Product Overview
Kynix Part #: | KY32-XC7K325T-2FFG900I |
Manufacturer Part#: | XC7K325T-2FFG900I |
Product Category: | Programmable Logic ICs |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC7K325T-2FFG900I | |
Description: | IC FPGA 500 I/O 900FCBGA |
Datasheet: | XC7K325T-2FFG900I Datasheet |
Package: | BGA |
Quantity: | 4562 PCS |
XC7K325T-2FFG900I Images are for reference only.
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Manufacturer | Xilinx Inc. |
Series | Kintex®-7 |
Base Part Number | XC7K325T |
Audio I/O | No |
Configuration Memory | 16MB QSPI; 128MB BPI FLASH |
Display Mode | HMDI Output |
Package Description | FBGA-900 |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
Ethernet | Yes |
GPIO | Yes |
Status | Active |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Clock Frequency-Max | 1,286.0 MHz |
Contact Plating | Copper , Tin , Silver |
Combinatorial Delay of a CLB-Max | 0.61 ns |
In System Programmability | No |
Interface Standards | FMC LPC; I2C; HPC; XADC; SMA; SFP+ |
JESD-30 Code | S-PBGA-B900 |
JESD-609 Code | e1 |
Lead Finish | Tin/Silver/Copper |
Memory Card Interface | SD Card |
Memory Size | 1GB |
Memory Type | DDR3 |
Moisture Sensitivity Level | 4 |
Maximum Number of User I/Os | 500.0 |
Number of CLBs | 25,475.0 |
Number of Inputs | 500.0 |
Number of Logic Cells | 326,080.0 |
Number of Logic Units | 326,080.0 |
Number of Outputs | 500.0 |
Number of Terminals | 900.0 |
Number of I/O | 500.0 |
Number of Logic Blocks (LABs) | 25,475.0 |
Number of Registers | 407,600 |
Operating Temperature | -40°C ~ 100°C (TJ) |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
PCIe | PCIe |
Package Type | FCBGA |
Package Equivalence Code | BGA, BGA900,30X30,40 |
Product Dimensions | 31 x 31 x 2.85 mm |
Package Shape | SQUARE |
Programmability | No |
Pbfree Code | Yes |
Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | 245 |
Power Supplies | 1,1.8,3.3 |
Pin Count | 900 |
PCB | 900 |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31 x 31) |
Qualification Status | Not Qualified |
RAM Bits | 16,404,480b |
Rohs Code | Yes |
Re-programmability Support | 1 |
Risk Rank | 2.17 |
Seated Height-Max | 3.35 mm |
Sub Category | Field Programmable Gate Arrays |
Supply Voltage-Nom | 1.0 V |
Supply Voltage-Min | 0.97V |
Supply Voltage-Max | 1.03 V |
Surface Mount | Yes |
Speed Grade | -2 |
Screening Level | Industrial |
Technology | CMOS |
Temperature Grade | OTHER |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal Form | Ball |
Terminal Pitch | 1.0 mm |
Terminal Position | Bottom |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Typical Operating Supply Voltage | 1.0000 V |
USB | USB-Serial Bridge |
Length | 31.0 mm |
Width | 31.0 mm |
Features
lAdvanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
l36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
lHigh-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
lHigh-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
lA user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
lDSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
lPowerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
lIntegrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
lWide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
lLow-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
lDesigned for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
Advantages and Disadvantages
Advantages
Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
Applications
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Product Functions
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ECCN / UNSPSC
Description | Value |
ECCN | 3A991.D |
HTSN | PARTS... |
SCHEDULE B | PARTS... |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 4562 PCS | Xilinx, Inc. | IC FPGA 500 I/O 900FCBGA |
Digi-Key | 8 in Stock | Xilinx, Inc. | IC FPGA 500 I/O 900FCBGA |
Avnet | Europe - 0 | Xilinx, Inc. | FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 900-Pin FC-BGA (Alt: XC7K325T-2FFG900I) |
Alternative Models
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