance SelectLink Technology

· High-bandwidth data path

· Double Data Rate (DDR) link

· Web-based HDL generation methodology

• Supported by Xilinx Foundation™ and Alliance Series™ Development Systems

- Integrated VHDL and Verilog design flows

- Compilation of 10M system gates designs

- Internet Team Design (ITD) tool

• SRAM-Based In-System Configuration

- Fast SelectMAP configuration

- Triple Data Encryption Standard (DES) security option (Bitstream Encryption)

- IEEE 1532 support

- Partial reconfiguration

- Unlimited reprogrammability

- Readback capability

• 0.15 µm 8-Layer Metal Process with 0.12 µm High-Speed Transistors

• 1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies

• IEEE 1149.1 Compatible Boundary-Scan Logic Support

• Flip-Chip and Wire-Bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm, 1.00 mm, and 1.27 mm)

• Wire-Bond BGA Devices Available in Pb-Free Packaging (www.xilinx.com/pbfree)

• 100% Factory Tested


Product Functions

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

EAR99

HTSN:

8542390001"8542.39.00.01

SCHEDULE B:

8542390000"8542.39.00.00


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

RoHS:

Non-Compliant

USHTS:

8542390001

TARIC:

8542399000

Radiation Hardening:

No


Documents & Media

Datasheet

Virtex-II Platform FPGAs

PCN Obsolescence/ EOL

Spartan, Virtex, XC17V00 24/Apr/2013


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

69

XILINX

-

DigiKey

0

Xilinx Inc.

IC FPGA 408 I/O 575BGA

Mouser

0

Xilinx

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC2V2000-4BG575I Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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