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XC3S500E-4FGG320C Datasheets| XILINX| PDF| Price| In Stock

Author: Apogeeweb
Date: 24 Jun 2019
 1295
IC Chips

Product Overview

Kynix Part #:

KY32-XC3S500E-4FGG320C

Manufacturer Part#:

XC3S500E-4FGG320C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

Click Purchase button to buy original genuine

XC3S500E-4FGG320C

purchase

Description:

-

Datasheet:

XC3S500E-4FGG320C Datasheet

Package:

BGA

Quantity:

256 PCS


XC3S500E-4FGG320C Images are for reference only:

XC3S500E-4FGG320C


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Manufacturer:

XILINX

Product Category:

IC Chips

Part Status:

Active

Series:

Spartan®-3E

Clock Frequency-Max:

572.0 MHz

Combinatorial Delay of a CLB-Max:

0.76 ns

In System Programmability:

Yes

.JESD-30 Code:

S-PBGA-B320

JESD-609 Code:

e1

Length:

19.0 mm

Mounting Type:

Surface Mount

Number of I/O:

232

Number of CLBs:

1164.0

Number of Gates:

500000

Number of Inputs:

232.0

Number of Outputs:

176.0

Number of Terminals:

320

Number of Registers:

9312

Number of Logic Cells:

10476.0

Number of Equivalent Gates:

500000.0

Organization:

1164 CLBS, 500000 GATES

Operating Temperature-Min:

0.0 °C

Operating Temperature-Max:

85.0 °C

Pin Count:

320

Power Supplies:

1.2,1.2/3.3,2.5

Package / Case:

320-BGA

Package Code:

BGA

Package Style:

GRID ARRAY

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA320,18X18,40

Peak Reflow Temperature:

260 °C

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Re-programmability Support:

1

Sub Category:

Field Programmable Gate Arrays

Speed Grade:

4

Surface Mount:

Yes

Screening Level:

Commercial

Seated Height-Max:

2.0 mm

Supply Voltage-Nom:

1.2 V

Supply Voltage-Min:

1.14 V

Supply Voltage-Max:

1.26 V

Supplier Device Package:

320-FBGA (19x19)

Technology:

CMOS

Total RAM Bits:

368640

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Position:

BOTTOM

Temperature Grade:

OTHER

Time@Peak Reflow Temperature-Max:

30 s

Voltage - Supply:

1.14 V ~ 1.26 V

Width:

19.0 mm


Product Features

•Very low cost, high-performance logic solution for high-volume, consumer-oriented applications

• Proven advanced 90-nanometer process technology

• Multi-voltage, multi-standard SelectIO™ interface pins

• Up to 376 I/O pins or 156 differential signal pairs

• LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards

• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling

• 622+ Mb/s data transfer rate per I/O

• True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O

• Enhanced Double Data Rate (DDR) support

• DDR SDRAM support up to 333 Mb/s

• Abundant, flexible logic resources

• Densities up to 33,192 logic cells, including optional shift register or distributed • RAM support

• Efficient wide multiplexers, wide logic

• Fast look-ahead carry logic

• Enhanced 18 x 18 multipliers with optional pipeline

• IEEE 1149.1/1532 JTAG programming/debug port

• Hierarchical SelectRAM™ memory architecture

• Up to 648 Kbits of fast block RAM

• Up to 231 Kbits of efficient distributed RAM

• Up to eight Digital Clock Managers (DCMs)

• Clock skew elimination (delay locked loop)

• Frequency synthesis, multiplication, division

• High-resolution phase shifting

• Wide frequency range (5 MHz to over 300 MHz)

• Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing

• Configuration interface to industry-standard PROMs

• Low-cost, space-saving SPI serial Flash PROM

• x8 or x8/x16 parallel NOR Flash PROM

• Low-cost Xilinx® Platform Flash with JTAG

• Complete Xilinx ISE® and WebPACK™ software

• MicroBlaze™ and PicoBlazeä embedded processor cores

• Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices)

• Low-cost QFP and BGA packaging options

• Common footprints support easy density migration

• Pb-free packaging options


Product Functions

There is no relevant information available for this part yet.


Applications

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Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

3A991.D

HTSN:

8542390001

SCHEDULE B:

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

There is no relevant information available for this part yet.


Documents & Media

Datasheets

Spartan-3E FPGA Family

PCN Design/Specification

FG(G) and BG(G) Wire Bond 25/Jan/2013


Product Manufacturer

Xilinx, Inc.is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

256

XILINX

-

DigiKey

267

Xilinx Inc.

IC FPGA 232 I/O 320FBGA

Mouser

-

-

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC3S500E-4FGG320C Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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