Product Overview
Kynix Part#: | KY32-XC4VLX25-11SFG363I |
Manufacturer Part#: | XC4VLX25-11SFG363I |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC4VLX25-11SFG363I |
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Description: | IC FPGA 240 I/O 363FCBGA |
Datasheet: | XC4VLX25-11SFG363I Datasheet |
Package: | BGA363 |
Quantity: | 257 PCS |
XC4VLX25-11SFG363I Images are for reference only:
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Product Attributes
Manufacturer: | Xilinx Inc. |
Product Category: | IC Chips |
Status: | Active |
Series: | Virtex®-4 LX |
Clock Frequency-Max: | 1205.0 MHz |
Distributed RAM: | 168 kbit |
Device Logic Cells: | 24192 |
Device Logic Units: | 24192 |
EU RoHS Compliant: | Yes |
Embedded Block RAM - EBR: | 1296 kbit |
In System Programmability: | No |
.JESD-30 Code: | S-PBGA-B363 |
JESD-609 Code: | e1 |
Length: | 17.0 mm |
Lead Finish: | Tin/Silver/Copper |
Mounting Type: | Surface Mount |
Mounting Style: | SMD/SMT |
Maximum Operating Frequency: | 500 MHz |
Number of I/O: | 240 |
Number of Pins: | 363 |
Number of CLBs: | 2688.0 |
Number of Inputs: | 240.0 |
Number of Outputs: | 240.0 |
Number of Terminals: | 363 |
Number of Logic Cells: | 24192 |
Organization: | 2688 CLBS |
Operating Temperature-Min: | -40.0 °C |
Operating Temperature-Max: | 100.0 °C |
Pin Count: | 363 |
Package / Case: | 363-FBGA, FCBGA |
Package Code: | FBGA |
Package Style: | GRID ARRAY, FINE PITCH |
Package Shape: | SQUARE |
Package Body Material: | PLASTIC/EPOXY |
Package Equivalence Code: | BGA363,20X20,32 |
Programmable Logic Type: | FIELD PROGRAMMABLE GATE ARRAY |
Peak Reflow Temperature: | 260 °C |
RAM Bits: | 1,327,104 Bit |
REACH Compliant: | Yes |
Re-programmability Support: | No |
Speed Grade: | 11 |
Sub Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
Screening Level: | Industrial |
Seated Height-Max: | 1.99 mm |
Supply Voltage-Nom: | 1.2 V |
Supply Voltage-Min: | 1.14 V |
Supply Voltage-Max: | 1.26 V |
Supplier Device Package: | 363-FCBGA (17x17) |
Tradename: | Virtex |
Technology: | CMOS |
Terminal Form: | BALL |
Terminal Pitch: | 0.8 mm |
Terminal Finish: | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Terminal Position: | BOTTOM |
Time@Peak Reflow Temperature-Max: | 30 s |
Voltage - Supply: | 1.14 V ~ 1.26 V |
Width: | 17.0 mm |
Product Features
• Three Families — LX/SX/FX
- Virtex-4 LX: High-performance logic applications solution
- Virtex-4 SX: High-performance solution for digital signal processing (DSP) applications
- Virtex-4 FX: High-performance, full-featured solution for embedded platform applications
• Xesium™ Clock Technology
- Digital clock manager (DCM) blocks
- Additional phase-matched clock dividers (PMCD)
- Differential global clocks
• XtremeDSP™ Slice
- 18 x 18, two’s complement, signed Multiplier
- Optional pipeline stages
- Built-in Accumulator (48-bit) and Adder/Subtracter
• Smart RAM Memory Hierarchy
- Distributed RAM
- Dual-port 18-Kbit RAM blocks
· Optional pipeline stages
· Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals
- High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.
• SelectIO™ Technology
- 1.5V to 3.3V I/O operation
- Built-in ChipSync™ source-synchronous technology
- Digitally controlled impedance (DCI) active termination
- Fine grained I/O banking (configuration in one bank)
• Flexible Logic Resources
• Secure Chip AES Bitstream Encryption
• 90 nm Copper CMOS Process
• 1.2V Core Voltage
• Flip-Chip Packaging including Pb-Free Package Choices
• RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit Transceiver (MGT) [FX only]
• IBM PowerPC RISC Processor Core [FX only]
- PowerPC 405 (PPC405) Core
- Auxiliary Processor Unit Interface (User Coprocessor)
• Multiple Tri-Mode Ethernet MACs [FX only]
Product Functions
There is no relevant information available for this part yet.
Applications
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Advantages and Disadvantages
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ECCN / UNSPSC
ECCN: | 3A991.D |
HTSN: | 8542390001 |
SCHEDULE B: | 8542390000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Product Compliance
RoHS: | Compliant |
USHTS: | 8542390001 |
TARIC: | 8542399000 |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributors | Stock | Manufacturers | Descriptions |
Kynix | 257 | Xilinx Inc. | IC FPGA 240 I/O 363FCBGA |
DigiKey | 0 | Xilinx Inc. | IC FPGA 240 I/O 363FCBGA |
Mouser | 0 | Xilinx | FPGA - Field Programmable Gate Array |
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