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XC5VLX85-2FFG676I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 9 Jul 2019
 1465
IC Chips

Product Overview

Kynix Part#:

KY32-XC5VLX85-2FFG676I

Manufacturer Part#:

XC5VLX85-2FFG676I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

Click Purchase button to buy original genuine

XC5VLX85-2FFG676I

purchase

Description:

IC FPGA 440 I/O 676FCBGA

Datasheet:

XC5VLX85-2FFG676I Datasheet

Package:

BGA-676

Quantity:

262 PCS


XC5VLX85-2FFG676I Images are for reference only:

XC5VLX85-2FFG676I


CAD Models

XC5VLX85-2FFG676I Symbol

XC5VLX85-2FFG676I Symbol

XC5VLX85-2FFG676I Footprint

XC5VLX85-2FFG676I Footprint


Product Attributes

Manufacturer:

Xilinx Inc.

Product Category:

IC Chips

Status:

Active

Series:

Virtex®-5 LX

Clock Frequency-Max:

1265.0 MHz

Distributed RAM:

840 kbit

Device Logic Cells:

82944

Device Logic Units:

82944

EU RoHS Compliant:

Yes

Embedded Block RAM - EBR:

3456 kbit

In System Programmability:

No

.JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Length:

27.0 mm

Lead Finish:

Tin/Silver/Copper

Mounting Type:

Surface Mount

Mounting Style:

SMD/SMT

Maximum Operating Frequency:

550 MHz

Number of I/O:

440

Number of Pins:

676

Number of CLBs:

6480.0

Number of Inputs:

440.0

Number of Outputs:

440.0

Number of Terminals:

676

Number of Logic Cells:

82944

Organization:

6480 CLBS

Operating Temperature-Min:

-40.0 °C

Operating Temperature-Max:

100.0 °C

Pin Count:

676

Product Type:

FPGA - Field Programmable Gate Array

Power Supplies:

1,2.5

Package / Case:

676-BBGA, FCBGA

Package Code:

BGA

Package Style:

GRID ARRAY

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA676,26X26,40

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Peak Reflow Temperature:

245.0 °C

RAM Bits:

3,538,944 Bit

REACH Compliant:

Yes

Speed Grade:

2

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Screening Level:

Industrial

Seated Height-Max:

3.0 mm

Supply Voltage-Nom:

1.0 V

Supply Voltage-Min:

0.95 V

Supply Voltage-Max:

1.05 V

Supplier Device Package:

676-FCBGA (27x27)

Tradename:

Virtex

Technology:

CMOS

Total RAM Bits:

3538944

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max:

30 s

Voltage - Supply:

0.95 V ~ 1.05 V

Width:

27.0 mm


Product Features

· Five platforms LX, LXT, SXT, TXT, and FXT

− Virtex-5 LX: High-performance general logic applications

− Virtex-5 LXT: High-performance logic with advanced serial connectivity

− Virtex-5 SXT: High-performance signal processing applications with advanced serial connectivity

− Virtex-5 TXT: High-performance systems with double density advanced serial connectivity

− Virtex-5 FXT: High-performance embedded systems with advanced serial connectivity

• Cross-platform compatibility

− LXT, SXT, and FXT devices are footprint compatible in the same package using adjustable voltage regulators

• Most advanced, high-performance, optimal-utilization, FPGA fabric

− Real 6-input look-up table (LUT) technology

− Dual 5-LUT option

− Improved reduced-hop routing

− 64-bit distributed RAM option

− SRL32/Dual SRL16 option

• Powerful clock management tile (CMT) clocking

− Digital Clock Manager (DCM) blocks for zero delay buffering, frequency synthesis, and clock phase shifting

− PLL blocks for input jitter filtering, zero delay buffering, frequency synthesis, and phase-matched clock division

• 36-Kbit block RAM/FIFOs

− True dual-port RAM blocks

− Enhanced optional programmable FIFO logic

− Programmable

   - True dual-port widths up to x36

   - Simple dual-port widths up to x72

− Built-in optional error-correction circuitry

− Optionally program each block as two independent 18-Kbit blocks

• High-performance parallel SelectIO technology

− 1.2 to 3.3V I/O Operation

− Source-synchronous interfacing using ChipSync™ technology

− Digitally-controlled impedance (DCI) active termination

− Flexible fine-grained I/O banking

− High-speed memory interface support

• Advanced DSP48E slices

− 25 x 18, two’s complement, multiplication

− Optional adder, subtracter, and accumulator

− Optional pipelining

− Optional bitwise logical functionality

− Dedicated cascade connections

• Flexible configuration options

− SPI and Parallel FLASH interface

− Multi-bitstream support with dedicated fallback reconfiguration logic

− Auto bus width detection capability

• System Monitoring capability on all devices

− On-chip/Off-chip thermal monitoring

− On-chip/Off-chip power supply monitoring

− JTAG access to all monitored quantities

• Integrated Endpoint blocks for PCI Express Designs

− LXT, SXT, TXT, and FXT Platforms

− Compliant with the PCI Express Base Specification 1.1

− x1, x4, or x8 lane support per block

− Works in conjunction with RocketIO™ transceivers

• Tri-mode 10/100/1000 Mb/s Ethernet MACs

− LXT, SXT, TXT, and FXT Platforms

− RocketIO transceivers can be used as PHY or connect to external PHY using many soft MII (Media Independent Interface) options

• RocketIO GTP transceivers 100 Mb/s to 3.75 Gb/s

− LXT and SXT Platforms

• RocketIO GTX transceivers 150 Mb/s to 6.5 Gb/s

− TXT and FXT Platforms

• PowerPC 440 Microprocessors

− FXT Platform only

− RISC architecture

− 7-stage pipeline

− 32-Kbyte instruction and data caches included

− Optimized processor interface structure (crossbar)

• 65-nm copper CMOS process technology

• 1.0V core voltage

• High signal-integrity flip-chip packaging available in standard or Pb-free package options


Product Functions

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

3A991.D

HTSN:

8542390001"8542.39.00.01

SCHEDULE B:

8542390000"8542.39.00.00


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

RoHS:

Compliant

USHTS:

8542390001

TARIC:

8542399000


Documents & Media

Datasheet

Virtex-5 Family Overview

Virtex-5 FPGA Datasheet

Virtex-5 FPGA User Guide

PCN Design/Specification

Substrate BallPad Metal Change 8/Feb/2016


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

262

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

DigiKey

0

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

Mouser

0

Xilinx

FPGA - Field Programmable Gate Array XC5VLX85-2FFG676I Connect FG


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

There is no relevant information available for this part yet.


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